公开(公告)号：US09035196B2

公开(公告)日：2015-05-19

申请号：US13827002

申请日：2013-03-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook Park ,  Jae Kul Lee ,  Jin Gu Kim ,  Chang Bae Lee

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/115 ,  H05K3/107 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4661 ,  H05K2201/0959

Abstract: Disclosed herein is a circuit board including: a core layer including a via hole; a metal film covering an inner wall of the via hole; a circuit pattern connected to the metal film on the core layer; and a plug surrounded by the metal film in the via hole and having a thickness thinner than a thickness of the core layer.

Abstract translation: 这里公开了一种电路板，包括：芯层，包括通孔; 覆盖所述通孔的内壁的金属膜; 连接到芯层上的金属膜的电路图案; 以及由所述通孔中的所述金属膜包围并且具有比所述芯层的厚度薄的厚度的塞子。

公开(公告)号：US20140345916A1

公开(公告)日：2014-11-27

申请号：US14169097

申请日：2014-01-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook Park ,  Young Do Kweon ,  Jin Gu Kim

IPC: H05K1/11

CPC classification number: H05K3/426 ,  H05K1/036 ,  H05K3/108 ,  H05K3/285 ,  H05K2201/0959 ,  H05K2203/1476

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 根据本发明的优选实施例的印刷电路板包括基底; 形成为穿透基底基板的贯通孔; 以及形成在基底基板的一侧和另一侧上并形成为比通孔的内壁更薄的电路图案。

公开(公告)号：US20140166347A1

公开(公告)日：2014-06-19

申请号：US13831720

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yoon Su Kim ,  Sung Han ,  Jin Gu Kim ,  Young Do Kweon

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K3/383 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2203/0307 ,  H05K2203/0773 ,  H05K2203/1131

Abstract: Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof.

Abstract translation: 本文公开了一种印刷电路板，包括：基底; 以及形成在基底基板上的电路图案，其中包括导电填料，并且在其表面上形成粗糙度。

公开(公告)号：US20140077896A1

公开(公告)日：2014-03-20

申请号：US14027835

申请日：2013-09-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Dong Hwan LEE ,  Seung Wook Park ,  Christian Romero ,  Young Do Kweon ,  Jin Gu Kim

IPC: H03H7/01

CPC classification number: H03H7/17 ,  H05K1/0251 ,  H05K1/116 ,  H05K2201/09381

Abstract: The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.

Abstract translation: 本发明涉及具有开口短截线的通孔结构和具有该开口短路的印刷电路板。 根据本发明的实施例，具有开口短截线的通孔结构包括：通过绝缘层的信号传输; 用于连接分别形成在绝缘层上和下面的第一和第二传输线的上和下通孔焊盘和信号传输通孔; 并且提供连接到每个通孔焊盘的外周的至少一个开放短截线以具有形成在绝缘层上和下面的每个接地图案的分流电容。 此外，提供了具有开口短路的通孔的印刷电路板。