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公开(公告)号：US10720900B2
公开(公告)日：2020-07-21
申请号：US15391353
申请日：2016-12-27
发明人： Tae Hun Lee , Won Han , Moon Chul Lee , Sung Han
摘要： An acoustic resonator including a substrate, an active vibration region including, sequentially stacked on the substrate, a lower electrode, a piezoelectric layer, and an upper electrode, and a horizontal resonance suppressing part formed from and disposed in the piezoelectric layer, the horizontal resonance suppressing part having piezoelectric physical properties that are different from piezoelectric physical properties of the piezoelectric layer.
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2.发明授权公开(公告)号：US09386706B2
公开(公告)日：2016-07-05
申请号：US14140803
申请日：2013-12-26
发明人： Sung Han , Young Do Kweon , Seung Min Baek , Yoon Su Kim , Young Jae Lee
IPC分类号： H05K3/10
CPC分类号： H05K3/108 , H05K2201/098 , H05K2203/087 , H05K2203/092 , H05K2203/095 , H05K2203/1105 , H05K2203/111 , H05K2203/1184 , H05K2203/1383 , Y10T29/49155
摘要： A printed circuit board includes an insulating layer; and a circuit pattern formed on the insulating layer. The circuit pattern includes a seed layer and a metal layer formed on the seed layer, and both sides of the seed layer are formed with an etched groove. Also, a method of manufacturing a printed circuit board includes: forming a seed layer on the insulating layer; forming a plating resist formed with an opening on the seed layer; forming a circuit pattern by performing plating processing on the opening; removing the plating resist; forming a passivation layer on the circuit pattern; performing dry etching on a remaining portion other than a side wall of the passivation layer; and performing wet etching the seed layer exposed on a surface by the dry etching.
摘要翻译： 印刷电路板包括绝缘层; 以及形成在绝缘层上的电路图案。 电路图案包括种子层和形成在种子层上的金属层，种子层的两侧形成有蚀刻槽。 另外，制造印刷电路板的方法包括：在绝缘层上形成晶种层; 在种子层上形成具有开口的电镀抗蚀剂; 通过在开口上进行电镀处理形成电路图案; 去除电镀抗蚀剂; 在电路图案上形成钝化层; 对钝化层的侧壁以外的剩余部分进行干蚀刻; 并且通过干蚀刻对表面上暴露的种子层进行湿法蚀刻。
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公开(公告)号：US09173291B2
公开(公告)日：2015-10-27
申请号：US14060345
申请日：2013-10-22
发明人： Sung Han , Young Do Kweon , Jin Gu Kim , Hyung Jin Jeon , Yoon Su Kim
CPC分类号： H05K1/116 , H05K1/113 , H05K3/0017 , H05K3/002 , H05K3/421 , H05K2201/0195 , H05K2201/09563 , H05K2201/09854 , H05K2203/0733
摘要： The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material.
摘要翻译： 本发明涉及一种电路板。 根据本发明实施例的电路板包括：基底; 覆盖基底的层间绝缘层; 通孔结构至少穿过基底衬底的层间绝缘层和层间绝缘层在垂直方向上; 以及在水平方向上设置在层间绝缘层上以围绕通孔结构并由绝缘材料制成的蚀刻停止图案。
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公开(公告)号：US20140166347A1
公开(公告)日：2014-06-19
申请号：US13831720
申请日：2013-03-15
发明人： Yoon Su Kim , Sung Han , Jin Gu Kim , Young Do Kweon
CPC分类号： H05K3/383 , H05K1/097 , H05K3/125 , H05K2201/0215 , H05K2201/0272 , H05K2203/0307 , H05K2203/0773 , H05K2203/1131
摘要： Disclosed herein is a printed circuit board, including: a base substrate; and a circuit pattern formed on the base substrate, including a conductive filler therein, and having roughness formed on a surface thereof.
摘要翻译： 本文公开了一种印刷电路板，包括：基底; 以及形成在基底基板上的电路图案，其中包括导电填料，并且在其表面上形成粗糙度。
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5.发明申请METHOD FOR REMOVING SEED LAYER IN MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD MANUFACTURED BY USING THE SAME 有权用于在制造印刷电路板中移除所述层的方法和使用其制造的印刷电路板公开(公告)号：US20140076619A1
公开(公告)日：2014-03-20
申请号：US13826857
申请日：2013-03-14
发明人： Sung Han , Yoon Su Kim , Kyoung Moo Harr , Kyung Seob Oh , Kyung Suk Shim , Du Sung Jung
CPC分类号： H05K3/06 , H05K1/02 , H05K3/027 , H05K3/108 , H05K2203/087 , H05K2203/107 , Y10T29/49156
摘要： Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.
摘要翻译： 本发明公开了一种在制造印刷电路板中去除种子层的方法，该方法包括：在印刷电路板上形成光刻胶层，该印刷电路板上形成有种子层; 根据预定图案去除光致抗蚀剂层; 在除去光致抗蚀剂层的预定图案上形成用于电路的镀层; 通过除去镀层周围的光致抗蚀剂层来曝光晶种层; 通过在填充有预定气体的反应器中进行种子层暴露的基板的化学反应，在种子层和镀层的表面上形成腐蚀层; 以及通过在腐蚀层上照射激光以除去腐蚀层来去除种子层。
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6.发明授权公开(公告)号：US08957319B2
公开(公告)日：2015-02-17
申请号：US13826857
申请日：2013-03-14
发明人： Sung Han , Yoon Su Kim , Kyoung Moo Harr , Kyung Seob Oh , Kyung Suk Shim , Du Sung Jung
CPC分类号： H05K3/06 , H05K1/02 , H05K3/027 , H05K3/108 , H05K2203/087 , H05K2203/107 , Y10T29/49156
摘要： Disclosed herein is a method for removing a seed layer in manufacturing a printed circuit board, the method including: forming a photo resist layer on a printed circuit board having a seed layer formed on a surface thereof; removing the photo resist layer according to a predetermined pattern; forming a plating layer for a circuit on the predetermined pattern from which the photo resist layer is removed; exposing the seed layer by removing the photo resist layer around the plating layer; forming a corrosion layer on surfaces of the seed layer and the plating layer by performing a chemical reaction of the substrate from which the seed layer is exposed in a reactor in which a predetermined gas is filled; and removing the seed layer by irradiating a laser on the corrosion layer to remove the corrosion layer.
摘要翻译： 本发明公开了一种在制造印刷电路板中去除种子层的方法，该方法包括：在印刷电路板上形成光刻胶层，该印刷电路板上形成有种子层; 根据预定图案去除光致抗蚀剂层; 在除去光致抗蚀剂层的预定图案上形成用于电路的镀层; 通过除去镀层周围的光致抗蚀剂层来曝光晶种层; 通过在填充有预定气体的反应器中进行种子层暴露的基板的化学反应，在种子层和镀层的表面上形成腐蚀层; 以及通过在腐蚀层上照射激光以除去腐蚀层来去除种子层。
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7.发明申请PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND METHOD OF MANUFACTURING THE SAME 审中-公开具有粗糙度的铜层的印刷电路板及其制造方法公开(公告)号：US20140186651A1
公开(公告)日：2014-07-03
申请号：US14140392
申请日：2013-12-24
发明人： Sung Han , Yoon Su Kim , Doo Sung Jung , Eun Jung Lim , Kyoung Moo Harr , Kyung Suk Shim , Kyung Seob Oh
CPC分类号： H05K3/385 , H05K2203/095 , H05K2203/122 , Y10T428/12472 , Y10T428/12646
摘要： Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same.
摘要翻译： 本发明公开了一种印刷电路板，其具有通过在形成作为电路布线的镀铜层时使用电镀抑制剂的具有各向异性结晶取向结构的铜镀层，具有锚定形状的表面和粗糙度的铜镀层， 使用复合气体等离子体和稀酸溶液及其制造方法。
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公开(公告)号：US11558034B2
公开(公告)日：2023-01-17
申请号：US17106415
申请日：2020-11-30
发明人： Sung Han , Yoon Sok Park , Tae Kyung Lee , Hwa Sun Lee
摘要： An acoustic resonator filter is provided. The acoustic resonator filter includes a rear filter electrically connected between a front port and a rear port, through which a radio frequency (RF) signal passes, the rear filter including at least one film bulk acoustic resonator (FBAR); and a front filter electrically connected between the front port and the rear filter and including at least one solidly mounted resonator (SMR).
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公开(公告)号：US10855249B2
公开(公告)日：2020-12-01
申请号：US16522093
申请日：2019-07-25
发明人： Tae Kyung Lee , Jae Sang Lee , Ran Hee Shin , In Young Kang , Sung Sun Kim , Sung Han
摘要： A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a weight ratio of molybdenum to tungsten in a range of 3:1 to 1:3.
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公开(公告)号：US10756700B2
公开(公告)日：2020-08-25
申请号：US15638809
申请日：2017-06-30
发明人： Sung Han , Jae Chang Lee , Won Han , Tae Yoon Kim , Jong Woon Kim , Tae Kyung Lee , Moon Chul Lee , Tae Hun Lee , Sung Min Cho , In Young Kang
摘要： A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.
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