公开(公告)号：US20200304167A1

公开(公告)日：2020-09-24

申请号：US16508650

申请日：2019-07-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Wook KWON ,  Yun Tae LEE ,  Seong Jong CHEON ,  Sung Jae YOON ,  Jin O YOO

IPC: H04B1/50 ,  H04B1/00

Abstract: A front end module includes: a first filter and a second filter, the first filter and the second filter being configured to respectively support cellular communications in different frequency bands among a first frequency band and a second frequency band of a sub-6 GHz band; a third filter configured to support Wi-Fi communications in a third frequency band of a 5 GHz band, and having one end connected to an antenna terminal; and a switch configured to selectively connect one end of the first filter and one end of the second filter to the antenna terminal.

公开(公告)号：US20190326223A1

公开(公告)日：2019-10-24

申请号：US16171114

申请日：2018-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae LEE ,  Eun Jung JO ,  Han KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  H01L25/065

Abstract: A fan-out semiconductor package includes a core member having a first through-hole and including wiring layers; a first semiconductor chip disposed in the first through-hole and having first connection pads formed on a lower side of the first semiconductor chip; a first encapsulant covering the core member and the first semiconductor chip; a connection member disposed below the core member and the first semiconductor chip and including redistribution layers; a first stack chip disposed on the first encapsulant and electrically connected to the wiring layers through a first connection conductor; and a second encapsulant disposed on the first encapsulant and covering the first stack chip. The first semiconductor chip includes DRAM and/or a controller, the first stack chip includes a stack type NAND flash, and the first connection pads of the first semiconductor chip are electrically connected to the wiring layers through the redistribution layers.

公开(公告)号：US20170287856A1

公开(公告)日：2017-10-05

申请号：US15448039

申请日：2017-03-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yun Tae LEE ,  Moon Il KIM

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/48

CPC classification number: H01L24/02 ,  H01L23/16 ,  H01L23/29 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/17 ,  H01L24/20 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/0237 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/171 ,  H01L2224/2919 ,  H01L2224/3213 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1094 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3025 ,  H01L2924/0665

Abstract: An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.