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公开(公告)号：US20210297609A1
公开(公告)日：2021-09-23
申请号：US17076041
申请日：2020-10-21
发明人： Tae Hoon KIM , Joon Seok CHAE , Yun Tae LEE , Tae Kon KOO , Jae Chan LEE , Yong Woon PARK
摘要： A camera for a vehicle includes: an imaging unit configured to image an exterior of the vehicle; and a controller configured to enlarge a region of interest of the imaging unit in response to a driving speed of the vehicle being higher than a reference speed, and reduce the region of interest of the imaging unit in response to the driving speed being lower than the reference speed.
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公开(公告)号：US20200381180A1
公开(公告)日：2020-12-03
申请号：US16561457
申请日：2019-09-05
发明人： Yun Tae LEE , Kyung Moon JUNG , Han KIM
摘要： A multilayer ceramic electronic component and a mounting board thereof include a reinforcing member that is disposed on upper and lower surfaces of a ceramic body of the multilayer ceramic electronic component and that is bonded to the first and the second external electrodes. The reinforcing member provides reduced occurrence of cracking and reduced stress applied to the component. The reinforcing member may have a coefficient of thermal expansion (CTE) that is within a range of 1 to 4 times a coefficient of thermal expansion of a dielectric layer of the ceramic body, and/or may have a modulus that is 0.5 or more times a modulus of the dielectric layer.
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公开(公告)号：US20180095341A1
公开(公告)日：2018-04-05
申请号：US15698290
申请日：2017-09-07
发明人： Hong Joo LEE , Dong Yeon SHIN , Nam Ki PARK , Shin Young CHEONG , Byung Gi AHN , Hoon HEO , Je Hyun BANG , Yun Tae LEE , Ick Chan SHIM , Young Bok YOON
IPC分类号： G03B3/10
CPC分类号： G03B3/10 , G02B7/08 , G02B7/36 , G02B13/001 , G02B27/646 , G03B2205/0069 , H04N5/2257 , H04N5/23212 , H04N5/23287
摘要： An actuator includes a magnet, a driving coil facing the magnet, a driver, and a position calculation processor. The driver is configured to move the magnet in at least one of an optical axis direction and a direction perpendicular to the optical axis by applying a driving signal to the driving coil. The position calculation processor includes sensing coils, and is configured to calculate a position of the magnet according to inductance levels of an inductor of the sensing coils. The inductance levels vary according to movements of the magnet.
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公开(公告)号：US20190043847A1
公开(公告)日：2019-02-07
申请号：US15973927
申请日：2018-05-08
发明人： Yun Tae LEE , Han KIM , Hyung Joon KIM
IPC分类号： H01L25/18 , H01L23/538 , H01L23/427 , H01L23/552 , H01L23/498
摘要： A connection system of semiconductor packages includes: a printed circuit board; a first semiconductor package disposed on a first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; a second semiconductor package disposed on a second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures; and a third semiconductor package disposed on the first semiconductor package and connected to the first semiconductor package through third electrical connection structures. The first semiconductor package includes an application processor (AP), the second semiconductor package includes a memory, and the third semiconductor package includes a power management integrated circuit (PMIC).
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公开(公告)号：US20180047683A1
公开(公告)日：2018-02-15
申请号：US15679860
申请日：2017-08-17
发明人： Yun Tae LEE , Sung Han KIM , Han KIM
IPC分类号： H01L23/00 , H01L23/31 , H01L23/498
CPC分类号： H01L24/02 , H01L23/3107 , H01L23/49822 , H01L23/49827 , H01L23/562 , H01L24/09 , H01L24/19 , H01L24/20 , H01L2224/02331 , H01L2224/02371 , H01L2224/02373 , H01L2224/02379 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/1035 , H01L2924/01029 , H01L2924/181 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H01L2924/3025 , H01L2924/351 , H01L2924/3511
摘要： A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from the semiconductor chip; a second connection member disposed on the first connection member, the dummy chip, and the active surface of the semiconductor chip; and an encapsulant encapsulating at least portions of the first connection member, the dummy chip, and the inactive surface of the semiconductor chip. The first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads.
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公开(公告)号：US20170287796A1
公开(公告)日：2017-10-05
申请号：US15442927
申请日：2017-02-27
发明人： Yun Tae LEE , Moon Il KIM
CPC分类号： H01L23/055 , H01L23/3157 , H01L23/481 , H01L24/20 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/1094 , H01L2924/15311 , H01L2924/3025 , H05K5/0021 , H05K5/0217 , H05K5/0247 , H05K5/065 , H05K7/023
摘要： An electronic component package includes: a lower package, including a frame including a through-hole and a through-wiring, a first electronic component disposed in the through-hole of the frame, a redistribution layer disposed below the first electronic component and the frame and electrically connected to the first electronic component, and an encapsulant filling the through-hole to encapsulate the first electronic component; an upper package disposed on the lower package and including a second electronic component; and a passive element disposed between the upper package and the lower package.
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7.发明申请公开(公告)号：US20200243450A1
公开(公告)日：2020-07-30
申请号：US16535421
申请日：2019-08-08
发明人： Jung Hyun CHO , Young Kwan LEE , Young Sik HUR , Yun Tae LEE , Ho Kwon YOON
IPC分类号： H01L23/538 , H01L23/00 , H01L23/31 , H01L23/498 , H05K1/18
摘要： A bridge embedded interposer and a package substrate and a semiconductor package including the same includes: a connection structure including one or more redistribution layers, a first bridge disposed on the connection structure and including one or more first circuit layers electrically connected to the one or more redistribution layers, a frame disposed around the first bridge on the connection structure and including one or more wiring layers electrically connected to the one or more redistribution layers, and an encapsulant disposed on the connection structure and covering at least a portion of each of the first bridge and the frame.
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公开(公告)号：US20190043835A1
公开(公告)日：2019-02-07
申请号：US15966673
申请日：2018-04-30
发明人： Yun Tae LEE , Han KIM , Hyung Joon KIM
IPC分类号： H01L25/065 , H01L25/00 , H01L23/538 , H01L23/00
CPC分类号： H01L25/0657 , H01L23/5384 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/95 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/24137 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2225/107 , H01L2924/15311 , H01L2924/18162 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A connection system of semiconductor packages includes: a printed circuit board having a first surface, and a second surface, opposing the first surface; a first semiconductor package disposed on the first surface of the printed circuit board and connected to the printed circuit board through first electrical connection structures; and a second semiconductor package disposed on the second surface of the printed circuit board and connected to the printed circuit board through second electrical connection structures. The first semiconductor package includes an application processor (AP) and a power management integrated circuit (PMIC) disposed side by side, and the second semiconductor package includes a memory.
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公开(公告)号：US20180366426A1
公开(公告)日：2018-12-20
申请号：US16111713
申请日：2018-08-24
发明人： Yun Tae LEE , Moon Il KIM
IPC分类号： H01L23/00 , H01L23/29 , H01L23/31 , H01L23/367 , H01L23/48 , H01L23/498 , H01L23/16 , H01L23/538
摘要： An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.
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公开(公告)号：US20180033746A1
公开(公告)日：2018-02-01
申请号：US15707266
申请日：2017-09-18
发明人： Yun Tae LEE , Moon Il KIM
CPC分类号： H01L24/02 , H01L23/16 , H01L23/29 , H01L23/3128 , H01L23/367 , H01L23/481 , H01L23/49811 , H01L23/5389 , H01L24/17 , H01L24/20 , H01L24/32 , H01L24/33 , H01L2224/0237 , H01L2224/04105 , H01L2224/12105 , H01L2224/171 , H01L2224/2919 , H01L2224/3213 , H01L2224/32245 , H01L2224/73267 , H01L2225/1035 , H01L2225/1041 , H01L2225/1094 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2924/0665
摘要： An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic component opposing the first side and electrically connected to the electronic component.
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