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公开(公告)号：US20180305498A1
公开(公告)日：2018-10-25
申请号：US15962104
申请日：2018-04-25
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Jungha CHAE , Chanjae AHN , Kyeong-Sik JU
CPC classification number: C08G73/14 , C08J5/18 , C08J2379/08
Abstract: A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4: wherein, in Chemical Formulae 1 to 4, L1, L2, Ra to Rd, R2, R3, R10, R12, R13, n7 and n8, and X are the same as defined in the specification.
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公开(公告)号：US20170218200A1
公开(公告)日：2017-08-03
申请号：US15419019
申请日：2017-01-30
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
Inventor： Chanjae AHN , Sungwon CHOI , Byunghee SOHN , A Ra JO , Kyeong-sik JU , Sang Soo JEE , Hongkyoon CHOI
Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) a solution including at least one of (i) a polymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a metallic salt soluble in the solution of the polymer and/or the copolymer, wherein the metallic salt is a salt of a metal selected from a Group 1 element, a Group 11 element, a Group 13 element, and a Group 14 element: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.
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13.发明申请公开(公告)号：US20250043046A1
公开(公告)日：2025-02-06
申请号：US18405175
申请日：2024-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minsang KIM , Haengdeog KOH , Yoonhyun KWAK , Jeongho MUN , Seonghyeon AHN , Chanjae AHN , Jaejun LEE , Kyuhyun IM , Jungha CHAE , Sungwon CHOI
IPC: C08F120/28 , G03F7/004 , G03F7/20
Abstract: Provided are a polymer including a first repeating unit represented by Formula 1 and having a glass transition temperature of 50° C. or less, a polymer-containing composition including the polymer, and a method of forming a pattern by using the polymer-containing composition: wherein, in Formula 1, descriptions of L11 to L13, a11 to a13, An, R11, R12, b12, and p1 are provided in the present specification.
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14.发明申请公开(公告)号：US20250021003A1
公开(公告)日：2025-01-16
申请号：US18537601
申请日：2023-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Cheol KANG , Haengdeog KOH , Yoonhyun KWAK , Minsang KIM , Beomseok KIM , Hana KIM , Hoyoon PARK , Chanjae AHN , Jaejun LEE , Sungwon CHOI
Abstract: Provided are a polymer including a first repeating unit represented by Formula 1 below, a resist composition including the same, a method of forming a pattern by using the same, and a monomer represented by Formula 10 below. In Formulae 1 and 10, L11 to L13, a11 to a13, X11, Rf, and R11 to R13 are as described in the specification.
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15.发明申请公开(公告)号：US20210221953A1
公开(公告)日：2021-07-22
申请号：US17205637
申请日：2021-03-18
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： A Ra JO , Chanjae AHN , Sungwon CHOI , Sun Jin SONG , Boreum JEONG , Won Suk CHANG
IPC: C08G73/10 , C08J5/18 , C09D179/08 , C08G73/14
Abstract: A film comprising a polyimide or poly(imide-amide) copolymer, wherein the film has an amplitude of a surface roughness curve of less than or equal to 270 nanometers.
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Patent Agency Ranking
公开(公告)号：US20210016552A1
公开(公告)日：2021-01-21
申请号：US16929382
申请日：2020-07-15
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Chanjae AHN , Sun Jin SONG , Won Suk CHANG , Boreum JEONG , A Ra JO , Kyeong-sik JU , Sungwon CHOI
Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate: in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.
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17.发明申请公开(公告)号：US20170190880A1
公开(公告)日：2017-07-06
申请号：US15397180
申请日：2017-01-03
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
Inventor： A Ra JO , Chanjae AHN , Byunghee SOHN , Kyeong-sik JU
CPC classification number: C08K5/56 , C08G69/32 , C08G73/1003 , C08G73/1039 , C08G73/1042 , C08G73/14 , C08K5/0091 , C08K5/357 , C09B69/10 , C09B69/101 , C09B69/103 , C08L79/08
Abstract: A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) at least one of (i) a polyimide, a polyamic acid, or a poly(imide-amic acid) including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a poly(imide-amide) copolymer, a poly(amic acid-amide) copolymer, or a poly(imide and amic acid-amide) copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a compound having a maximum absorption wavelength at about 570 nm or more in a visible radiation region: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.
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公开(公告)号：US20170130004A1
公开(公告)日：2017-05-11
申请号：US15346876
申请日：2016-11-09
Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
Inventor： Hongkyoon CHOI , Chanjae AHN , Hyunjeong JEON , Sang Soo JEE , Sungwon CHOI , Sung Woo HONG , Byunghee SOHN
IPC: C08G73/14 , C09J179/08 , C09D179/08
CPC classification number: C08G73/14 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C09D179/08 , C09J179/08
Abstract: A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thererof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
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19.发明申请COMPOSITION FOR PREPARING ARTICLE CONTAINING POLY(IMIDE-AMIDE), METHOD OF PREPARING THE SAME, AND ARTICLE CONTAINING POLY(IMIDE-AMIDE) 审中-公开用于制备含聚（酰胺）的制品的组合物，其制备方法和含有聚（酰胺）的制品公开(公告)号：US20160222249A1
公开(公告)日：2016-08-04
申请号：US14744621
申请日：2015-06-19
Applicant: SAMSUNG ELECTRONICS CO., LTD. , SAMSUNG SDI CO., LTD.
Inventor： Sungwon CHOI , Chanjae AHN , Sungwoo HONG , Byunghee SOHN , Hyunjeong JEON , Kyeong-sik JU
IPC: C09D179/08
CPC classification number: C09D179/08 , C08G73/1028 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08G73/14
Abstract: A composition for preparing an article including a poly(imide-amide) copolymer, the composition including (i) a copolymer obtained by reacting a tetracarboxylic acid dianhydride represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, and a carboxylic acid dichloride to form a reaction product, followed by removing hydrochloric acid from the reaction product, (ii) an acid anhydride, and (iii) a solvent: Wherein group R1 in Chemical Formula 1 and group R2 in Chemical Formula 2 are the same as described in the specification.
Abstract translation: 用于制备包含聚（酰亚胺 - 酰胺）共聚物的制品的组合物，所述组合物包含（i）通过化学式1表示的四羧酸二酐和由化学式2表示的二胺与二羧酸二羧酸反应得到的共聚物 形成反应产物，然后从反应产物中除去盐酸，（ii）酸酐，和（iii）溶剂：化学式2中化学式1和基团R2中的基团R1与上述相同 规格。
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公开(公告)号：US20250123564A1
公开(公告)日：2025-04-17
申请号：US18770083
申请日：2024-07-11
Inventor： Chanjae AHN , Myungwoong KIM , Yoonhyun KWAK , Yunhee KO , Seungjun KIM
IPC: G03F7/039 , C08F212/14 , G03F7/00 , G03F7/038
Abstract: Provided are a resist composition and a method of forming a pattern by using the same, the resist composition including a polymer including a first repeating unit represented by Formula 1, a photoacid generator, and an organic solvent: Formula 1 is as defined in the specification.
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