公开(公告)号：US10763399B2

公开(公告)日：2020-09-01

申请号：US15684144

申请日：2017-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Gun Lee ,  Yong Il Kim ,  Young Soo Park ,  Jin Sub Lee ,  Wan Tae Lim

IPC: H01L33/12 ,  H01L33/46 ,  H01L27/15 ,  H01L33/50 ,  H01L25/075 ,  H01L33/44

Abstract: A light emitting device package includes a light emitting structure including a first light emitting cell, a second light emitting cell, and a third light emitting cell, each of the first to third light emitting cells including an active layer to emit light of a first wavelength in a first direction and being separated from each other in a second direction, orthogonal to the first direction, a first light adjusting portion including a first wavelength conversion layer in a first recess portion of the first light emitting cell, the first wavelength conversion layer to convert light of the first wavelength to light of a second wavelength, and a second light adjusting portion including a second wavelength conversion layer in a second recess portion of the second light emitting cell, the second wavelength conversion layer to convert light of the first wavelength to light of a third wavelength.

公开(公告)号：US10566318B2

公开(公告)日：2020-02-18

申请号：US16008276

申请日：2018-06-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Gun Lee ,  Yong Il Kim ,  Hye Seok Noh ,  Han Kyu Seong ,  Sung Hyun Sim ,  Ha Nul Yoo

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L27/12 ,  H01L33/60 ,  H01L33/06 ,  H01L33/32 ,  H01L33/30 ,  H01L33/40

Abstract: A light emitting device package includes a first wavelength conversion portion and a second wavelength conversion portion to provide a wavelength of incident light to provide light having a converted wavelength, a light-transmissive partition structure extending along side surfaces of the first and second wavelength conversion portions along a thickness direction to separate the first and second wavelength conversion portions part from each other along a direction crossing the thickness direction, and a cell array including a first light emitting device, a second light emitting device and a third light emitting device, overlapping the first wavelength conversion portion, the second wavelength conversion portion and the light-transmissive partition structure, respectively, along the thickness direction.

公开(公告)号：US10438994B2

公开(公告)日：2019-10-08

申请号：US15992316

申请日：2018-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Hye Yeon ,  Sung Hyun Sim ,  Ha Nul Yoo ,  Dong Gun Lee

IPC: H01L33/50 ,  H01L27/15 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L33/46 ,  H01L33/22 ,  H01L33/00 ,  H01L25/16 ,  H01L33/64

Abstract: A method of fabricating a light emitting device package including forming a cell array that includes semiconductor light-emitters including first and second conductivity-type semiconductor layers and an active layer on a substrate, and a separation region, the cell array having a first surface contacting the substrate; exposing the first surface of the separation region by removing the substrate; forming a seed layer on the first surface in the separation region; forming a photoresist pattern on the light-emitters such that the photoresist pattern exposes the seed layer; forming a partition structure that separates the light-emitters by plating a region exposed by the photoresist pattern; forming light emitting windows of the partition structure by removing the photoresist pattern such that the light-emitters are exposed at lower ends of the light emitting windows; and forming wavelength converters by filling the light emitting windows with a wavelength conversion material.