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公开(公告)号：US12042828B2
公开(公告)日：2024-07-23
申请号：US18299279
申请日：2023-04-12
发明人： Seung Min Shin , Hun Jae Jang , Seok Hoon Kim , Young-Hoo Kim , In Gi Kim , Tae-Hong Kim , Kun Tack Lee , Ji Hoon Cha , Yong Jun Choi
IPC分类号： B08B7/00 , B08B3/10 , H01L21/311 , H01L21/67 , H01L21/687
CPC分类号： B08B7/0042 , B08B3/10 , B08B7/0064 , H01L21/31111 , H01L21/67051 , H01L21/67075 , H01L21/67098 , H01L21/67248 , H01L21/68764
摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
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12.发明授权公开(公告)号：US11862457B2
公开(公告)日：2024-01-02
申请号：US18098330
申请日：2023-01-18
发明人： SeongKeun Cho , Young Hoo Kim , Seung Min Shin , Tae Min Earmme , Kun Tack Lee , Hun Jae Jang , Eun Hee Jeang
IPC分类号： H01L21/02 , B08B3/08 , H01L21/428 , H01L21/687
CPC分类号： H01L21/02057 , B08B3/08 , H01L21/428 , H01L21/68764
摘要： A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
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公开(公告)号：US20230249230A1
公开(公告)日：2023-08-10
申请号：US18299279
申请日：2023-04-12
发明人： Seung Min SHIN , Hun Jae Jang , Seok Hoon Kim , Young-Hoo Kim , In Gi Kim , Tae-Hong Kim , Kun Tack Lee , Ji Hoon Cha , Yong Jun Choi
IPC分类号： B08B7/00 , B08B3/10 , H01L21/67 , H01L21/687 , H01L21/311
CPC分类号： B08B7/0042 , B08B3/10 , B08B7/0064 , H01L21/67051 , H01L21/67075 , H01L21/67248 , H01L21/68764 , H01L21/31111 , H01L21/67098
摘要： A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.
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公开(公告)号：US10435234B2
公开(公告)日：2019-10-08
申请号：US15814842
申请日：2017-11-16
发明人： Yong Jhin Cho , In Kwang Bae , Jung Min Oh , Mi Hyun Park , Kun Tack Lee , Yong Jun Choi
IPC分类号： B05B5/025 , B05C11/10 , B65D85/00 , B65D90/46 , G01R29/24 , C09D5/24 , C08L27/20 , H01L21/67 , C08F14/26 , C08K3/04 , C08F14/22
摘要： A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.
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15.发明申请公开(公告)号：US20180334318A1
公开(公告)日：2018-11-22
申请号：US15814842
申请日：2017-11-16
发明人： Yong Jhin Cho , In Kwang Bae , Jung Min Oh , Mi Hyun Park , Kun Tack Lee , Yong Jun Jun
IPC分类号： B65D85/00 , B65D90/46 , G01R29/24 , C09D5/24 , C08L27/20 , C08F14/22 , C08F14/26 , C08K3/04 , H01L21/67
CPC分类号： B65D85/70 , B05B5/025 , B05C11/10 , B65D90/46 , C08F14/22 , C08F14/26 , C08G2261/1424 , C08G2261/312 , C08G2261/3221 , C08G2261/3223 , C08G2261/3422 , C08G2261/51 , C08K3/041 , C08K3/042 , C08L27/20 , C08L65/00 , C09D5/24 , G01R29/24 , H01L21/67051 , H01L21/6708 , H01L21/67253
摘要： A chemical liquid supply apparatus includes a storage container configured to accommodate a chemical liquid for processing a semiconductor substrate, a chemical liquid supply pipe, a supply nozzle, and a grounding conductor. A conductive layer including a non-metallic conductive material is formed on an inner surface of the chemical liquid supply pipe. The supply nozzle includes a non-metallic conductive material. The conductive layer or the supply nozzle is electrically connected to the grounding conductor which is grounded to an outside of the pipe.
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