公开(公告)号：US08921990B2

公开(公告)日：2014-12-30

申请号：US14088482

申请日：2013-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyol Park ,  Yun-Hyeok Im

IPC: H05K1/02

CPC classification number: H01L23/3675 ,  H01L21/561 ,  H01L23/367 ,  H01L23/3677 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/8385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K3/30 ,  H05K2201/0215 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.

Abstract translation: 半导体封装包括具有内部电路图案和连接到内部电路图案的多个接触焊盘的电路板，电路板上的至少一个集成电路（IC）装置并与接触焊盘接触，模具在 电路板，将IC器件固定到电路板上的模具，以及IC器件表面和模具表面上的表面轮廓改性剂，以及将IC器件和模具的表面积扩大的表面轮廓修改器 散热

公开(公告)号：US20130259092A1

公开(公告)日：2013-10-03

申请号：US13776973

申请日：2013-02-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-hyeok IM ,  Kyol Park ,  Tae-je Cho

IPC: G01K7/34 ,  G01K7/16

CPC classification number: G01K7/34 ,  G01K7/16 ,  G01K7/42

Abstract: A method of predicting a temperature includes operatively coupling a temperature prediction circuit to a device including a semiconductor chip, determining a correlation between a current and voltage of the temperature prediction circuit, and predicting a temperature with respect to power applied to the device using the determined correlation.

Abstract translation: 预测温度的方法包括将温度预测电路可操作地耦合到包括半导体芯片的装置，确定温度预测电路的电流和电压之间的相关性，以及使用所确定的温度预测相对于施加到装置的功率的温度 相关性。