公开(公告)号：US09171825B2

公开(公告)日：2015-10-27

申请号：US14488707

申请日：2014-09-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-Sick Park ,  In-Young Lee ,  Byoung-Soo Kwak ,  Min-Soo Kim ,  Sang-Wook Park ,  Tae-Je Cho

IPC: H01L23/48 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/94 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00

Abstract: A semiconductor device and a method of fabricating the same includes providing a first semiconductor chip which has first connection terminals, providing a second semiconductor chip which comprises top and bottom surfaces facing each other and has second connection terminals and a film-type first underfill material formed on the bottom surface thereof, bonding the first semiconductor chip to a mounting substrate by using the first connection terminals, bonding the first semiconductor chip and the second semiconductor chip by using the first underfill material, and forming a second underfill material which fills a space between the mounting substrate and the first semiconductor chip and covers side surfaces of the first semiconductor chip and at least part of side surfaces of the second semiconductor chip.

Abstract translation: 一种半导体器件及其制造方法包括提供具有第一连接端子的第一半导体芯片，提供第二半导体芯片，该第二半导体芯片包括彼此相对的顶表面和底表面，并且具有第二连接端子和形成的膜型第一底部填充材料 在其底面上，通过使用第一连接端子将第一半导体芯片接合到安装基板，通过使用第一底部填充材料接合第一半导体芯片和第二半导体芯片，以及形成填充第二底部填充材料之间的空间的第二底部填充材料 安装基板和第一半导体芯片，并且覆盖第一半导体芯片的侧表面和第二半导体芯片的至少一部分侧表面。

公开(公告)号：US20150017835A1

公开(公告)日：2015-01-15

申请号：US14309313

申请日：2014-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Bae Sim ,  Kang-II Kim ,  Min-Soo Kim

IPC: H01R13/66

Abstract: An electronic device includes a power receiver that manages power transmitted from an outside; and a receptacle including a plurality of first basic connection terminals based on a first Universal Serial Bus (USB) interface and a plurality of first expansion connection terminals based on a second USB interface, wherein the first expansion connection terminals includes one or more first power supply terminals that transmit power received through a cable device connected with the receptacle to the power receiver.

Abstract translation: 电子设备包括管理从外部发送的电力的电力接收器; 以及基于第一通用串行总线（USB）接口的多个第一基本连接端子和基于第二USB接口的多个第一扩展连接端子的插座，其中所述第一扩展连接端子包括一个或多个第一电源 将通过与插座连接的电缆装置接收的功率发送到电力接收器的端子。

公开(公告)号：US10600145B2

公开(公告)日：2020-03-24

申请号：US14488621

申请日：2014-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Chul Yoon ,  Min-Soo Kim ,  Jae-Sop Kong

IPC: G09G5/00 ,  G06T3/40 ,  G06T3/60 ,  G06T3/00 ,  G06T1/60 ,  G06T1/20 ,  H04N5/262

Abstract: An image processor comprises first scaling logic that receives image data comprising a first number of lines and generates first scaled image data by scaling down the image data in a first direction, a rotation buffer that has storage capacity for storing a second number of lines less than the first number of lines and stores the first scaled image data in a rotated state, and second scaling logic that generates second scaled image data by scaling down the first scaled image data in a second direction different from the first direction.

公开(公告)号：US10534405B2

公开(公告)日：2020-01-14

申请号：US15948799

申请日：2018-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Soo Kim ,  Kyujin Kwak ,  Soo-Gyu Lee ,  Sung-Won Park ,  Joon Won Chang ,  Jin-Wan An ,  Janghoon Lee

IPC: H05K7/14 ,  H05K5/03 ,  H05K1/18 ,  G06F1/16 ,  H05K1/02 ,  G06F1/20 ,  H04M1/02 ,  H01Q1/24 ,  H05K1/14 ,  H02J7/00 ,  H05K1/05

Abstract: An electronic device is provided. The electronic device includes a housing comprising a first plate, a second plate apart from the first plate while facing the first plate, and a side member which surrounds a space between the first plate and the second plate, a touchscreen display exposed through the first plate, a printed circuit board (PCB) disposed between the touchscreen display and the second plate, a mid-plate disposed between the touchscreen display and the PCB, and extending from the side member, and at least one integrated circuit (IC) mounted on the PCB and relating to power, wherein the mid-plate can include at least one conductive path formed on a surface facing the PCB and electrically connected to the at least one IC, and the at least one conductive path can be formed with the same metallic material as the mid-plate.

公开(公告)号：US20190012544A1

公开(公告)日：2019-01-10

申请号：US16013475

申请日：2018-06-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo PARK ,  Min-Soo Kim ,  Jae-Il Seo ,  Soonwoong Yang ,  Kyujin Kwak ,  Kijae Kim ,  Jin-Wan An

IPC: G06K9/00 ,  H04M1/02 ,  H04N5/225 ,  H04N5/369

CPC classification number: G06K9/00604 ,  G06K9/209 ,  H04M1/0264 ,  H04M1/0266 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/369

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate and a rear plate; a touch screen display operably coupled to the front plate; at least one through-hole operably disposed on the front plate; and an imaging sensor assembly facing the front plate at an acute angle with respect to the front plate. The imaging sensor assembly includes a barrel at least partially disposed in the through-hole; a plurality of lenses disposed inside the barrel; a sensor housing surrounding at least part of an outer surface of the barrel; an image sensor assembly comprising an image sensor disposed inside the sensor housing; and a processor electrically coupled to the image sensor and configured to detect an iris image.