公开(公告)号：US12112970B2

公开(公告)日：2024-10-08

申请号：US17460424

申请日：2021-08-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daeho Min ,  Junhyung Kim ,  Minsoo Han ,  Mngu Lee ,  Minwoo Rhee

IPC: H01L21/683 ,  B25J15/06 ,  B65G47/91

CPC classification number: H01L21/6838 ,  B25J15/0683 ,  B65G47/91 ,  B65G2249/045

Abstract: A substrate transfer apparatus includes a body portion having a holding region on a surface thereof corresponding to a substrate. The body portion moves so that the surface thereof approaches the substrate up to at least a first distance. A plurality of vacuum holes are distributed in the holding region and form negative pressure to provide suction force to the substrate disposed at the first distance. At least some of the plurality of vacuum holes are disposed at equal intervals at an edge of the holding region and have the same width. A plurality of air holes are distributed in the holding region and form positive pressure to provide a buoyancy force to the substrate close to the holding region at a second distance smaller than the first distance.

公开(公告)号：US20240139972A1

公开(公告)日：2024-05-02

申请号：US18206635

申请日：2023-06-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daeho Min ,  Minwoo Rhee ,  Juno Kim ,  Kazuya ONO ,  Kangsan Lee ,  Kyeongbin Lim

IPC: B25J15/06 ,  B25J11/00

CPC classification number: B25J15/0658 ,  B25J11/0095

Abstract: A non-contact type gripper may include a gripping plate, a plurality of blowing holes, a plurality of suction holes and a cavity. The blowing holes may be formed at the gripping plate to inject a gas to an object. The suction holes may be formed at the gripping plate to suck the gas. The cavity may be extended from at least one of the blowing holes to suppress a pressure drop of the gas. The gas flowing through the cavities extended from the corner suction hole and the blowing holes between the adjacent suction holes may receive a low flow resistance. Thus, a pressure drop of the gas injected from the blowing holes may be suppressed by the cavities to maintain a pressure of the gas, thereby preventing a deflection of the corner portion of the object such as the semiconductor chip by a strong suction force. As a result, the non-contact type gripper may grip the object in the non-contact manner to prevent a contamination of the object.

公开(公告)号：US20230178280A1

公开(公告)日：2023-06-08

申请号：US18075814

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sumin KIM ,  Minwoo Rhee ,  Yongchul Shin ,  Ilyoung Han ,  Nungpyo Hong ,  Seungdon Lee ,  Kyeongbin Lim

IPC: H01F13/00 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01F13/00 ,  H01L25/50 ,  H01L23/564

Abstract: A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force between the first magnetic patterns and the second magnetic patterns. Each of the first magnetic patterns and the second magnetic patterns comprises a horizontally magnetically anisotropic material. The first magnetic patterns and the second magnetic patterns do not vertically overlap each other when the first die and the second die are vertically aligned with each other.

公开(公告)号：US20210104405A1

公开(公告)日：2021-04-08

申请号：US16842083

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Kyeongbin Lim ,  Minsoo Han ,  Minwoo Rhee ,  Inbae Chang

IPC: H01L21/18 ,  B32B37/00 ,  B23K20/10 ,  H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.