ULTRASONIC DIAGNOSIS APPARATUSES FOR GENERATING HARMONIC IMAGES AND METHODS OF GENERATING ULTRASONIC IMAGES INCLUDING HARMONIC IMAGES
    14.
    发明申请
    ULTRASONIC DIAGNOSIS APPARATUSES FOR GENERATING HARMONIC IMAGES AND METHODS OF GENERATING ULTRASONIC IMAGES INCLUDING HARMONIC IMAGES 审中-公开
    用于生成谐波图像的超声诊断装置和产生包括谐波图像的超声图像的方法

    公开(公告)号:US20160051229A1

    公开(公告)日:2016-02-25

    申请号:US14595518

    申请日:2015-01-13

    Abstract: An ultrasonic diagnosis apparatus may comprise: a probe comprising a transducer configured to transmit a signal to an object and configured to receive an echo signal from the object; a controller configured to control the probe; and/or an image generation unit configured to generate an image of the object based on the echo signal. The controller may be further configured to drive the transducer such that the signal transmitted simultaneously comprises a fundamental frequency and at least one harmonic. A method of generating an ultrasonic image may comprise: transmitting a signal to an object by using a transducer; receiving an echo signal from the object by using the transducer; and/or generating an image of the object based on the echo signal. The transmitting of the signal to the object may comprise driving the transducer such that the signal transmitted simultaneously comprises a fundamental frequency and at least one harmonic.

    Abstract translation: 超声波诊断装置可以包括:探针,其包括被配置为将信号发送到对象并被配置为从对象接收回波信号的换能器; 控制器,被配置为控制所述探针; 和/或图像生成单元,被配置为基于回波信号生成对象的图像。 控制器还可以被配置为驱动换能器,使得同时传输的信号包括基频和至少一个谐波。 产生超声波图像的方法可以包括:通过使用换能器将信号发送到对象; 通过使用换能器从物体接收回波信号; 和/或基于回波信号生成对象的图像。 将信号发送到对象可以包括驱动换能器,使得同时传输的信号包括基频和至少一个谐波。

    SEMICONDUCTOR DEVICE
    15.
    发明申请

    公开(公告)号:US20250157883A1

    公开(公告)日:2025-05-15

    申请号:US18647903

    申请日:2024-04-26

    Abstract: A semiconductor device includes a semiconductor chip having a semiconductor integrated circuit. A cooling channel is formed in the semiconductor chip. At least a portion of the cooling channel is formed in the semiconductor chip. First wick structures may be arranged on a bottom of the cooling channel that is parallel to an upper surface of the semiconductor chip in a transverse direction. The first wick structures may move a liquid coolant by capillary action in the transverse direction along the bottom of the cooling channel. Second wick structures may be arranged along an inner surface of the vapor chamber and may move the liquid coolant by capillary action in the transverse direction along the inner surface of the vapor chamber.

    DIRECTIONAL ACOUSTIC SENSOR
    17.
    发明公开

    公开(公告)号:US20230152411A1

    公开(公告)日:2023-05-18

    申请号:US17731742

    申请日:2022-04-28

    CPC classification number: G01S3/801 G01S3/803 H03H9/132

    Abstract: A directional acoustic sensor includes: a support including a first support portion and a second support portion that are separated from each other and face each other; a plurality of first resonators extending in a length direction thereof from the first support portion of the support; and a plurality of second resonators extending in the length direction thereof from the second support portion of the support and facing the plurality of first resonators, wherein each first resonator of the plurality of first resonators has a first end, wherein each second resonator of the plurality of second resonators has a second end, and wherein, in a first resonator arrangement of a region where the plurality of first resonators and the plurality of second resonators face each other, the first ends of the plurality of first resonators and the second ends of the plurality of second resonators form an intersecting structure.

    HIGH-EFFICIENCY CAPACITOR STRUCTURE

    公开(公告)号:US20220173210A1

    公开(公告)日:2022-06-02

    申请号:US17671040

    申请日:2022-02-14

    Abstract: A capacitor structure includes at least one first layer and at least one second layer that are alternately stacked. The at least one first layer includes first electrodes and second electrodes alternately arranged in a first direction, and the at least one second layer includes third electrodes and fourth electrodes alternately arranged in a second direction intersecting the first direction, the third electrodes and the fourth electrodes being electrically connected to the first electrodes and the second electrodes. Each of the first electrodes and the second electrodes includes a base portion and branch portions protruding from the base portion, and the third electrodes and the fourth electrodes are arranged side by side to correspond to the branch portions.

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