公开(公告)号：US07846752B2

公开(公告)日：2010-12-07

申请号：US12259696

申请日：2008-10-28

申请人： Chang Wook Kim ,  Seon Goo Lee

发明人： Chang Wook Kim ,  Seon Goo Lee

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

公开(公告)号：USD552046S1

公开(公告)日：2007-10-02

申请号：US29232938

申请日：2005-06-24

申请人： Chang Wook Kim ,  Hong Min Kim

设计人： Chang Wook Kim ,  Hong Min Kim

公开(公告)号：USD495667S1

公开(公告)日：2004-09-07

申请号：US29195596

申请日：2003-12-15

申请人： Chang Wook Kim ,  Seoung Ju Moon

设计人： Chang Wook Kim ,  Seoung Ju Moon

公开(公告)号：US20130241665A1

公开(公告)日：2013-09-19

申请号：US13989281

申请日：2011-11-07

申请人： Chang Wook Kim

发明人： Chang Wook Kim

IPC分类号： H03H7/38 ,  H01G7/00

CPC分类号： H03H7/38 ,  H01G7/00 ,  H03H2007/008

摘要： Disclosed is an impedance matching device. Variable devices of the impedance matching device installed in a mobile terminal, such as a portable terminal, are configured to have a MEMS structure. The MEMS structure and other components are integrated as one package, so the manufacturing cost is reduced and the manufacturing efficiency is improved.

摘要翻译： 公开了一种阻抗匹配装置。 安装在诸如便携式终端的移动终端中的阻抗匹配装置的可变装置被配置为具有MEMS结构。 MEMS结构等组件集成为一体，降低制造成本，提高制造效率。

公开(公告)号：USRE43200E1

公开(公告)日：2012-02-21

申请号：US12029220

申请日：2008-02-11

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L23/48

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在其凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并具有用于传送的传热部分 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US07678592B2

公开(公告)日：2010-03-16

申请号：US11680847

申请日：2007-03-01

申请人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

发明人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

摘要： In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

摘要翻译： 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。

公开(公告)号：US07251905B2

公开(公告)日：2007-08-07

申请号：US11013407

申请日：2004-12-17

申请人： Young Jin Doh ,  Chang Wook Kim

发明人： Young Jin Doh ,  Chang Wook Kim

IPC分类号： F26B25/06

CPC分类号： D06F58/24

摘要： Disclosed is a drawer structure for storing condensed water generated during the drying procedure. The drawer prevents the condensed water form being leaked out of the dryer though the condensed water is fully filled in the drawer and overflowed from the drawer. Thus, a user may not throw away the condensed water whenever the laundry is dried.

摘要翻译： 公开了一种用于存储在干燥过程中产生的冷凝水的抽屉结构。 抽屉防止冷凝水形式从干燥器中泄漏出来，尽管冷凝水完全填充在抽屉中并从抽屉中溢出。 因此，每当衣物干燥时，用户不得丢弃冷凝水。

公开(公告)号：US07242035B2

公开(公告)日：2007-07-10

申请号：US11319100

申请日：2005-12-28

申请人： Chang Wook Kim ,  Young Jae Song

发明人： Chang Wook Kim ,  Young Jae Song

IPC分类号： H01L29/22 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a side view LED package in use with an LCD backlight unit. The side view LED package comprises: an LED chip; and a strip-shaped lead frame having a toothed structure formed in a lateral edge thereof. The LED chip is mounted on a surface of the lead frame. An integral package body is made of resin, and includes a hollow front half having a cavity for housing the LED chip and a solid rear half divided from the front half by the lead frame. The toothed structure of the lead frame structure can improve resin flow in order to ensure stability even if the LED package is made extremely thin.

摘要翻译： 本发明涉及一种与LCD背光单元一起使用的侧视LED封装。 侧视LED封装包括：LED芯片; 以及具有形成在其侧边缘中的齿形结构的条形引线框架。 LED芯片安装在引线框架的表面上。 整体包装体由树脂制成，并且包括具有用于容纳LED芯片的空腔的中空前半部分和由前框架由引线框架分隔的实心后半部分。 引线框架结构的齿形结构可以改善树脂流动，以确保即使LED封装非常薄的稳定性。

公开(公告)号：US07217004B2

公开(公告)日：2007-05-15

申请号：US10890201

申请日：2004-07-14

申请人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

发明人： Jung Kyu Park ,  Chang Wook Kim ,  Young Sam Park

IPC分类号： F21V1/00

CPC分类号： G02F1/133603 ,  F21K9/00 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： A Light Emitting Diode (LED) array module, which can be used as backlight, includes a bar-shaped Printed Circuit Board (PCB) on which conductive patterns for transmitting power are formed, a base formed on the PCB and made of a heat conductive material, a plurality of LED chips mounted on the base in a line and electrically connected to the conductive patterns of the PCB, a reflector formed to surround the plurality of the LED chips and adapted to reflect light radiated from the plurality of LED chips upward, and a lens formed above the plurality of LED chips and reflector to have a bar shape and adapted to diffuse the light radiated from the plurality of LED chips and reflector in a horizontal direction.

摘要翻译： 可用作背光的发光二极管（LED）阵列模块包括形成有用于传输功率的导电图案的条形印刷电路板（PCB），形成在PCB上并由导热 材料，多个安装在基座上的LED芯片并电连接到PCB的导电图案;反射器，形成为围绕多个LED芯片并适于反射从多个LED芯片辐射的光向上， 以及透镜，形成在所述多个LED芯片和所述反射器之上，以具有条形并且适于在从水平方向扩散从所述多个LED芯片和反射器辐射的光。

公开(公告)号：USRE45596E1

公开(公告)日：2015-06-30

申请号：US13294405

申请日：2011-11-11

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

IPC分类号： H01L29/22 ,  H01L23/48 ,  H01L33/62 ,  H01L33/60

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。