公开(公告)号：USRE44811E1

公开(公告)日：2014-03-18

申请号：US13330239

申请日：2011-12-19

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US07846752B2

公开(公告)日：2010-12-07

申请号：US12259696

申请日：2008-10-28

申请人： Chang Wook Kim ,  Seon Goo Lee

发明人： Chang Wook Kim ,  Seon Goo Lee

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

公开(公告)号：USRE43200E1

公开(公告)日：2012-02-21

申请号：US12029220

申请日：2008-02-11

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L23/48

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在其凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并具有用于传送的传热部分 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US07678592B2

公开(公告)日：2010-03-16

申请号：US11680847

申请日：2007-03-01

申请人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

发明人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

摘要： In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

摘要翻译： 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。

公开(公告)号：USRE45596E1

公开(公告)日：2015-06-30

申请号：US13294405

申请日：2011-11-11

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg

IPC分类号： H01L29/22 ,  H01L23/48 ,  H01L33/62 ,  H01L33/60

CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：US07498610B2

公开(公告)日：2009-03-03

申请号：US11325322

申请日：2006-01-05

申请人： Chang Wook Kim ,  Seon Goo Lee

发明人： Chang Wook Kim ,  Seon Goo Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

摘要： An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

摘要翻译： LED壳体，其中导热部分具有芯片安装区域，与芯片安装区域相对的热连接区域和它们之间的颈部。 固定部件具有与颈部接合的第一端。 电连接部分具有与芯片安装区域相邻放置的导线连接区域和连接到电线连接区域的外部电源连接区域。 成型材料的壳体整体地保持导热部分，固定部分和电连接部分，同时将电连接部分与导热部分隔离。 LED壳体在两侧固定导热部件的颈部，从而将导热部件稳定地连接到壳体主体。 固定部件可以将热量从热传导部分扩散到LED壳体的横向区域，从而更有效地散热。

公开(公告)号：USD512694S1

公开(公告)日：2005-12-13

申请号：US29220220

申请日：2004-12-27

申请人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

设计人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

公开(公告)号：US07462871B2

公开(公告)日：2008-12-09

申请号：US11497232

申请日：2006-08-02

申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

IPC分类号： H01L27/15

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S257/918 ,  H01L2924/00014

摘要： In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

摘要翻译： 在侧视图LED中，细长的第一和第二引线框架各自具有从其延伸的指状物。 第一引线框架的指状物与第二引线框架的手指平行设置。 LED芯片和保护装置分别安装在第一和第二引线框架的安装区域上，并且电连接到第一引线框架和第二引线框架。 包装体容纳第一和第二引线框架以形成第一和第二开放区域。 第一开放区域围绕LED芯片外部打开，第二开放区域在保护装置周围被外部打开，并且间隔壁形成在其间。 第一和第二密封剂分别提供给第一和第二开放区域以分别封装LED芯片和保护装置。 至少第一密封剂是透明的。

公开(公告)号：US07208772B2

公开(公告)日：2007-04-24

申请号：US11186971

申请日：2005-07-22

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L29/22 ,  H01L23/48

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2224/0401

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：USD512029S1

公开(公告)日：2005-11-29

申请号：US29220264

申请日：2004-12-28

申请人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

设计人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han