公开(公告)号：US07682872B2

公开(公告)日：2010-03-23

申请号：US12037084

申请日：2008-02-25

申请人： SooMoon Park ,  Tae Keun Lee ,  YoRim Lee

发明人： SooMoon Park ,  Tae Keun Lee ,  YoRim Lee

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package system includes: providing a package carrier; forming a first channel in the package carrier; mounting a first integrated circuit device over the package carrier and adjacent to the first channel; mounting a second integrated circuit device over the package carrier and adjacent to the first channel; and forming a contiguous underfill fillet with the first channel and under both the first integrated circuit device and the second integrated circuit device.

摘要翻译： 集成电路封装系统包括：提供封装载体; 在包装载体中形成第一通道; 将第一集成电路器件安装在封装载体上并与第一通道相邻; 将第二集成电路装置安装在所述封装载体上并与所述第一通道相邻; 以及在所述第一通道和所述第一集成电路器件和所述第二集成电路器件之下形成连续的底部填充圆角。

公开(公告)号：US20080136005A1

公开(公告)日：2008-06-12

申请号：US11608826

申请日：2006-12-09

申请人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

发明人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/31 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/315 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/48479 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/48471 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/4554

摘要： A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

摘要翻译： 提供了一种堆叠集成电路封装包装系统，包括形成第一外部互连; 在第一外部互连下方安装第一集成电路管芯; 在第一集成电路管芯上以不在第一外部互连上的偏移配置堆叠第二集成电路管芯; 将所述第一集成电路管芯与所述第一外部互连件连接; 并且将所述第二集成电路管芯与所述第一外部互连件封装，并且所述第一集成电路管芯部分地露出。

公开(公告)号：US20070164422A1

公开(公告)日：2007-07-19

申请号：US11615923

申请日：2006-12-22

申请人： Hyung Jun Jeon ,  Tae Keun Lee ,  Young Chan Ko

发明人： Hyung Jun Jeon ,  Tae Keun Lee ,  Young Chan Ko

IPC分类号： H01L23/04

CPC分类号： H01L24/72 ,  H01L21/561 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor wafer scale package system is provided including providing a semiconductor substrate having a through-hole via with a conductive coating, forming a filled via by filling the through-hole via with a conductive material, coupling a package substrate to the filled via, and singulating a chip scale package from the semiconductor substrate and the package substrate.

摘要翻译： 提供了一种半导体晶片级封装系统，包括提供具有通孔通孔的半导体衬底和导电涂层，通过用导电材料填充通孔通孔来形成填充通孔，将封装衬底耦合到填充通孔，以及 从半导体衬底和封装衬底分离芯片级封装。

公开(公告)号：US20070108596A1

公开(公告)日：2007-05-17

申请号：US11279131

申请日：2006-04-10

申请人： Kyungsic Yu ,  Tae Keun Lee ,  Youngnam Choi

发明人： Kyungsic Yu ,  Tae Keun Lee ,  Youngnam Choi

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L21/568 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, the encapsulant in contact with the heat slug. The substrate, heat slug, and encapsulant are singulated to remove the support.

摘要翻译： 集成电路封装系统包括提供其上具有集成电路管芯的衬底。 在基板上提供支撑。 具有连接杆的热塞通过连接杆定位在支撑件上。 衬底和集成电路管芯封装有密封剂，密封剂与热渣接触。 将基底，热塞和密封剂分开以除去载体。

公开(公告)号：US20060103009A1

公开(公告)日：2006-05-18

申请号：US11163559

申请日：2005-10-22

申请人： Seongmin Lee ,  Tae Keun Lee

发明人： Seongmin Lee ,  Tae Keun Lee

IPC分类号： H01L23/34

CPC分类号： H01L21/561 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.

公开(公告)号：US08921861B2

公开(公告)日：2014-12-30

申请号：US13553790

申请日：2012-07-19

申请人： Ji Eun Chae ,  Tae Keun Lee

发明人： Ji Eun Chae ,  Tae Keun Lee

IPC分类号： H01L29/04 ,  H01L27/12

CPC分类号： H01L27/1259 ,  H01L27/1225 ,  H01L27/1244 ,  H01L29/66969

摘要： A flat panel display device with oxide thin film transistors and a fabricating method thereof are disclosed. The flat panel display device includes: a substrate; gate lines and data lines formed to cross each other and define a plurality of pixel regions on the substrate; the thin film transistors each including an oxide channel layer which is formed at an intersection of the gate and data lines; a pixel electrode and a common electrode formed in the pixel region with having a passivation layer therebetween; and step coverage compensation patterns formed at a step portion formed by the gate line and a gate electrode of the thin film transistor.

摘要翻译： 公开了一种具有氧化物薄膜晶体管的平板显示装置及其制造方法。 平板显示装置包括：基板; 栅极线和数据线形成为彼此交叉并在衬底上限定多个像素区域; 所述薄膜晶体管各自包括形成在所述栅极和数据线的交叉点处的氧化物沟道层; 形成在像素区域中的像素电极和公共电极，其间具有钝化层; 以及形成在由栅极线和薄膜晶体管的栅电极形成的台阶部分的阶梯覆盖补偿图案。

公开(公告)号：US08035237B2

公开(公告)日：2011-10-11

申请号：US12398163

申请日：2009-03-04

申请人： SeongMin Lee ,  Tae Keun Lee

发明人： SeongMin Lee ,  Tae Keun Lee

IPC分类号： H01L23/373

CPC分类号： H01L21/561 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.

摘要翻译： 提供了一种集成电路封装系统，包括提供具有附接并电连接到其上的管芯的衬底。 该系统包括在基底上形成热棒支柱，将热棒定位在热芯棒柱上，并将基底，模具，热棒棒和热棒塞在模具化合物中。 该系统包括基板，模具，热段和模具化合物的分离。

公开(公告)号：US07851268B2

公开(公告)日：2010-12-14

申请号：US11279131

申请日：2006-04-10

申请人： Kyungsic Yu ,  Tae Keun Lee ,  Youngnam Choi

发明人： Kyungsic Yu ,  Tae Keun Lee ,  Youngnam Choi

IPC分类号： H01L21/00

CPC分类号： H01L23/3121 ,  H01L21/568 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, the encapsulant in contact with the heat slug. The substrate, heat slug, and encapsulant are singulated to remove the support.

摘要翻译： 集成电路封装系统包括提供其上具有集成电路管芯的衬底。 在基板上提供支撑。 具有连接杆的热塞通过连接杆定位在支撑件上。 衬底和集成电路管芯封装有密封剂，密封剂与热渣接触。 将基底，热塞和密封剂分开以除去载体。

公开(公告)号：US20090174064A1

公开(公告)日：2009-07-09

申请号：US12398163

申请日：2009-03-04

申请人： Seongmin Lee ,  Tae Keun Lee

发明人： Seongmin Lee ,  Tae Keun Lee

IPC分类号： H01L23/34 ,  H01L23/36

CPC分类号： H01L21/561 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.

摘要翻译： 提供了一种集成电路封装系统，包括提供具有附接并电连接到其上的管芯的衬底。 该系统包括在基底上形成热棒支柱，将热棒定位在热棒支柱上，并将基底，模具，热芯棒柱和热芯块封装在模具化合物中。 该系统包括基板，模具，热段和模具化合物的分离。

公开(公告)号：US07517729B2

公开(公告)日：2009-04-14

申请号：US11163559

申请日：2005-10-22

申请人： Seongmin Lee ,  Tae Keun Lee

发明人： Seongmin Lee ,  Tae Keun Lee

IPC分类号： H01L21/50

CPC分类号： H01L21/561 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the substrate, positioning a heat slug on the heat slug pillars, and encapsulating the substrate, the die, the heat slug pillars, and the heat slug in a mold compound. The system includes singulating the substrate, the die, the heat slug, and the mold compound.

摘要翻译： 提供了一种集成电路封装系统，包括提供具有附接并电连接到其上的管芯的衬底。 该系统包括在基底上形成热棒支柱，将热棒定位在热棒支柱上，并将基底，模具，热芯棒柱和热芯块封装在模具化合物中。 该系统包括基板，模具，热段和模具化合物的分离。