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公开(公告)号：US20220260446A1
公开(公告)日：2022-08-18
申请号：US17597672
申请日：2020-07-22
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Anderson Pires Singulani , Coenraad Cornelis Tak , Casper Van Der Avoort
Abstract: In an embodiment a sensor arrangement includes a sensor die having a contact area, a suspended area and a sensitive element located in the suspended area, an interposer including at least two vias connecting a first side of the interposer to a second side of the interposer and a support mechanically and electrically connecting the contact area of the sensor die to the first side of the interposer, the support including at least two contact joints.
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公开(公告)号：US20220221363A1
公开(公告)日：2022-07-14
申请号：US17708407
申请日：2022-03-30
Applicant: Sciosense B.V.
Inventor： Jörg Siegert , Willem Frederik Adrianus Besling , Coenraad Cornelis Tak , Martin Schrems , Franz Schrank
Abstract: In an embodiment a method for forming a pressure sensor device includes providing a pressure sensor on a substrate body, the pressure sensor comprising a membrane, depositing a top layer on top of the substrate body and the pressure sensor, connecting a cap body with the top layer, a mass of the cap body being approximately equal to a mass of the substrate body and introducing at least one opening in the cap body.
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公开(公告)号：US11248976B2
公开(公告)日：2022-02-15
申请号：US16758680
申请日：2018-11-16
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Jörg Siegert , Alessandro Faes
Abstract: Capacitive pressure sensors and other devices are disclosed. In an embodiment a semiconductor device includes a first electrode, a cavity over the first electrode and a second electrode including a suspended membrane over the cavity and electrically conductive anchor trenches laterally surrounding the cavity, wherein the anchor trenches include an inner anchor trench and an outer anchor trench, the outer anchor trench having rounded corners.
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公开(公告)号：US20210163282A1
公开(公告)日：2021-06-03
申请号：US17043397
申请日：2019-04-25
Applicant: Sciosense B.V.
Inventor： Olaf Wunnicke , Frederik Willem Maurits Vanhelmont , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg , Casper Van Der Avoort , Anderson Pires Singulani , Martijn Goossens
Abstract: In an embodiment a system includes a sensor including a base having a base electrode and a first membrane suspended above the base, wherein the first membrane has a first membrane electrode, wherein the first membrane is configured to deflect with respect to the base electrode in response to an environmental condition, and wherein the sensor is configured to measure a capacitance between the base electrode and the first membrane electrode. The system further includes a first device of the system configured to generate electrical interference signals, a first electrically conductive shield layer positioned between the sensor and the first device of the system, wherein the first electrically conductive shield layer defines a plurality of first apertures extending through the first electrically conductive shield layer and a dielectric material disposed in the plurality of first apertures.
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公开(公告)号：US12180066B2
公开(公告)日：2024-12-31
申请号：US17228248
申请日：2021-04-12
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Coenraad Cornelis Tak , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Hendrik Bouman
Abstract: A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.
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Patent Agency Ranking
公开(公告)号：US11946822B2
公开(公告)日：2024-04-02
申请号：US17290140
申请日：2019-10-16
Applicant: Sciosense B.V.
Inventor： Alessandro Faes , Jörg Siegert , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg
CPC classification number: G01L9/0073 , B81B3/0021 , B81C1/00595 , G01L9/0042 , B81B2201/0264 , B81B2203/0127 , B81B2207/015 , B81C2201/0109 , B81C2201/0133 , B81C2201/014
Abstract: In an embodiment a semiconductor transducer device includes a semiconductor body and a diaphragm having a first layer and a second layer, wherein a main extension plane of the diaphragm is arranged parallel to a surface of the semiconductor body, wherein the diaphragm is suspended at a distance from the semiconductor body in a direction perpendicular to the main extension plane of the diaphragm, wherein the second layer comprises titanium and/or titanium nitride, wherein the first layer comprises a material that is resistant to an etchant comprising fluorine or a fluorine compound, and wherein the second layer is arranged between the semiconductor body and the first layer.
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17.发明授权公开(公告)号：US11878906B2
公开(公告)日：2024-01-23
申请号：US17937123
申请日：2022-09-30
Applicant: Sciosense B.V.
Inventor： Kailash Vijayakumar , Remco Henricus Wilhelmus Pijnenburg , Willem Frederik Adrianus Besling , Sophie Guillemin , Jörg Siegert
IPC: B81C1/00
CPC classification number: B81C1/00476 , B81C1/00595 , B81B2201/0257 , B81B2201/0264 , B81C2201/014 , B81C2201/0132 , B81C2201/053
Abstract: In an embodiment, an integrated MEMS transducer device includes a substrate body having a first electrode on a substrate, an etch stop layer located on a surface of the substrate, a suspended micro-electro-mechanical systems (MEMS) diaphragm with a second electrode, an anchor structure with anchors connecting the MEMS diaphragm to the substrate body and a sacrificial layer in between the anchors of the anchor structure, the sacrificial layer including a first sub-layer of a first material, wherein the first sub-layer is arranged on the etch stop layer, a second sub-layer of a second material, wherein the second sub-layer is arranged on the first sub-layer, and wherein the first and the second material are different materials.
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公开(公告)号：US11366031B2
公开(公告)日：2022-06-21
申请号：US16337554
申请日：2017-10-02
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Coenraad Cornelis Tak , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Martijn Goossens
Abstract: In an embodiment, a semiconductor device includes a substrate body, an environmental sensor, a cap body and a volume of gas, wherein the environmental sensor and the volume of gas are arranged between the substrate body and the cap body in a vertical direction which is perpendicular to a main plane of extension of the substrate body, wherein at least one channel between the substrate body and the cap body connects the volume of gas with an environment of the semiconductor device such that the channel is permeable for gases, and wherein a thickness of the substrate body amounts to at least 80% of a thickness of the cap body and at most 120% of the thickness of the cap body.
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公开(公告)号：US20210356342A1
公开(公告)日：2021-11-18
申请号：US17290140
申请日：2019-10-16
Applicant: Sciosense B.V.
Inventor： Alessandro Faes , Jörg Siegert , Willem Frederik Adrianus Besling , Remco Henricus Wilhelmus Pijnenburg
Abstract: In an embodiment a semiconductor transducer device includes a semiconductor body and a diaphragm having a first layer and a second layer, wherein a main extension plane of the diaphragm is arranged parallel to a surface of the semiconductor body, wherein the diaphragm is suspended at a distance from the semiconductor body in a direction perpendicular to the main extension plane of the diaphragm, wherein the second layer comprises titanium and/or titanium nitride, wherein the first layer comprises a material that is resistant to an etchant comprising fluorine or a fluorine compound, and wherein the second layer is arranged between the semiconductor body and the first layer.
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公开(公告)号：US20210229981A1
公开(公告)日：2021-07-29
申请号：US17228248
申请日：2021-04-12
Applicant: Sciosense B.V.
Inventor： Willem Frederik Adrianus Besling , Casper Van Der Avoort , Coenraad Cornelis Tak , Remco Henricus Wilhelmus Pijnenburg , Olaf Wunnicke , Hendrik Bouman
Abstract: A sensor package and a method for producing a sensor package are disclosed. In an embodiment a method for producing a sensor package includes providing a carrier including electric conductors, fastening a dummy die or interposer to the carrier, providing an ASIC device including an integrated sensor element and fastening the ASIC device to the dummy die or interposer.
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