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公开(公告)号：US20150277512A1
公开(公告)日：2015-10-01
申请号：US14640986
申请日：2015-03-06
Applicant: Seagate Technology LLC
Inventor： David Michael Davis , Alexander Carl Worrall , Alan John Westbury
IPC: G06F1/18
Abstract: The invention provides a storage system comprising a solid state storage carrier sized to correspond to a defined storage form factor and to include a support printed circuit board (PCB) having arranged thereon a plurality of solid state storage devices. The storage system can include a storage enclosure including a midplane and at least one slot on an end of the storage enclosure, sized to receive a solid state storage carrier for connection with the midplane in the storage enclosure. The storage system can also include at least one midplane connector located on the midplane, wherein the at least one midplane connector is configured to mate with at least one form factor connector on an end of the solid state storage carrier.
Abstract translation: 本发明提供了一种存储系统，其包括固定状态的存储载体，其尺寸对应于限定的存储形状因子，并且包括其上布置有多个固态存储装置的支撑印刷电路板（PCB）。 存储系统可以包括存储壳体，其包括中平面和存储壳体的端部上的至少一个槽，其尺寸被设计成接收用于与存储壳体中的中平面连接的固态存储载体。 存储系统还可以包括位于中平面上的至少一个中平面连接器，其中所述至少一个中平面连接器被配置为与固态存储载体的端部上的至少一个形状因数连接器配合。
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公开(公告)号：US20190095294A1
公开(公告)日：2019-03-28
申请号：US16189417
申请日：2018-11-13
Applicant: Seagate Technology LLC
Inventor： David Michael Davis , Kenneth Kevin Claffey , Christopher Bloxham
Abstract: There is disclosed a storage unit for high performance computing system, a storage network and a method of providing storage and of accessing storage. The storage unit includes an enclosure constructed and arranged to receive plural storage devices to provide high density, high capacity storage. The unit also includes a network connector and at least one integrated application controller constructed and arranged to run a scalable parallel file system for accessing data stored on the storage devices and providing server functionality to provide file access to a client via the network connector.
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公开(公告)号：US20180352647A1
公开(公告)日：2018-12-06
申请号：US16102356
申请日：2018-08-13
Applicant: Seagate Technology LLC
Inventor： David Michael Davis , Gary Edward Webb
CPC classification number: H05K1/029 , H01L23/50 , H05K1/0243 , H05K1/0245 , H05K1/181 , H05K3/3436 , H05K2201/10212 , H05K2201/10719 , H05K2201/10734
Abstract: A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.
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公开(公告)号：US10149411B2
公开(公告)日：2018-12-04
申请号：US15260595
申请日：2016-09-09
Applicant: Seagate Technology LLC
Inventor： David Michael Davis
IPC: H05K7/20
Abstract: A system includes an enclosure with a device space having a layer of active devices arranged into rows and adjacent cooling channels and an inlet partition having apertures aligned to the cooling channels defining a supply plenum. In a method of use, cooling fluid, such as air, is transferred from the supply plenum to the cooling channels to concurrently cool the layer of active devices and may provide substantially the same temperature and flow of cooling fluid to each row of active devices. Active devices may include storage devices. The supply plenum may include elongate ducts to encourage uniform cooling along a row. The supply plenum may also include a duct partition or more than one supply plenum to encourage uniform cooling among the rows. One or more fans may provide pressurized cooling fluid in the supply plenum space.
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公开(公告)号：US09883618B2
公开(公告)日：2018-01-30
申请号：US14868783
申请日：2015-09-29
Applicant: Seagate Technology LLC
Inventor： Richard Charles Alexander Pitwon , David Michael Davis
CPC classification number: H05K7/20836 , H05K7/20727
Abstract: The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, comprising a plurality of baffles or airflow redirection modules, and a controller configured to control an orientation of one or more of the plurality of baffles or airflow redirection modules for redirection of airflow distribution within the computing system enclosure based on a determined computing system enclosure profile. In another implementation, a method includes monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of one or more baffles or airflow redirection modules in the computing system based on results of the monitoring operation for redirection of airflow distribution.
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Patent Agency Ranking
公开(公告)号：US20160324032A1
公开(公告)日：2016-11-03
申请号：US14698618
申请日：2015-04-28
Applicant: Seagate Technology LLC
Inventor： David Michael Davis , Odie Killen
IPC: H05K7/20
CPC classification number: G11B33/142 , G11B33/128
Abstract: Apparatus and method for cooling a power supply unit in a storage system. In some embodiments, a storage system includes a first section for receiving a plurality of storage media, a second section having a power supply unit, and a plenum arranged in communication with the first and second sections. The power supply unit has an inlet for receiving air, an outlet for exhausting air and an airflow generator which generates airflow therethrough, where the inlet and the outlet are in fluidic communication with the plenum.
Abstract translation: 用于冷却存储系统中的电源单元的装置和方法。 在一些实施例中，存储系统包括用于接收多个存储介质的第一部分，具有电源单元的第二部分和布置成与第一和第二部分连通的集气室。 电源单元具有用于接收空气的入口，用于排出空气的出口和产生气流的气流发生器，其中入口和出口与气室流体连通。
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公开(公告)号：US20180294878A1
公开(公告)日：2018-10-11
申请号：US15481965
申请日：2017-04-07
Applicant: Seagate Technology LLC
Inventor： Richard C.A. Pitwon , David Michael Davis
IPC: H04B10/114 , H04B10/80 , G02B26/04 , G02B19/00
CPC classification number: H04B10/1143 , G02B19/0052 , G02B19/0061 , G02B19/0076 , G02B19/009 , G02B26/04 , H04B10/807
Abstract: A system includes a first optical communication interface and a second optical communication interface optically coupled via a free-space communication channel. The interfaces are spaced at variable distances. Each interface includes an optical source to provide a beam of electromagnetic energy and an optical receiver to receive the beam to bi-directionally communicate with the other interface via the channel. The first optical communication interface may be coupled to a sub-chassis. The second optical communication interface may be coupled to a device frame. The device frame may be movably coupled to the chassis. Communication may utilize multi-input, multi-output processing configured by a calibration matrix. A shutter may be positioned to receive the beam or be positioned clear of the beam depending on the distance between the interfaces.
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公开(公告)号：US20180084634A1
公开(公告)日：2018-03-22
申请号：US15271525
申请日：2016-09-21
Applicant: Seagate Technology LLC
Inventor： David Michael Davis , Gary Edward Webb
CPC classification number: H05K1/029 , H01L23/50 , H05K1/0243 , H05K1/0245 , H05K1/181 , H05K3/3436 , H05K2201/10212 , H05K2201/10719 , H05K2201/10734
Abstract: A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.
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公开(公告)号：US09535471B2
公开(公告)日：2017-01-03
申请号：US13773530
申请日：2013-02-21
Inventor： David Michael Davis , Alexander Carl Worrall
CPC classification number: G06F1/206 , H05K7/20727
Abstract: A data storage system and a method of cooling the data storage system are presented. The data storage system includes: an enclosure; one or more drawer structures disposed within the enclosure, wherein at least one of the drawer structures is configured to receive one or more electronic devices; and one or more temperature control elements positioned adjacent to the bottom of the at least one drawer structure, wherein at least one of the temperature control elements is arranged in use to thermally communicate with at least one of the electronic devices.
Abstract translation: 提出了一种数据存储系统和一种冷却数据存储系统的方法。 数据存储系统包括：外壳; 设置在所述外壳内的一个或多个抽屉结构，其中所述抽屉结构中的至少一个构造成容纳一个或多个电子设备; 以及与所述至少一个抽屉结构的底部相邻定位的一个或多个温度控制元件，其中至少一个所述温度控制元件在使用中被布置成与所述电子设备中的至少一个热连通。
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公开(公告)号：US10037782B1
公开(公告)日：2018-07-31
申请号：US15614899
申请日：2017-06-06
Applicant: Seagate Technology LLC
CPC classification number: G11B33/0466 , G06F1/185 , G06F1/187 , G06F12/0623 , G11B33/128
Abstract: An enclosure has a sidewall with a step that results in an upper part of the sidewall extending over a slide mounting region. A backplane is located at a base of the enclosure and is configured to receive a plurality of data storage drives. A circuit carrier extends from the backplane to the step in the side of the enclosure. The circuit carrier has one or more connectors proximate an upper surface of the step and is configured to receive one or more expansion modules that expand a functionality of the backplane.
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