公开(公告)号：US20060047134A1

公开(公告)日：2006-03-02

申请号：US10926425

申请日：2004-08-25

申请人： Frank Molock ,  Shivkumar Mahadevan ,  Robert Ward ,  Shanger Wang ,  James Parakka ,  Yuan Tian

发明人： Frank Molock ,  Shivkumar Mahadevan ,  Robert Ward ,  Shanger Wang ,  James Parakka ,  Yuan Tian

IPC分类号： C07F7/04

CPC分类号： C07F7/0879

摘要： The present invention relates to a process comprising the steps of reacting in the presence of a hydrosilylation catalyst, a first reaction mixture comprising a free radical reactive compound and a silicon containing compound to form a silicon substituted glyceryl (meth)acrylate.

摘要翻译： 本发明涉及包括以下步骤的方法：在氢化硅烷化催化剂存在下，包含自由基反应性化合物和含硅化合物的第一反应混合物反应，形成硅取代的（甲基）丙烯酸甘油酯。

公开(公告)号：US06610559B2

公开(公告)日：2003-08-26

申请号：US10014129

申请日：2001-11-16

申请人： Shanger Wang ,  Wushing Yin ,  Ning-Cheng Lee

发明人： Shanger Wang ,  Wushing Yin ,  Ning-Cheng Lee

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/11822 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3489 ,  H01L2924/00 ,  H01L2924/3512

摘要： An integrated void-free process has been developed for attaching a solder bumped chip to a substrate. The chip is first dipped in a tacky thermosettable flux, and the chip is mounted on the substrate. An underfill is dispensed along the edge of the chip The device is then sent into the reflow furnace to complete the underfilling (which optionally can be completed before reflow), solder reflowing and underfill curing. The flux also acts as a physical barrier minimizing, if not eliminating, the interference of filler on solder wetting and resulting metallurgical joints formed between the solder and the bond pads. The process allows for the integration of a void free conventional capillary flow underfilling process and a pre-deposited fluxing underfilling process by using a tacky thermosettable flux, avoiding the problems associated with each of the individual processes and requiring less time for the overall process.

摘要翻译： 已经开发了用于将焊料凸起的芯片附着到衬底的集成的无空隙工艺。 该芯片首先浸入粘性可热固化的焊剂中，芯片安装在基板上。 沿着芯片的边缘分配底部填料。然后将该装置送入回流炉以完成底部填充（其可选地可以在回流之前完成），焊料回流和底部填充固化。 焊剂还充当物理屏障，尽可能减少填料对焊料润湿和焊料与焊盘之间形成的冶金接头的干扰。 该方法允许通过使用粘性热固性助熔剂将无空隙的常规毛细管流动底部填充工艺和预沉积的助熔底部填充工艺整合，避免与每个单独工艺相关的问题并且需要更少的整个工艺的时间。

公开(公告)号：US07902299B2

公开(公告)日：2011-03-08

申请号：US11230709

申请日：2005-09-19

申请人： John Borland Kerr ,  Shanger Wang ,  Jun Hou ,  Steven Edward Sloop ,  Yong Bong Han ,  Gao Liu

发明人： John Borland Kerr ,  Shanger Wang ,  Jun Hou ,  Steven Edward Sloop ,  Yong Bong Han ,  Gao Liu

IPC分类号： C08F297/02

CPC分类号： H01B1/122 ,  C08G65/14 ,  C08G65/22 ,  C08G65/336 ,  C08G83/003 ,  C08J5/2218 ,  C08L71/02 ,  C08L2205/05 ,  H01M10/052 ,  H01M10/0565 ,  H01M2300/0082 ,  C08L83/00

摘要： Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.

摘要翻译： 公开了包含通过将盐化合物接枝到梳状聚合物或树枝状聚合物上制备的聚合物电解质的单离子导体，其具有优异的性质。

公开(公告)号：US20230293060A1

公开(公告)日：2023-09-21

申请号：US18185843

申请日：2023-03-17

申请人： Stacy Hunt Duvall ,  Renaud Bonzom ,  Jose Ferney Rivera ,  Ted Lee ,  Morgan Robinson ,  Sanaz Pilehvar ,  Pradeep Ramiah Rajasekaran ,  Wenjie Lan ,  Nicolas Robert Medjo ,  Avid Najdahmadi ,  Shayla Payne ,  Gregory Murphy ,  Peter C Simpson ,  Chris W Dring ,  Shanger Wang ,  Didier Sagan

发明人： Stacy Hunt Duvall ,  Renaud Bonzom ,  Jose Ferney Rivera ,  Ted Lee ,  Morgan Robinson ,  Sanaz Pilehvar ,  Pradeep Ramiah Rajasekaran ,  Wenjie Lan ,  Nicolas Robert Medjo ,  Avid Najdahmadi ,  Shayla Payne ,  Gregory Murphy ,  Peter C Simpson ,  Chris W Dring ,  Shanger Wang ,  Didier Sagan

IPC分类号： A61B5/145 ,  A61B5/1486

CPC分类号： A61B5/14532 ,  A61B5/1486 ,  A61B5/14546 ,  A61B2562/043

摘要： Various embodiments disclosed relate to analyte sensor configurations. The present disclosure can include planar analyte sensors or coaxial analyte sensors. The planar analyte sensors can include one or more insulating and conductive layers and a substrate layered on each other. The coaxial analyte sensors can include one or more co-extruded wire electrodes with a substrate. The continuous analyte monitoring systems discussed herein can be configured to monitor one or more analytes to provide predictive and real-time health data and benefits.

公开(公告)号：US07101643B2

公开(公告)日：2006-09-05

申请号：US10160604

申请日：2002-05-31

申请人： John Borland Kerr ,  Shanger Wang ,  Jun Hou ,  Steven Edward Sloop ,  Yong Bong Han ,  Gao Liu

发明人： John Borland Kerr ,  Shanger Wang ,  Jun Hou ,  Steven Edward Sloop ,  Yong Bong Han ,  Gao Liu

IPC分类号： H01M6/18 ,  C08G77/12 ,  C08L83/04

CPC分类号： H01B1/122 ,  C08G65/336 ,  C08L71/02 ,  H01M10/052 ,  H01M10/0565 ,  H01M2300/0082 ,  C08L83/00

摘要： New polymer electrolytes were prepared by in situ cross-linking of allyl functional polymers based on hydrosilation reaction using a multifunctional silane cross-linker and an organoplatinum catalyst. The new cross-linked electrolytes are insoluble in organic solvent and show much better mechanical strength. In addition, the processability of the polymer electrolyte is maintained since the casting is finished well before the gel formation.

公开(公告)号：US20060041075A1

公开(公告)日：2006-02-23

申请号：US11230709

申请日：2005-09-19

申请人： John Kerr ,  Shanger Wang ,  Jun Hou ,  Steven Sloop ,  Yong Han ,  Gao Liu

发明人： John Kerr ,  Shanger Wang ,  Jun Hou ,  Steven Sloop ,  Yong Han ,  Gao Liu

IPC分类号： C08F297/02

CPC分类号： H01B1/122 ,  C08G65/14 ,  C08G65/22 ,  C08G65/336 ,  C08G83/003 ,  C08J5/2218 ,  C08L71/02 ,  C08L2205/05 ,  H01M10/052 ,  H01M10/0565 ,  H01M2300/0082 ,  C08L83/00

摘要： Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.

公开(公告)号：US06956083B2

公开(公告)日：2005-10-18

申请号：US10160495

申请日：2002-05-31

申请人： John Borland Kerr ,  Shanger Wang ,  Yong Bong Han ,  Gao Liu ,  Jun Hou ,  Steven Edward Sloop

发明人： John Borland Kerr ,  Shanger Wang ,  Yong Bong Han ,  Gao Liu ,  Jun Hou ,  Steven Edward Sloop

IPC分类号： C08F2/00 ,  C08G65/14 ,  C08G65/22 ,  C08G65/336 ,  C08G83/00 ,  C08J5/22 ,  C08L71/02 ,  H01B1/12 ,  H01M10/052 ,  H01M10/0565 ,  H01M10/36 ,  C08L63/08 ,  C08F255/06 ,  C08F283/10 ,  C08F285/00

CPC分类号： H01B1/122 ,  C08G65/14 ,  C08G65/22 ,  C08G65/336 ,  C08G83/003 ,  C08J5/2218 ,  C08L71/02 ,  C08L2205/05 ,  H01M10/052 ,  H01M10/0565 ,  H01M2300/0082 ,  C08L83/00

摘要： Single ion conductors comprising polymer electrolytes prepared by grafting a salt compound onto a comb-branch polymer or dendrimer are disclosed having superior properties.

摘要翻译： 公开了包含通过将盐化合物接枝到梳状聚合物或树枝状聚合物上制备的聚合物电解质的单离子导体，其具有优异的性质。