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11.发明授权公开(公告)号：US11334740B2
公开(公告)日：2022-05-17
申请号：US16910840
申请日：2020-06-24
Inventor： Kerui Xi , Tingting Cui , Feng Qin , Xuhui Peng , Linzhi Wang
Abstract: Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US11183463B2
公开(公告)日：2021-11-23
申请号：US16456392
申请日：2019-06-28
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui Xi , Feng Qin , Jine Liu , Xiaohe Li , Tingting Cui
IPC: H01L23/544 , H01L21/02 , H01L21/56 , H01L21/683 , H01L23/31 , H01L23/48
Abstract: Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.
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公开(公告)号：US20210229096A1
公开(公告)日：2021-07-29
申请号：US17231842
申请日：2021-04-15
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Baiquan LIN , Kerui Xi , Zhenyu Jia , Junting Ouyang , Feng Qin , Xuhui Peng
Abstract: A microfluidic device includes: first substrate, microfluidic channel layer, and second substrate; the first substrate includes light source layer including a plurality of light source structures, the light source structure includes first electrode, second electrode, and an electroluminescence module, and when being turned on, emits light passing through the microfluidic channel layer and irradiating the second substrate; the second substrate includes photoelectric detection layer including a plurality of photoelectric detection structures and driving electrode layer including a plurality of driving electrodes and a plurality of driving circuits, the photoelectric detection structure includes third electrode, fourth electrode, and photoelectric conversion module arranged therebetween, and when being turned on, generates an electrical signal according to an incident light signal; the driving circuit is configured to apply a voltage to each driving electrode such that a droplet moves in a microfluidic channel of the microfluidic channel layer.
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14.发明申请公开(公告)号：US20190393245A1
公开(公告)日：2019-12-26
申请号：US16188621
申请日：2018-11-13
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui Xi , Tingting Cui , Feng Qin , Jine Liu , Xiaohe Li
Abstract: In an array substrate, an electronic paper display panel and a drive method thereof, and a display device, a display area includes multiple sub-display areas. A plurality of scanning lines in each sub-display area are electrically insulated from each other, corresponding scanning lines in different sub-display areas are electrically connected to each other and display time of each sub-display area is controlled through control signal lines. When a control chip and a flexible circuit board are employed, only a small number of control chips and/or flexible circuit boards, or even only one control chip and/or one flexible circuit board, may drive multiple sub-display areas to display pictures.
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公开(公告)号：US12057324B2
公开(公告)日：2024-08-06
申请号：US18090918
申请日：2022-12-29
Inventor： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC: H01L21/48 , H01L21/56 , H01L23/00 , H01L23/498
CPC classification number: H01L21/4853 , H01L21/486 , H01L21/4896 , H01L21/561 , H01L23/49816 , H01L23/49822 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2924/37001
Abstract: A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.
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Patent Agency Ranking
公开(公告)号：US11901324B2
公开(公告)日：2024-02-13
申请号：US17451621
申请日：2021-10-20
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui Xi , Feng Qin , Jine Liu , Xiaohe Li , Tingting Cui
CPC classification number: H01L24/20 , H01L23/3135 , H01L24/13 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/13023 , H01L2224/2101
Abstract: Chip package structure is provided. The chip package structure includes: a chip, the chip including metal pins; an organic polymer material layer, the organic polymer material layer being located on a side of the metal pins away from the chip, the organic polymer material layer including a first via hole, and the organic polymer material layer including a first surface away from the chip; metal parts, at least a portion of the metal parts being located in the first via hole, the metal parts and metal pins being electrically connected, the metal parts including a second surface away from the chip, and the second surface and the first surface being flush to each other; and an encapsulating layer, the encapsulating layer being located on a side of the metal parts away from the organic polymer material layer.
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公开(公告)号：US11826755B2
公开(公告)日：2023-11-28
申请号：US17363792
申请日：2021-06-30
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Kerui Xi , Feng Qin , Xiangjian Kong , Jiubin Zhou , Guicai Wang , Yajie Wang , Tingting Cui
CPC classification number: B01L3/502715 , B01L3/50273 , G01N27/228 , G09G3/348 , H01L27/124 , H01L27/1255 , H03K17/687 , H05B45/30 , B01L2400/0427 , G09G2300/0426
Abstract: A panel includes a substrate, an array layer and an electrode array layer. The array layer is on a side of the substrate; the electrode array layer is on a side of the array layer away from the substrate; and the array layer includes an active layer, a gate metal layer and a source/drain metal layer. The substrate includes drive units arranged in an array, scan line groups, data lines extending in a second direction; and common signal lines extending in the second direction. The scan line group includes first scan lines and second scan lines, extending in a first direction. The first direction is perpendicular with the second direction. The electrode array layer includes drive electrodes arranged in an array; the drive electrodes correspond to the drive units; and the drive unit includes a first transistor, a second transistor, a third transistor, a first capacitor and a second capacitor.
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公开(公告)号：US11824262B2
公开(公告)日：2023-11-21
申请号：US17361356
申请日：2021-06-29
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Baiquan Lin
CPC classification number: H01Q1/005 , H01Q5/371 , H01Q21/065
Abstract: Provided are an antenna, a phase shifter, and a communication device. The antenna includes a first metal electrode, a second metal electrode, and a photo-sensitive layer. The first metal electrode and the second metal electrode are respectively located on two opposite sides of the photo-sensitive layer. The first metal electrode includes multiple transmission electrodes. The multiple transmission electrodes are configured to transmit electrical signals. The photo-sensitive layer includes at least one photo-sensitive unit and the at least one photo-sensitive unit overlaps the transmission electrodes. The antenna provides more possibilities for large-scale commercialization.
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公开(公告)号：US11705643B2
公开(公告)日：2023-07-18
申请号：US17530425
申请日：2021-11-18
Inventor： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Zhenyu Jia
CPC classification number: H01Q21/065 , H01Q1/38 , H01Q1/422 , H01Q3/36
Abstract: Disclosed antenna unit includes first substrate and second substrate opposite to each other, phase shifting units and driver circuit. Region facing the first substrate and the second substrate form phase shifting region. In first direction, the first substrate formed with first step region, and used for connecting radio-frequency signal terminal; in second direction, the second substrate formed with second step region, and included angle between the first direction and the second direction greater than or equal to 0° and smaller than 180°. At least part of the first step region does not overlap at least part of the second step region. Phase shifting units used for radiating radio-frequency signal and distributed in phase shifting region, each phase shifting unit. At least part of the driver circuit disposed in the second step region and the driver circuit electrically connected to each phase shifting unit to adjust radio-frequency signal.
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公开(公告)号：US11660597B2
公开(公告)日：2023-05-30
申请号：US17231842
申请日：2021-04-15
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
Inventor： Baiquan Lin , Kerui Xi , Zhenyu Jia , Junting Ouyang , Feng Qin , Xuhui Peng
CPC classification number: B01L3/502715 , G01N21/01 , G01N21/59 , H10K65/00 , B01L2300/0663
Abstract: A microfluidic device includes: first substrate, microfluidic channel layer, and second substrate; the first substrate includes light source layer including a plurality of light source structures, the light source structure includes first electrode, second electrode, and an electroluminescence module, and when being turned on, emits light passing through the microfluidic channel layer and irradiating the second substrate; the second substrate includes photoelectric detection layer including a plurality of photoelectric detection structures and driving electrode layer including a plurality of driving electrodes and a plurality of driving circuits, the photoelectric detection structure includes third electrode, fourth electrode, and photoelectric conversion module arranged therebetween, and when being turned on, generates an electrical signal according to an incident light signal; the driving circuit is configured to apply a voltage to each driving electrode such that a droplet moves in a microfluidic channel of the microfluidic channel layer.
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