公开(公告)号：US20190002689A1

公开(公告)日：2019-01-03

申请号：US15744579

申请日：2016-04-08

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG

IPC: C08L71/12 ,  B32B27/28 ,  C08L25/10 ,  C08J5/24 ,  H05K1/03

CPC classification number: C08L71/126 ,  B32B27/00 ,  B32B27/285 ,  B32B2305/076 ,  C08J5/24 ,  C08J2325/10 ,  C08J2371/12 ,  C08J2409/00 ,  C08J2409/06 ,  C08J2425/10 ,  C08J2447/00 ,  C08J2471/12 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L2312/02 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/015 ,  C08L9/00

Abstract: Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl eresin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.

公开(公告)号：US20180215971A1

公开(公告)日：2018-08-02

申请号：US15744446

申请日：2016-03-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing CHEN ,  Xianping ZENG ,  Chiji GUAN

IPC: C09J171/12 ,  C08J5/24 ,  C09J11/04 ,  C09J11/06 ,  H05K1/03 ,  H05K1/02

CPC classification number: C09J171/12 ,  C08G65/485 ,  C08G77/20 ,  C08J5/24 ,  C08J2371/12 ,  C08J2483/07 ,  C08L71/126 ,  C09J11/04 ,  C09J11/06 ,  H05K1/0237 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0162 ,  C08L83/04 ,  C08K5/14

Abstract: The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.