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11.发明申请METHOD OF ATTACHING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ATTACHING TOOL 失效连接电子元件和电子元器件连接工具的方法公开(公告)号：US20120005883A1
公开(公告)日：2012-01-12
申请号：US13242647
申请日：2011-09-23
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。
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公开(公告)号：US06924174B2
公开(公告)日：2005-08-02
申请号：US10655030
申请日：2003-09-05
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
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13.发明授权Tray in combination with electronic component attaching tool attached to the tray 失效托盘与附在托盘上的电子元件连接工具组合公开(公告)号：US08671557B2
公开(公告)日：2014-03-18
申请号：US13242647
申请日：2011-09-23
IPC分类号： B23P19/00
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.
摘要翻译： 托盘与附接到托盘上的电子部件连接工具组合地提供，并且包括附接凹陷部分，该附件凹陷部分包括内壁并且附接有电子部件，其中，附接凹陷部分的内壁的形成基本上不 取决于电子部件的外部形状，以及形成在安装凹部的内壁中的标准部分，并与电子部件安装工具的第一结构部分接合，以将电子部件安装工具的位置对准到标准 当使用电子部件安装工具将电子部件的位置与托盘的第一位置对准时，标准部件具有基本上不依赖于电子部件的外形的形状。
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公开(公告)号：US07430798B2
公开(公告)日：2008-10-07
申请号：US11126246
申请日：2005-05-11
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。
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15.发明申请Method of attaching electronic component and electronic component attaching tool 有权安装电子元件和电子元件安装工具的方法公开(公告)号：US20050204551A1
公开(公告)日：2005-09-22
申请号：US11126246
申请日：2005-05-11
CPC分类号： B25B27/14 , H05K7/1061 , Y10T29/4913 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183 , Y10T29/53187 , Y10T29/53191 , Y10T29/53943
摘要： An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
摘要翻译： 准备适用于半导体器件外形的电子部件安装工具。 电子部件安装工具具有将半导体器件的位置与IC插座对准的功能。 电子部件安装工具安装在形成在IC插座上的标准表面上，基本上与半导体器件的外部形状无关。 然后通过使用电子部件安装工具将半导体器件对准并附接到IC插座，并且将电子部件附接工具从IC插座移除。 准备适用于另一半导体器件的外部形状的另一个电子部件附接工具，并且执行与上述相同的步骤以将该半导体器件对准并附接到相同类型的IC插座。
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16.发明授权Probe card and method of testing wafer having a plurality of semiconductor devices 有权探针卡和测试具有多个半导体器件的晶片的方法公开(公告)号：US06563330B1
公开(公告)日：2003-05-13
申请号：US09540870
申请日：2000-03-31
申请人： Shigeyuki Maruyama , Daisuke Koizumi , Naoyuki Watanabe , Yoshito Konno , Eiji Yoshida , Toshiyuki Honda , Toshimi Kawahara , Kenichi Nagashige
发明人： Shigeyuki Maruyama , Daisuke Koizumi , Naoyuki Watanabe , Yoshito Konno , Eiji Yoshida , Toshiyuki Honda , Toshimi Kawahara , Kenichi Nagashige
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05568 , H01L2224/05569 , H01L2224/05573 , H01L2224/11 , H05K3/326
摘要： A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material according to the present invention. An electrode pitch of the contact electrodes is expanded by the first wiring.
摘要翻译： 一种用于测试形成多个半导体芯片的晶片的探针卡，所述探针卡包括基板和多层基板。 探针卡还可以包括柔性基底。 在其中一个芯片上与电极相对设置的接触电极设置在柔性基板的上方或下方，或者可以设置在多层基板上的弹性材料上。 第一布线具有连接到接触电极的第一部分，从第一部分的电平延伸到较低电平的多层基板的电平转换部分，以及连接到电平转换部分的端部处的连接端子 多层基板上的内部端子。 多层基板中的第二布线将内部端子连接到多层基板的外围的外部端子。 电路板上的第三个接线将多层基板上的外部端子连接到电路板上的外部连接端子。 在晶片测试期间施加的温度负载导致的内部端子的位移由第一布线的电平转换部分补偿。 涉及探针卡上的接触电极和芯片上的电极之间的接触的不均匀性由根据本发明的接触电极和/或弹性材料补偿。 接触电极的电极间距由第一布线扩大。
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17.发明授权Contactor, method for manufacturing such contactor, and testing method using such contactor 失效接触器，制造这种接触器的方法以及使用这种接触器的测试方法公开(公告)号：US06767219B2
公开(公告)日：2004-07-27
申请号：US10292839
申请日：2002-11-13
申请人： Shigeyuki Maruyama , Naoyuki Watanabe , Kazuhiro Tashiro , Naohito Kohashi , Osamu Igawa , Tetsuya Fujisawa
发明人： Shigeyuki Maruyama , Naoyuki Watanabe , Kazuhiro Tashiro , Naohito Kohashi , Osamu Igawa , Tetsuya Fujisawa
IPC分类号： H01R1200
CPC分类号： G01R1/0675 , G01R3/00 , H05K7/1069
摘要： A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An inclined plane is formed by a cutting surface. A fracture surface formed by a tension fracture is formed at the apex portion of the contact electrode.
摘要翻译： 接触器具有接触器基板和形成在接触器基板上的多个接触电极。 每个接触电极由在连接到接触器基板的一端和另一端之间弯曲的金属线形成。 倾斜平面由切割面形成。 在接触电极的顶点处形成由张力断裂形成的断裂面。
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18.发明授权Probe card and method of testing wafer having a plurality of semiconductor devices 有权探针卡和测试具有多个半导体器件的晶片的方法公开(公告)号：US06774650B2
公开(公告)日：2004-08-10
申请号：US10392925
申请日：2003-03-21
申请人： Shigeyuki Maruyama , Daisuke Koizumi , Naoyuki Watanabe , Yoshito Konno , Eiji Yoshida , Toshiyuki Honda , Toshimi Kawahara , Kenichi Nagashige
发明人： Shigeyuki Maruyama , Daisuke Koizumi , Naoyuki Watanabe , Yoshito Konno , Eiji Yoshida , Toshiyuki Honda , Toshimi Kawahara , Kenichi Nagashige
IPC分类号： G01R3102
CPC分类号： G01R31/2886 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05568 , H01L2224/05569 , H01L2224/05573 , H01L2224/11 , H05K3/326
摘要： A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material. An electrode pitch of the contact electrodes is expanded by the first wiring.
摘要翻译： 一种用于测试形成多个半导体芯片的晶片的探针卡，所述探针卡包括基板和多层基板。 探针卡还可以包括柔性基底。 在其中一个芯片上与电极相对设置的接触电极设置在柔性基板的上方或下方，或者可以设置在多层基板上的弹性材料上。 第一布线具有连接到接触电极的第一部分，从第一部分的电平延伸到较低电平的多层基板的电平转换部分，以及连接到电平转换部分的端部处的连接端子 多层基板上的内部端子。 多层基板中的第二布线将内部端子连接到多层基板的外围的外部端子。 电路板上的第三个接线将多层基板上的外部端子连接到电路板上的外部连接端子。 在晶片测试期间施加的温度负载导致的内部端子的位移由第一布线的电平转换部分补偿。 与探针卡上的接触电极和芯片上的电极之间的接触相关的不均匀性由接触电极和/或弹性材料补偿。 接触电极的电极间距由第一布线扩大。
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公开(公告)号：US06410354B1
公开(公告)日：2002-06-25
申请号：US09906675
申请日：2001-07-18
IPC分类号： H01L2100
CPC分类号： G01R31/2891 , G01R1/07314
摘要： A semiconductor substrate test device includes a contactor having contact electrodes to be connected with terminals formed on a semiconductor substrate, and a drag supply part supplying a drag to prevent a deformation of the contactor caused by a contact force resulting from contacts of the contact electrodes with the terminals.
摘要翻译： 半导体衬底测试装置包括具有与半导体衬底上形成的端子连接的接触电极的接触器，以及阻力供应部分，用于阻止接触器由接触电极的接触引起的接触力引起的变形， 终端。
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公开(公告)号：US06806723B2
公开(公告)日：2004-10-19
申请号：US10369705
申请日：2003-02-21
申请人： Shigeyuki Maruyama , Keisuke Fukuda , Naoyuki Watanabe , Takumi Kumatabara , Naohisa Matsushita , Masayuki Imakado , Kyohei Tamaki , Hiroshi Nozawa
发明人： Shigeyuki Maruyama , Keisuke Fukuda , Naoyuki Watanabe , Takumi Kumatabara , Naohisa Matsushita , Masayuki Imakado , Kyohei Tamaki , Hiroshi Nozawa
IPC分类号： G01R3102
CPC分类号： G01R1/0675 , G01R1/06733 , G01R1/07342 , G01R3/00
摘要： Contact electrodes having a predetermined shape are formed by irradiating a laser beam onto the contact electrodes that are formed of a conductive material. The laser beam can be irradiated, after joining an end of each contact electrode opposite to a contact end to a contact board, so as to deform the contact electrode so that the contact end is located at a predetermined position. The laser beam may be irradiated while heating or cooling a portion of the contact electrode opposite to a portion onto which the laser beam is irradiated.
摘要翻译： 通过将激光照射到由导电材料形成的接触电极上而形成具有预定形状的接触电极。 在将与接触端相对的每个接触电极的端部接合到接触板之后，可以照射激光束，以使接触电极变形，使得接触端位于预定位置。 可以在加热或冷却接触电极的与照射激光束的部分相对的部分的同时照射激光束。
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