公开(公告)号：US06709699B2

公开(公告)日：2004-03-23

申请号：US09961288

申请日：2001-09-25

申请人： Tatsuhiko Ema ,  Shinichi Ito ,  Katsuya Okumura

发明人： Tatsuhiko Ema ,  Shinichi Ito ,  Katsuya Okumura

IPC分类号： B05D312

CPC分类号： H01L21/6715 ,  B05D1/265 ,  B05D3/0254 ,  B05D3/0406 ,  B05D3/0493 ,  H01L21/67034

摘要： Disclosed is a film-forming method, comprising dispensing from a dispenser nozzle a coating solution, which is prepared by adding a solid component to a solvent and controlled to be spread on the substrate in a predetermined range, onto a target substrate to be processed while relatively moving the dispenser nozzle and the target substrate so as to form a liquid film on the entire surface of the target substrate, and arranging a sucking nozzle above and apart from the target substrate such that the sucking nozzle is not in contact with the surface of the liquid film so as to permit the sucking nozzle to suck the solvent vapor right under the sucking nozzle while moving the sucking nozzle relative to the target substrate, thereby removing the solvent from the liquid film and, thus, forming a coated film.

公开(公告)号：US06660091B2

公开(公告)日：2003-12-09

申请号：US10092301

申请日：2002-03-07

申请人： Shinichi Ito ,  Katsuya Okumura

发明人： Shinichi Ito ,  Katsuya Okumura

IPC分类号： B05C502

CPC分类号： G03C1/49845 ,  B05B13/04 ,  B05C5/0212 ,  B05C5/025 ,  B05C11/10 ,  B05C11/1039 ,  G03F7/16

摘要： A liquid output portion is arranged above and moves relative to a semiconductor substrate with determined film formation and non-film-formation regions. The liquid output portion continuously outputs a liquid in a constant amount to the substrate. Below the liquid output portion is a liquid shut-out-portion. A liquid controlled to spread in a constant amount is continuously output from the liquid output nozzle to the substrate. While the nozzle and the substrate relatively move, the liquid is supplied to a first region, and the liquid is supplied to a second region in such a way that the liquid supplied and spread in the second region is in contact with the liquid supplied and spread in the first region. Where projections and depressions are formed on the surface of the substrate, an amount of the liquid supplied varies depending upon the ratio between the projections and depressions.

摘要翻译： 液体输出部分布置在具有确定的成膜和非成膜区域的半导体衬底之上并相对于半导体衬底移动。 液体输出部分连续输出一定量的液体到基底。 在液体输出部分下面是液体封闭部分。 从液体输出喷嘴向衬底连续地输出以恒定量传播的液体。 当喷嘴和基板相对移动时，将液体供应到第一区域，并且将液体供应到第二区域，使得供应和扩散在第二区域中的液体与供应和扩散的液体接触 在第一个地区。 在基板的表面上形成有凹凸的情况下，所供给的液体的量根据凸部和凹部的比例而变化。

公开(公告)号：US06528128B2

公开(公告)日：2003-03-04

申请号：US09553480

申请日：2000-04-20

申请人： Shinichi Ito ,  Katsuya Okumura

发明人： Shinichi Ito ,  Katsuya Okumura

IPC分类号： C08J704

CPC分类号： B05C5/002 ,  B05C5/004 ,  B05C5/007 ,  B05D1/28

摘要： A substrate-treating method, which comprises the steps of, discharging a chemical liquid from a chemical liquid feeder to a chemical liquid-transporting face of a chemical liquid supplier, the chemical liquid-transporting face being disposed parallel with or inclined to a main surface of the substrate which is held in an approximately horizontal state, and moving the chemical liquid supplier in relative to the substrate while allowing the chemical liquid discharged from the chemical liquid feeder to flow over the chemical liquid-transporting face in a manner where the surface of chemical liquid is opened to ambient atmosphere. The chemical liquid discharged from the chemical liquid feeder and flowing over the chemical liquid-transporting face is fed to the substrate in state where the feeding speed and pressure of the chemical liquid are reduced due to relative moving between the chemical liquid supplier and the substrate.

摘要翻译： 一种基板处理方法，其特征在于，包括以下步骤：将化学液体从化学液体供给器排出到化学液体供给器的化学液体输送面，所述化学液体输送面与主表面平行或倾斜配置 保持在大致水平状态的基板，并且使化学液体供给体相对于基板移动，同时允许从药液供给器排出的化学液体以化学液体输送面的方式流过化学液体输送面， 化学液体向大气环境开放。 在化学液体供给器和基板之间的相对移动的情况下，从化学液体供给器排出并流过化学液体输送面的化学液体被供给到基板，在该状态下，化学液体的进给速度和压力被降低。

公开(公告)号：US06265696B1

公开(公告)日：2001-07-24

申请号：US09371845

申请日：1999-08-11

申请人： Hideaki Sakurai ,  Akitoshi Kumagae ,  Iwao Higashikawa ,  Shinichi Ito ,  Tsunetoshi Arikado ,  Katsuya Okumura

发明人： Hideaki Sakurai ,  Akitoshi Kumagae ,  Iwao Higashikawa ,  Shinichi Ito ,  Tsunetoshi Arikado ,  Katsuya Okumura

IPC分类号： F27B514

CPC分类号： G01J5/06 ,  G01J5/0003 ,  G05D23/27

摘要： A substrate to be processed on which a thin film is formed is supported by a support member. The substrate to be processed is heated by a heating section. The surface temperature is measured by a radiation thermometer, and the heating temperature of the heating section is controlled by a control section, in response to the temperature measured by the radiation thermometer. Further, a blackbody is provided at a position optically symmetrical to the radiation thermometer with respect to the surface of the thin film. The blackbody is set at a constant temperature. The blackbody cuts stray light (noise light) which enters into the radiation thermometer.

摘要翻译： 其上形成有薄膜的待处理基板由支撑部件支撑。 待加工的基板被加热部加热。 通过辐射温度计测量表面温度，并且响应于由辐射温度计测量的温度，加热部分的加热温度由控制部分控制。 此外，相对于薄膜的表面，在与辐射温度计光学对称的位置处设置黑体。 黑体被设定在恒温。 黑体切割进入辐射温度计的杂散光（噪声光）。

公开(公告)号：US06231917B1

公开(公告)日：2001-05-15

申请号：US09335508

申请日：1999-06-18

申请人： Shinichi Ito ,  Katsuya Okumura

发明人： Shinichi Ito ,  Katsuya Okumura

IPC分类号： B05D314

CPC分类号： G03C1/49845 ,  B05B13/04 ,  B05C5/0212 ,  B05C5/025 ,  B05C11/10 ,  B05C11/1039 ,  G03F7/16

摘要： A liquid output portion is arranged above a substrate. In the substrate, a film formation region and a non-film-formation region are determined. The liquid output portion is responsible for continuously outputting a liquid in a constant amount to the substrate. The substrate and the liquid output portion are relatively moved by a moving portion. Below the liquid output portion, a liquid shut-out portion is arranged. At least one of the substrate and the liquid output portion is moved and ready to supply of the liquid from the liquid output portion to the non-film-formation region, the supply is shut out by the liquid shut-out portion. A liquid, which has been controlled so as to spread in a constant amount, is continuously output from the liquid output nozzle to the substrate. While the nozzle and the substrate are relatively moved, the liquid is supplied to a first region on the substrate. While the nozzle and the substrate are relatively moved, the liquid is supplied to a second region on the substrate in such a way that the liquid supplied from the nozzle and spread in a second region on the substrate is in contact with the liquid which has supplied and spread in the first region on the substrate. In the case where projections and depressions are formed on the surface of the substrate, an amount of the liquid to be supplied to the substrate is varied depending upon the ratio between the projections and depressions.

摘要翻译： 液体输出部分设置在基板的上方。 在基板中，确定成膜区域和非成膜区域。 液体输出部分负责将恒定量的液体连续地输出到基板。 基板和液体输出部分被移动部分相对移动。 在液体输出部分下方布置有液体封闭部分。 衬底和液体输出部分中的至少一个被移动并准备好将液体从液体输出部分供应到非成膜区域，由液体截留部分关闭供给。 从液体输出喷嘴向衬底连续地输出已经被控制成以恒定量扩散的液体。 当喷嘴和基板相对移动时，液体被供应到基板上的第一区域。 当喷嘴和基板相对移动时，液体被供应到基板上的第二区域，使得从喷嘴供应并在基板上的第二区域中扩散的液体与已经供应的液体接触 并扩散在基板上的第一区域中。 在基板的表面上形成有凹凸的情况下，供给到基板的液体的量根据凸部和凹部的比例而变化。

公开(公告)号：US07604832B2

公开(公告)日：2009-10-20

申请号：US10927155

申请日：2004-08-27

申请人： Shinichi Ito ,  Tatsuhiko Ema ,  Kei Hayasaki ,  Rempei Nakata ,  Nobuhide Yamada ,  Katsuya Okumura

发明人： Shinichi Ito ,  Tatsuhiko Ema ,  Kei Hayasaki ,  Rempei Nakata ,  Nobuhide Yamada ,  Katsuya Okumura

IPC分类号： B05D1/02 ,  B05D3/12

CPC分类号： H01L21/6715 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02282 ,  H01L21/288 ,  H01L21/31633

摘要： There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5 qγ (mm) given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5 (m·sec/N).

摘要翻译： 公开了一种成膜方法，其特征在于，连续地排出通过设置在喷嘴中的排出口将调整后的液体以一定量向基板扩散至基板，使喷嘴和基板相对移动， 将供给的溶液供给到基板上以形成液膜，其中喷嘴的排出口和基板之间的距离h被设定为不小于2mm，并且在小于5×10 -5 qgamma（mm）的范围内 相对于溶液的表面张力γ（N / m），通过排出口连续排出的溶液的排出速度q（m / sec），常数为5×10 -5（m·sec / N）。

公开(公告)号：US06301435B1

公开(公告)日：2001-10-09

申请号：US09573227

申请日：2000-05-19

申请人： Shinichi Ito ,  Katsuya Okumura

发明人： Shinichi Ito ,  Katsuya Okumura

IPC分类号： F26B1900

CPC分类号： F26B3/28

摘要： A heating method for heating an object by making use of a heating apparatus comprising lamps and light transmissive columnar bodies each being positioned in front of and in the light irradiating direction of each of the lamps and having a fore-end constituting a light-receiving face for taking up an irradiated light from the lamp and a rear-end constituting a light-irradiating face for irradiating light; the object being disposed to face the light-irradiating faces of the light transmissive columnar bodies and heated by the irradiation of light transmitted via the light transmissive columnar bodies from the lamps. A distance between the light-irradiating faces of the light transmissive columnar bodies and the object is set to around 0.3L or not less than 0.8L (herein, L is a width of the light-irradiating face).

摘要翻译： 一种利用包括灯和透光柱状体的加热装置加热物体的加热方法，每个灯都位于每个灯的前面和光线照射方向上，并且具有构成光接收面的前端 用于摄取来自灯的照射光和构成用于照射光的光照射面的后端; 物体被设置为面对透光柱状体的光照射面，并且通过从灯透过的透光柱状体的光的照射被加热。 透光性柱状体的光照射面与物体之间的距离设定为0.3L以下且0.8L以上（此处，L为照射面的宽度）。

公开(公告)号：US6072162A

公开(公告)日：2000-06-06

申请号：US352323

申请日：1999-07-12

申请人： Shinichi Ito ,  Katsuya Okumura

发明人： Shinichi Ito ,  Katsuya Okumura

IPC分类号： G03F7/16 ,  H01L21/00 ,  H01L21/027 ,  H05B3/26 ,  H05B3/68 ,  C23C16/00

CPC分类号： H01L21/67109 ,  H01L21/67103 ,  H05B3/262 ,  H05B3/68 ,  H05B2203/022

摘要： A device for heating a substrate comprises a heating plate for heating a to-be-treated substrate, substrate holding section for holding the to-be-treated substrate on the heating plate, a gas stream producing section for producing a gas stream in a space above the heating plate in one direction along a surface of the heating plate, and a heater provided at the heating plate, and having pattern symmetrical with respect to a gas stream flowing through the center of the heating plate, wherein the heater comprises a first heater constituting section having heater elements arranged in the form of a ring, and a second heater constituting section located inside the first heater constituting section and having heater elements which are arranged so that more heat is generated in an upstream side of the gas stream than in a downstream side thereof.

摘要翻译： 用于加热基板的装置包括用于加热被处理基板的加热板，用于将待处理基板保持在加热板上的基板保持部分，用于在空间中产生气流的气流产生部分 在加热板的一个方向上方，以及设置在加热板上的加热器，并且具有相对于流过加热板的中心的气流对称的图案，其中加热器包括第一加热器 具有以环形形式设置的加热器元件的构成部分和位于第一加热器构成部分内部的第二加热器构成部分，并且具有加热器元件，其布置成在气流的上游侧产生比在 下游侧。

公开(公告)号：US6059880A

公开(公告)日：2000-05-09

申请号：US995990

申请日：1997-12-22

申请人： Takahiro Kitano ,  Katsuya Okumura ,  Shinichi Ito

发明人： Takahiro Kitano ,  Katsuya Okumura ,  Shinichi Ito

IPC分类号： B05C11/08 ,  G03F7/16 ,  H01L21/027 ,  B05C5/00

CPC分类号： G03F7/162

摘要： A coating apparatus according to the invention comprises a spin chuck for holding a substrate, resist solution tanks which contain a primary resist solution, a thinner tank which contains thinner, a confluence valve communicating with the thinner tank and the resist solution tanks, first pumps each for supplying the confluence valve with the primary resist solution from a corresponding one of the resist solution tanks, a second pump for supplying thinner from the thinner tank to the confluence valve, a mixer for mixing the primary treatment solution and thinner supplied from the confluence valve, a nozzle for applying a solution from the mixer, to the substrate held by the spin chuck, and a controller for controlling the first and second pumps to adjust the mixture ratio of the primary resist solution to be supplied from each of the resist solution tanks to the confluence valve, to thinner to be supplied from the thinner tank to the confluence valve.

摘要翻译： 根据本发明的涂覆装置包括：用于保持基底的旋转卡盘，含有主抗蚀剂溶液的抗蚀剂溶液罐，含有较薄的罐的较薄的罐，与较薄罐相连的汇流阀和抗蚀剂溶液罐，首先泵送每个 用于从所述抗蚀剂溶液罐中的相应的一个供应所述汇流阀，用于从所述较薄罐向所述汇流阀供应较薄的第二泵，用于混合所述主处理溶液和从所述汇流阀供应的稀释剂的混合器 用于将来自混合器的溶液施加到由旋转卡盘保持的基板的喷嘴，以及用于控制第一和第二泵以调节要从每个抗蚀剂溶液罐供应的主抗蚀剂溶液的混合比率的控制器 到合流阀，从较薄的罐到合流阀更薄。

公开(公告)号：US20080090001A1

公开(公告)日：2008-04-17

申请号：US11987653

申请日：2007-12-03

申请人： Shinichi Ito ,  Tatsuhiko Ema ,  Kei Hayasaki ,  Rempei Nakata ,  Nobuhide Yamada ,  Katsuya Okumura

发明人： Shinichi Ito ,  Tatsuhiko Ema ,  Kei Hayasaki ,  Rempei Nakata ,  Nobuhide Yamada ,  Katsuya Okumura

IPC分类号： C23C14/54 ,  B05C11/00

CPC分类号： H01L21/6715 ,  H01L21/02126 ,  H01L21/02164 ,  H01L21/022 ,  H01L21/02282 ,  H01L21/288 ,  H01L21/31633

摘要： There is disclosed a film forming method comprising continuously discharging a solution adjusted so as to spread over a substrate by a given amount to the substrate through a discharge port disposed in a nozzle, moving the nozzle and substrate with respect to each other, and holding the supplied solution onto the substrate to form a liquid film, wherein a distance h between the discharge port of the nozzle and the substrate is set to be not less than 2 mm and to be in a range less than 5×10−5 qγ (mm) given with respect to a surface tension γ (N/m) of the solution, discharge speed q (m/sec) of the solution continuously discharged through the discharge port, and a constant of 5×10−5 (m·sec/N).

摘要翻译： 公开了一种成膜方法，其特征在于，连续地排出通过设置在喷嘴中的排出口将调整后的液体以一定量向基板扩散至基板，使喷嘴和基板相对移动， 将所述溶液供给到所述基板上以形成液膜，其中所述喷嘴的排出口与所述基板之间的距离h被设定为不小于2mm并且在小于5×10 -5的范围内， 相对于溶液的表面张力γ（N / m）给出的SUP> qgamma（mm），通过排出口连续排出的溶液的排出速度q（m / sec）和5×10 -6 5（m.sec / N）。