-
公开(公告)号：US08171623B2
公开(公告)日：2012-05-08
申请号：US13117016
申请日：2011-05-26
IPC分类号： H05K3/20
CPC分类号： G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K2201/09727 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49155 , Y10T29/49169
摘要： A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
摘要翻译： 描述了一种用于将设备组件与相对于彼此在不同级别和取向上的电路连接的方法。 第一电路可以位于多平面刚性电路板上，其中多平面刚性电路板可以包括至少一个与多平面刚性电路板共用公共衬底的柔性构件，该多平面刚性电路板从多层刚性电路板的主体部分延伸， 平面刚性电路板。 柔性构件可以包括用于传递功率和/或数据的迹线以及耦合到功率和/或数据迹线的接口。 柔性构件可以被偏转或扭曲以将多平面刚性电路板的主体部分上的第一电路连接到与另一个装置部件相关联的第二电路。
-
公开(公告)号：US20110166690A1
公开(公告)日：2011-07-07
申请号：US12694085
申请日：2010-01-26
申请人： John P. Ternus , Stephen R. McClure , Joshua D. Banko , Ming Yu
发明人： John P. Ternus , Stephen R. McClure , Joshua D. Banko , Ming Yu
CPC分类号： G06F1/1633 , G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H01Q1/2266 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K5/03 , Y10T29/49995
摘要： A portable computing device is disclosed. The portable computing device can take many forms such as a laptop computer, a tablet computer, and so on. The portable computing device can include at least a single piece housing. The single piece housing including a plurality of steps. The plurality of mounting steps is formed by at least removing a preselected amount of housing material at predetermined locations on the interior surface. At least some of the mounting steps are used to mount at least some of the plurality of internal operating components to the housing.
摘要翻译： 公开了一种便携式计算设备。 便携式计算设备可以采用许多形式，例如膝上型计算机，平板计算机等。 便携式计算装置可以包括至少一个单件壳体。 单件壳体包括多个台阶。 多个安装步骤通过在内表面上的预定位置处至少去除预选量的壳体材料而形成。 至少一些安装步骤用于将多个内部操作部件中的至少一些安装到壳体。
-
公开(公告)号：US08896991B2
公开(公告)日：2014-11-25
申请号：US13619790
申请日：2012-09-14
申请人： John P. Ternus , Stephen R. McClure , Joshua D. Banko , Ming Yu
发明人： John P. Ternus , Stephen R. McClure , Joshua D. Banko , Ming Yu
CPC分类号： G06F1/1633 , G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H01Q1/2266 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K5/03 , Y10T29/49995
摘要： A portable computing device is disclosed. The portable computing device can take many forms such as a laptop computer, a tablet computer, and so on. The portable computing device can include at least a single piece housing. The single piece housing including a plurality of steps. The plurality of mounting steps is formed by at least removing a preselected amount of housing material at predetermined locations on the interior surface. At least some of the mounting steps are used to mount at least some of the plurality of internal operating components to the housing.
摘要翻译： 公开了一种便携式计算设备。 便携式计算设备可以采用许多形式，例如膝上型计算机，平板计算机等。 便携式计算装置可以包括至少一个单件壳体。 单件壳体包括多个台阶。 多个安装步骤通过在内表面上的预定位置处至少去除预选量的壳体材料而形成。 至少一些安装步骤用于将多个内部操作部件中的至少一些安装到外壳。
-
公开(公告)号：US08659906B2
公开(公告)日：2014-02-25
申请号：US13442801
申请日：2012-04-09
IPC分类号： H05K1/00
CPC分类号： G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K2201/09727 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49155 , Y10T29/49169
摘要： A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
摘要翻译： 描述了一种用于将设备组件与相对于彼此在不同级别和取向上的电路连接的方法。 第一电路可以位于多平面刚性电路板上，其中多平面刚性电路板可以包括至少一个与多平面刚性电路板共用公共衬底的柔性构件，该多平面刚性电路板从多层刚性电路板的主体部分延伸， 平面刚性电路板。 柔性构件可以包括用于传递功率和/或数据的迹线以及耦合到功率和/或数据迹线的接口。 柔性构件可以被偏转或扭曲以将多平面刚性电路板的主体部分上的第一电路连接到与另一个装置部件相关联的第二电路。
-
公开(公告)号：US20120195008A1
公开(公告)日：2012-08-02
申请号：US13442801
申请日：2012-04-09
IPC分类号： H05K1/00
CPC分类号： G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K2201/09727 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49155 , Y10T29/49169
摘要： A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
摘要翻译： 描述了一种用于将设备组件与相对于彼此在不同级别和取向上的电路连接的方法。 第一电路可以位于多平面刚性电路板上，其中多平面刚性电路板可以包括至少一个与多平面刚性电路板共用公共衬底的柔性构件，该多平面刚性电路板从多层刚性电路板的主体部分延伸， 平面刚性电路板。 柔性构件可以包括用于传递功率和/或数据的迹线以及耦合到功率和/或数据迹线的接口。 柔性构件可以被偏转或扭曲以将多平面刚性电路板的主体部分上的第一电路连接到与另一个装置部件相关联的第二电路。
-
公开(公告)号：US20110225817A1
公开(公告)日：2011-09-22
申请号：US13117016
申请日：2011-05-26
IPC分类号： H05K3/36
CPC分类号： G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K2201/09727 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49155 , Y10T29/49169
摘要： A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
-
公开(公告)号：US20110164371A1
公开(公告)日：2011-07-07
申请号：US12694166
申请日：2010-01-26
CPC分类号： G06F1/1613 , G06F1/1626 , G06F1/1643 , G06F1/1656 , H04M1/0252 , H04M1/0266 , H04M1/0277 , H05K1/0281 , H05K1/118 , H05K1/147 , H05K2201/09727 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49135 , Y10T29/4914 , Y10T29/49155 , Y10T29/49169
摘要： A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.
摘要翻译： 描述了一种用于将设备组件与相对于彼此在不同级别和取向上的电路连接的方法。 第一电路可以位于多平面刚性电路板上，其中多平面刚性电路板可以包括至少一个与多平面刚性电路板共用公共衬底的柔性构件，该多平面刚性电路板从多层刚性电路板的主体部分延伸， 平面刚性电路板。 柔性构件可以包括用于传递功率和/或数据的迹线以及耦合到功率和/或数据迹线的接口。 柔性构件可以被偏转或扭曲以将多平面刚性电路板的主体部分上的第一电路连接到与另一个装置部件相关联的第二电路。
-
公开(公告)号：US09223349B2
公开(公告)日：2015-12-29
申请号：US13528789
申请日：2012-06-20
申请人： Jeremy C. Franklin , Jiang Ai , Amy Qian , Benjamin M. Rappoport , Kevin D. Gibbs , Derek Wright , John P. Ternus , John Raff , Stephen R. McClure
发明人： Jeremy C. Franklin , Jiang Ai , Amy Qian , Benjamin M. Rappoport , Kevin D. Gibbs , Derek Wright , John P. Ternus , John Raff , Stephen R. McClure
IPC分类号： G06F1/16
CPC分类号： G06F1/1643 , G06F1/1656 , G06F1/1658 , Y10T29/49863 , Y10T29/49865
摘要： An electronic device may have polarizer layers, color filter layers, thin-film-transistor layers, and other display layers. A display layer may be separated from structures such as a display cover layer formed from clear glass or plastic and a touch sensor layer mounted on an inner surface of the display cover layer by an air gap. Cavities within an electronic device housing may serve as a source of dust and other contaminants. The air gap may be sealed against dust intrusion from a cavity within an electronic device using a dust sealing structure. The dust sealing structure may have a rectangular ring shape that runs around a rectangular peripheral portion of a display layer. The dust sealing structure may be formed from a tape-based structure, an elastomeric structure, a compressible foam structure, or a cured liquid structure.
摘要翻译： 电子器件可以具有偏振器层，滤色器层，薄膜晶体管层和其它显示层。 显示层可以与诸如由透明玻璃或塑料形成的显示器覆盖层和通过气隙安装在显示器覆盖层的内表面上的触摸传感器层之类的结构分离。 电子设备外壳内的腔体可能作为灰尘和其他污染物的来源。 空气间隙可以使用防尘密封结构来密封防止电子设备内的空腔中的灰尘侵入。 防尘密封结构可以具有围绕显示层的矩形周边部分延伸的矩形环形状。 防尘密封结构可以由带状结构，弹性体结构，可压缩泡沫结构或固化的液体结构形成。
-
公开(公告)号：US20130328051A1
公开(公告)日：2013-12-12
申请号：US13490287
申请日：2012-06-06
IPC分类号： H05K5/00 , H01L29/786 , H05K1/02
CPC分类号： H05K5/0017 , G02F1/133308 , G02F1/13452 , G02F1/13454 , G02F2001/133322 , G02F2201/42 , G06F1/1605 , G06F1/1633 , G06F1/1637 , G06F1/1643 , H01L29/786 , H04M1/0266 , H04M1/23 , H05K1/028
摘要： An electronic device may have a display mounted in a housing. The display may have layers such as polarizer layers, a color filter layer, and a thin-film transistor layer. Display layers such as color filter layers and thin-film-transistor layers may have glass substrates. Notches or other openings may be formed in the layers of a display. For example, a notch with a curved chamfered edge may be formed in a lower end of a thin-film-transistor layer. A component such as a button may overlap the notch. Structures such as sensors, cameras, acoustic components, and other electronic components, buttons, communications path structures such as flexible printed circuit cables and wire bonding wires, and housing structures may be received within a display layer notch.
摘要翻译： 电子设备可以具有安装在壳体中的显示器。 显示器可以具有诸如偏振器层，滤色器层和薄膜晶体管层的层。 显示层，例如滤色器层和薄膜晶体管层可以具有玻璃基板。 可以在显示器的层中形成凹口或其它开口。 例如，可以在薄膜晶体管层的下端形成具有弯曲倒角边缘的凹口。 诸如按钮的组件可能与凹口重叠。 诸如传感器，照相机，声学部件和其他电子部件，按钮，诸如柔性印刷电路电缆和引线接合线的通信路径结构以及壳体结构的结构可以被接收在显示层切口内。
-
公开(公告)号：US09894781B2
公开(公告)日：2018-02-13
申请号：US13490287
申请日：2012-06-06
IPC分类号： G02F1/1345 , H05K5/00 , H01L29/786 , G06F1/16 , H04M1/02 , G02F1/1333 , H05K1/02 , H04M1/23
CPC分类号： H05K5/0017 , G02F1/133308 , G02F1/13452 , G02F1/13454 , G02F2001/133322 , G02F2201/42 , G06F1/1605 , G06F1/1633 , G06F1/1637 , G06F1/1643 , H01L29/786 , H04M1/0266 , H04M1/23 , H05K1/028
摘要： An electronic device may have a display mounted in a housing. The display may have layers such as polarizer layers, a color filter layer, and a thin-film transistor layer. Display layers such as color filter layers and thin-film-transistor layers may have glass substrates. Notches or other openings may be formed in the layers of a display. For example, a notch with a curved chamfered edge may be formed in a lower end of a thin-film-transistor layer. A component such as a button may overlap the notch. Structures such as sensors, cameras, acoustic components, and other electronic components, buttons, communications path structures such as flexible printed circuit cables and wire bonding wires, and housing structures may be received within a display layer notch.
-
-
-
-
-
-
-
-
-
搜索结果
83 条记录 (耗时 0.028 秒)