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公开(公告)号：US20230420188A1
公开(公告)日：2023-12-28
申请号：US18331358
申请日：2023-06-08
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Takaaki SATO , Norihisa ANDO , Shinya ITO , Kosuke YAZAWA
Abstract: An electronic device comprises a chip component including a terminal electrode, a case having an accommodation recess accommodating the chip component, a conductive terminal attached to the case and connected to the terminal electrode, and a case cover disposed on an opening-edge surface of the case so as to cover the accommodation recess. The opening-edge surface has an opening-edge recess at least partly covered by the case cover. The opening-edge recess and the case cover have a space therebetween. The space is filled with a resin.
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公开(公告)号：US20230386747A1
公开(公告)日：2023-11-30
申请号：US18303703
申请日：2023-04-20
Applicant: TDK CORPORATION
Inventor： Takaaki SATO , Akihiro MASUDA , Norihisa ANDO , Shinya ITO , Kosuke YAZAWA
Abstract: An electronic device includes a chip component, a case, a resin, and a conductive terminal. The chip component includes a terminal electrode. The case includes an accommodation recess for accommodating the chip component. The resin is filled in the accommodation recess. The conductive terminal is attachable to the case. The conductive terminal includes an inner electrode portion disposed in the accommodation recess and connected to the terminal electrode. The inner electrode portion includes a space formation portion forming a filling space for a conductive agent with an outer surface of the chip component at a position closer to a bottom surface than to an opening of the accommodation recess.
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公开(公告)号：US20220148808A1
公开(公告)日：2022-05-12
申请号：US17495274
申请日：2021-10-06
Applicant: TDK CORPORATION , TDK XIAMEN CO., LTD.
Inventor： Masahiro MORI , Akihiro MASUDA , Shinya ITO , Norihisa ANDO
Abstract: A ceramic electronic component including: a ceramic element body including an end surface extending along a first axis, and a side surface extending along a second axis and intersecting the end surface; an end-face electrode formed on the end surface of the ceramic element body; and a lead terminal connected to the end-face electrode by soldering. The lead terminal includes: an adjacent part overlapping the end-face electrode in a side view from the second axis; and an extension part extending from an end of the adjacent part in a direction away from a plane including the side surface. A first recess is formed at the extension part and is recessed in a direction away from a plane including the end surface, and the first recess exists at a position close to the end of the adjacent part.
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公开(公告)号：US20210125782A1
公开(公告)日：2021-04-29
申请号：US17063106
申请日：2020-10-05
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Norihisa ANDO , Shinya ITO
Abstract: A ceramic electronic device includes a ceramic element body, a terminal electrode, and a lead terminal. The ceramic element body has an end surface and a lateral surface. The terminal electrode is formed on from the end surface to a part of the lateral surface of the ceramic element body. The lead terminal is connected to the terminal electrode by a connection member. The lead terminal includes an electrode facing portion disposed correspondingly to an end-surface electrode of the terminal electrode, an extension portion extending downward from a lower end of the electrode facing portion, and a step surface located between the electrode facing portion and the extension portion. The electrode facing portion has a first recess facing the terminal electrode. A part of the first recess reaches the step surface. Another part of the first recess is open outside the lead terminal.
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公开(公告)号：US20210090805A1
公开(公告)日：2021-03-25
申请号：US17006100
申请日：2020-08-28
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Norihisa ANDO , Shinya ITO
IPC: H01G4/232
Abstract: A ceramic electronic component of the present invention includes: a ceramic element body; a terminal electrode formed on from an end surface to a side surface of the ceramic element body; and a lead terminal joined to the terminal electrode by a solder. A fillet of the solder is formed between the terminal electrode of a side surface at the ceramic element body and the lead terminal, and a coating layer is formed on a surface of the lead terminal that is in contact with the solder. The coating layer is formed of a metal component having a contact angle with the solder smaller than that of the lead terminal.
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Patent Agency Ranking
公开(公告)号：US20230402228A1
公开(公告)日：2023-12-14
申请号：US18331652
申请日：2023-06-08
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Takaaki SATO , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
Abstract: An electronic device includes: a ceramic element including a first electrode portion and a second electrode portion; a first metal terminal including a first external connection portion and a first electrode connection portion connected to the first electrode portion through solder; and a second metal terminal including a second external connection portion and a second electrode connection portion connected to the second electrode portion through solder. The first electrode connection portion includes a first solder stopper formed by undulation of at least a part of a facing surface of the first electrode connection portion facing the first electrode portion to control a range of an adhesion region of solder to the first electrode portion. The second electrode connection portion includes a second solder stopper that is formed by undulation of at least a part of a facing surface of the second electrode connection portion facing the second electrode portion.
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公开(公告)号：US20230268128A1
公开(公告)日：2023-08-24
申请号：US18154165
申请日：2023-01-13
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Shinya ITO , Norihisa Ando , Hideki Kaneko , Ken Aburakawa , Kenya Tamaki , Akitoshi Yoshii
Abstract: An electronic component having a case including an accommodation part having an opening; a ceramic element in the accommodation part with first and second main faces facing each other, a first and second electrode formed to the first and second main face, respectively; a first metal terminal including a first electrode connecting part connecting to the first electrode, a first mounting part exposed out of the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part and the first mounting part; a second metal terminal including a second electrode connecting part connecting to the second electrode, a second mounting part exposed out of the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part and the second mounting part; and an insulation member between the first electrode and the second terminal arm part.
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公开(公告)号：US20230268127A1
公开(公告)日：2023-08-24
申请号：US18096766
申请日：2023-01-13
Applicant: TDK CORPORATION
Inventor： Takaaki SATO , Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
Abstract: An electronic component including a case including an accommodation part having an opening; a ceramic element arranged in the accommodation part; a metal terminal including an electrode connecting part connecting to the ceramic element, a mounting part exposed out of the accommodation part, and a terminal arm part connecting the electrode connecting part and the mounting part; a case cover including a closing plate part covering the opening, and a case cover lateral side portion extending in a depth direction of the accommodation part from a circumference of the closing plate part and at least partially facing against an accommodation side wall of the accommodation part; and a mold resin filling the accommodation part.
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公开(公告)号：US20230064506A1
公开(公告)日：2023-03-02
申请号：US17888219
申请日：2022-08-15
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
Abstract: An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and a case lower surface facing opposite to its opening. The ceramic element is disposed in the recess and includes first and second main surfaces opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the case lower surface and being substantially parallel to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.
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公开(公告)号：US20230061638A1
公开(公告)日：2023-03-02
申请号：US17888139
申请日：2022-08-15
Applicant: TDK CORPORATION
Inventor： Akihiro MASUDA , Shinya ITO , Norihisa ANDO , Hideki KANEKO , Ken ABURAKAWA , Kenya TAMAKI , Akitoshi YOSHII
Abstract: An electronic device includes a case, a ceramic element, a first metal terminal, and a second metal terminal. The case includes a recess and its opening edge. The ceramic element is disposed in the recess and includes a first main surface and a second main surface opposing to each other, a first electrode portion formed on the first main surface, and a second electrode portion formed on the second main surface. The first metal terminal includes a first mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a first electrode connection portion connected to the first electrode portion. The second metal terminal includes a second mounting portion disposed on the opening edge and being substantially perpendicular to the first and second main surfaces and a second electrode connection portion connected to the second electrode portion.
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