公开(公告)号：US20200257250A1

公开(公告)日：2020-08-13

申请号：US16589176

申请日：2019-10-01

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Argyrios DELLIS ,  Adam FRUEHLING ,  Juan Alejandro HERBSOMMER

IPC: G04F5/00

Abstract: A clock generator includes a hermetically sealed cavity and clock generation circuitry. A dipolar molecule in the hermetically sealed cavity has a quantum rotational state transition at a fixed frequency. The clock generation circuitry generates an output clock signal based on the fixed frequency of the dipolar molecule. The clock generation circuitry includes a detection circuit, a reference oscillator, and control circuitry. The detection circuit generates a first detection signal and a second detection signal representative of amplitude of signal at an output of the hermetically sealed cavity responsive to a first sweep signal and a second sweep signal input to the hermetically sealed cavity. The control circuitry sets a frequency of the reference oscillator based on a difference in time of identification of the fixed frequency of the dipolar molecule in the first detection signal and the second detection signal.

公开(公告)号：US20240039475A1

公开(公告)日：2024-02-01

申请号：US17876008

申请日：2022-07-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Udit RAWAT ,  Bichoy BAHR ,  Swaminathan SANKARAN

IPC: H03B5/24 ,  H03H9/02 ,  G01S13/88

CPC classification number: H03B5/24 ,  H03H9/02007 ,  G01S13/88

Abstract: An oscillator circuit includes a bulk acoustic wave resonator, a differential active inductor circuit, and a gain circuit. The differential active inductor circuit is configured to bias the bulk acoustic wave resonator. The differential active inductor circuit is coupled between the bulk acoustic wave resonator and a power supply terminal. The gain circuit is coupled to the bulk acoustic wave resonator.

公开(公告)号：US20240007078A1

公开(公告)日：2024-01-04

申请号：US17854170

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Udit RAWAT ,  Bichoy BAHR

IPC: H03H9/02 ,  H03H9/24

CPC classification number: H03H9/02448 ,  H03H9/2405

Abstract: A microelectromechanical systems (MEMS) resonator includes a substrate, an array of ferroelectric capacitors on the substrate, and a three-dimensional metal stack above the array of ferroelectric capacitors. The three-dimensional metal stack may include more than two metal layers. Each of the metal layers is coupled to another of the metal layers by more than two metal vias.

公开(公告)号：US20230170877A1

公开(公告)日：2023-06-01

申请号：US17537776

申请日：2021-11-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR ,  Ting-Ta YEN ,  Michael Henderson PERROTT ,  Zachary SCHAFFER

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/02

CPC classification number: H03H9/175 ,  H03H9/131 ,  H03H9/02015

Abstract: A tunable bulk acoustic wave (BAW) resonator includes: a first electrode adapted to be coupled to an oscillator circuit; a second electrode adapted to be coupled to the oscillator circuit; and a piezoelectric layer between the first electrode and the second electrode; and a Bragg mirror. The Bragg mirror has: a metal layer; and a dielectric layer between the metal layer and either of the first electrode or the second electrode. The tunable BAW resonator also includes: a radio-frequency (RF) signal source having a first end and a second end, the first end coupled to the first electrode, and the second end coupled to the second electrode; and an amplifier circuit between either the first electrode or the second electrode and the Bragg mirror metal layer.

公开(公告)号：US20230063409A1

公开(公告)日：2023-03-02

申请号：US17463406

申请日：2021-08-31

Applicant: Texas Instruments Incorporated

Inventor： Michael Henderson PERROTT ,  Ting-Ta YEN ,  Bichoy BAHR ,  Baher S. HAROUN

IPC: H03B5/32 ,  H03B5/04 ,  H03L7/099 ,  H03L7/093

Abstract: A temperature compensated oscillator circuit includes a first oscillator, a second oscillator, a first divider, a second divider, a frequency ratio circuit, and a temperature compensation circuit. The first divider is coupled to the first oscillator, and is configured to divide a frequency of a first oscillator signal generated by the first oscillator. The second divider is coupled to the second oscillator, and is configured to divide a frequency of a second oscillator signal generated by the second oscillator. The frequency ratio circuit is coupled to the first divider and the second divider, and is configured to determine a frequency ratio of an output of the first divider to an output of the second divider. The temperature compensation circuit is coupled to the frequency ratio circuit and the first oscillator, and is configured to generate a compensated frequency based on the frequency ratio and the first oscillator signal.

公开(公告)号：US20220407528A1

公开(公告)日：2022-12-22

申请号：US17731795

申请日：2022-04-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Michael PERROTT ,  Bichoy BAHR

IPC: H03L7/26 ,  H03K5/00 ,  H03K3/011 ,  G04F5/14 ,  G06F1/04

Abstract: A system comprises a digital processing circuit, a frequency modulator, an amplitude modulator, and an adder. The digital processing circuit receives an input signal and a correlation signal and generates a frequency tuning parameter and an amplitude modulation parameter. The frequency modulator generates a frequency modulation signal and the correlation signal. The amplitude modulator receives the amplitude modulation parameter and generates an amplitude modulation signal. The adder receives the frequency tuning parameter and the frequency modulation signal and generates a control signal. In some implementations, the system further comprises a DC feedback circuit that receives the input signal and generates a DC compensation signal. In some implementations, the system further comprises a temperature sensor, a temperature compensation circuit, and a second adder.

公开(公告)号：US20250119112A1

公开(公告)日：2025-04-10

申请号：US18984189

申请日：2024-12-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hakhamanesh MANSOORZARE ,  Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR

IPC: H03H9/02 ,  H03H3/007

Abstract: A method comprises: forming a die including a cavity; coupling an anchor to the die; coupling a first resonator to a side of the anchor, in which the first resonator is suspended over the cavity and is operable to bend towards or away from a bottom of the cavity; and coupling a second resonator to the side of the anchor, in which the second resonator is suspended over the cavity, at least a part of the first resonator is laterally between the side of the anchor and a part of the second resonator, and the first resonator is operable to bend in an opposite direction from the second resonator.

公开(公告)号：US20250088148A1

公开(公告)日：2025-03-13

申请号：US18399974

申请日：2023-12-29

Applicant: Texas Instruments Incorporated

Inventor： Ajay Kumar REDDY ,  Arpan THAKKAR ,  Peeyoosh MIRAJKAR ,  Bichoy BAHR

IPC: H03B5/36 ,  H03K5/00

Abstract: A circuit includes a resonator, a transistor pair, and a common-mode feedback circuit. The transistor pair is cross-coupled across the resonator. The common-mode feedback circuit is coupled to the transistor pair. The common-mode feedback circuit includes first and second degeneration cells. The second degeneration cell is connected in parallel with the first degeneration cell. The second degeneration cell is configured to switchably vary a current flow through the transistor pair.

公开(公告)号：US20240113063A1

公开(公告)日：2024-04-04

申请号：US17957446

申请日：2022-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Udit RAWAT ,  Bichoy BAHR ,  Swaminathan SANKARAN ,  Baher S. HAROUN

IPC: H01L23/00 ,  A61B8/00

CPC classification number: H01L24/24 ,  A61B8/4494 ,  H01L24/05 ,  H01L24/73 ,  H01L2224/05005 ,  H01L2224/2401 ,  H01L2224/73251

Abstract: In examples, a semiconductor die comprises a semiconductor substrate having a surface, the surface having first and second surface portions, and a radiator layer on the surface. The radiator layer comprises a metal member having a first metal member portion above the first surface portion and a second metal member portion above the second surface portion, a first distance between the first metal member portion and the first surface portion, and a second distance between the second metal member portion and the second surface portion, the first distance less than the second distance. The radiator layer includes first and second electrodes. The radiator layer includes a piezoelectric layer extending along a length of the radiator layer and on each of the first and second electrodes, the piezoelectric layer between the first and second metal members and the semiconductor substrate.

公开(公告)号：US20210143130A1

公开(公告)日：2021-05-13

申请号：US17150825

申请日：2021-01-15

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Bichoy BAHR ,  Baher HAROUN

IPC: H01L25/065 ,  H01L21/673 ,  H03B5/08 ,  H01F38/14

Abstract: A multi-die module includes a first die with a first electronic device and a second die with a second electronic device. The multi-die module also includes a contactless coupler configured to convey signals between the first electronic device and the second electronic device. The multi-die module also includes a coupling loss reduction structure.