公开(公告)号：US11495524B2

公开(公告)日：2022-11-08

申请号：US16411457

申请日：2019-05-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Abram Castro ,  Usman Chaudhry ,  Joe Adam Garcia ,  Mahmud Halim Chowdhury

IPC: H01L23/495 ,  H01L23/31 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48 ,  H01L21/67 ,  H01L23/00 ,  H01L21/66

Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).

公开(公告)号：US20200173013A1

公开(公告)日：2020-06-04

申请号：US16209513

申请日：2018-12-04

Applicant: Texas Instruments Incorporated

Inventor： Luu Thanh Nguyen ,  Mahmud Halim Chowdhury ,  Ashok Prabhu ,  Anindya Poddar

IPC: C23C14/12 ,  C23F11/10 ,  H01L21/768 ,  H01L21/3205 ,  H01L21/288

Abstract: In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 μm on a surface of the copper corrosion inhibitor layer.

公开(公告)号：US20190279955A1

公开(公告)日：2019-09-12

申请号：US15914761

申请日：2018-03-07

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Daniel Lee Revier ,  Sadia Naseem ,  Mahmud Halim Chowdhury

IPC: H01L23/00

Abstract: In described examples, a microelectronic device includes a microelectronic die with a die attach surface. The microelectronic device further includes a nanoparticle layer coupled to the die attach surface. The nanoparticle layer may be in direct contact with the die attach surface, or may be coupled to the die attach surface through an intermediate layer, such as an adhesion layer or a contact metal layer. The nanoparticle layer includes nanoparticles having adjacent nanoparticles adhered to each other. The microelectronic die is attached to a package substrate by a die attach material. The die attach material extends into the nanoparticle layer and contacts at least a portion of the nanoparticles.