公开(公告)号：US12087673B2

公开(公告)日：2024-09-10

申请号：US17983249

申请日：2022-11-08

Applicant: Texas Instruments Incorporated

Inventor： Abram Castro ,  Usman Chaudhry ,  Joe Adam Garcia ,  Mahmud Halim Chowdhury

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/67 ,  H01L23/31 ,  H05K1/18 ,  H05K3/34 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L23/4952 ,  H01L21/4825 ,  H01L21/67138 ,  H01L23/3121 ,  H01L23/49541 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3494 ,  H01L22/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/3511 ,  H05K2201/10636

Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

公开(公告)号：US20230057405A1

公开(公告)日：2023-02-23

申请号：US17983249

申请日：2022-11-08

Applicant: Texas Instruments Incorporated

Inventor： Abram Castro ,  Usman Chaudhry ,  Joe Adam Garcia ,  Mahmud Halim Chowdhury

IPC: H01L23/495 ,  H01L23/31 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48 ,  H01L21/67

Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).

公开(公告)号：US11495524B2

公开(公告)日：2022-11-08

申请号：US16411457

申请日：2019-05-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Abram Castro ,  Usman Chaudhry ,  Joe Adam Garcia ,  Mahmud Halim Chowdhury

IPC: H01L23/495 ,  H01L23/31 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48 ,  H01L21/67 ,  H01L23/00 ,  H01L21/66

Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).