AUTOMATED CABLE WIRE PROCESSING
    11.
    发明申请

    公开(公告)号:US20250070524A1

    公开(公告)日:2025-02-27

    申请号:US18455485

    申请日:2023-08-24

    Abstract: A method for automated cable wire processing includes receiving a set of two or more cable wires, including at least a first cable wire positioned at a selection position, and a second cable wire positioned away from the selection position. A cable selection tool is automatically moved to contact the set of two or more cable wires, such that contact between the cable selection tool and the first cable wire causes a tip portion of the first cable wire to extend into a working region, and contact between the cable selection tool and the second cable wire moves a tip portion of the second cable wire outside of the working region. One or more tip processing operations are applied to the tip portion of the first cable wire within the working region.

    Automated methods and apparatus for installing a sleeve on a cable

    公开(公告)号:US11640862B2

    公开(公告)日:2023-05-02

    申请号:US17458063

    申请日:2021-08-26

    Abstract: A method utilizes a funnel system and robotic end effector grippers to feed an unjacketed portion of a shielded cable through a sleeve. The funnel is designed with one or more thin extensions (hereinafter “prongs”) on which a sleeve is placed prior to a cable entering the funnel. Preferably two or more prongs are employed, although a single prong may be used if properly configured to both guide a cable and fit between the sleeve and cable. The prongs close off the uneven surface internal to a sleeve and provide a smooth surface for the cable to slide along and through the sleeve, preventing any damage to the exposed shielding. The sleeve is picked up and held on the prongs using a robotic end effector. If the sleeve is a solder sleeve, the robotic end effector has grippers designed to make contact with the portions of the solder sleeve that are between the insulating rings and the central solder ring.

    Laser wire processing device
    13.
    发明授权

    公开(公告)号:US11446768B2

    公开(公告)日:2022-09-20

    申请号:US16239146

    申请日:2019-01-03

    Abstract: A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

    Wire bundle processing method
    14.
    发明授权

    公开(公告)号:US11319183B2

    公开(公告)日:2022-05-03

    申请号:US16655019

    申请日:2019-10-16

    Abstract: A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

    Cable processing apparatus and method therefore

    公开(公告)号:US10587101B2

    公开(公告)日:2020-03-10

    申请号:US15472452

    申请日:2017-03-29

    Abstract: A cable processing apparatus including a frame; a cable guide coupled to the frame; a first cable clamp adjacent the cable guide; a second cable clamp adjacent the cable guide where the first cable clamp is disposed between the cable guide and the second cable clamp; and a controller configured to move the second cable clamp to a clamped position such that a cable extending through the cable guide is clamped by the second cable clamp, move the second cable clamp, relative to the cable guide, in a direction extending along the cable such that a first portion of the insulation is removed from the cable at the first score to expose shielding of the cable, and move the second cable clamp, relative to the first cable clamp, in the direction extending along the cable to cut the shielding to expose one or more conductor of the cable.

    VIBRATING PALLET SYSTEM FOR AUTOMATED WIRE INSERTION

    公开(公告)号:US20190027886A1

    公开(公告)日:2019-01-24

    申请号:US16129538

    申请日:2018-09-12

    Abstract: A method and an apparatus relate to the insertion of one or more wires into a cavity of a fixture of a structure or component. The wire insertion apparatus includes a grommet, a gripper adapted to interface with the grommet, and at least a first vibrating element. The first vibrating element is connected to and vibrates one or more of the apparatus, the grommet, the gripper, the wire, and/or a component of the apparatus. Vibration, induced in any direction, enables the cavities to shift position during insertion relative to the contact, thus increasing the tolerance of the cavity, reducing the failure rate of wire insertion, and reducing total production time. The vibration breaks the static friction of the contact in the grommet or dielectric opening, creates the positive locating required to insert the contact in the grommet and/or dielectric, and/or pivots the contact.

    Wire contact inspection
    18.
    发明授权

    公开(公告)号:US10096102B2

    公开(公告)日:2018-10-09

    申请号:US15335299

    申请日:2016-10-26

    Abstract: A method of inspecting a wire contact includes determining, at a processor, a striation metric of a particular image of the wire contact. The particular image depicts an inspection hole in the wire contact. The method also includes comparing the striation metric to a wire-in-hole detection threshold and determining that a threshold number of visible wire strands are oriented along a particular axis in the inspection hole if the striation metric satisfies the wire-in-hole detection threshold.

    Split backshell for wire bundles
    19.
    发明授权

    公开(公告)号:US09871359B1

    公开(公告)日:2018-01-16

    申请号:US15472581

    申请日:2017-03-29

    CPC classification number: H02G3/0406 B64D2221/00 B64F5/10 H02G3/0481

    Abstract: A backshell, the backshell including a first shell member having a first end, a second end and a first channel, a second shell member having a first end, a second end and a second channel, the second shell member being configured to interface with the first shell member so that, when interfaced, the first ends of the first and second shell members are adjacent each other and defines a backshell first end, the second ends of the first and second shell members are adjacent each other and defines a backshell second end, and the channels of the first and the second shell members form a wire bundle passage extending between the backshell first end and the backshell second end, and a coupling ring configured to engage both the first shell member and the second shell member at the backshell first end to couple the first shell member to the second shell member.

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