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    Electronic equipment
    11.
    发明授权
    Electronic equipment 失效
    电子设备

    公开(公告)号：US06449149B1

    公开(公告)日：2002-09-10

    申请号：US09057339

    申请日：1998-04-09

    申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

    发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

    IPC分类号： G06F116

    CPC分类号： G06F1/203 ,  G06F2200/203

    摘要： An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

    摘要翻译： 电子设备包括：第一壳体，其上安装有键盘和布线板;第二壳体，其通过铰链可旋转地安装在第一壳体上。 电子设备的冷却结构包括作为第一壳体内的冷却对象的一个​​或多个元件，与该元件和第一壳体热连接的第一加热排放构件，第二加热排出构件，其布置在 第二壳体的内部和用于热连接第一散热元件和第二散热元件的连接装置。

    Electronic device and a thermal connector used therein
    13.
    发明授权
    Electronic device and a thermal connector used therein 有权
    电子设备和其中使用的热连接器

    公开(公告)号：US07839640B2

    公开(公告)日：2010-11-23

    申请号：US12544137

    申请日：2009-08-19

    申请人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

    发明人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

    IPC分类号： H05K7/20

    CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

    摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

    摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。

    Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board
    15.
    发明授权
    Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board 失效
    便携式计算机，其具有风扇，从在键盘和第一电路板之间产生的第一空间移动空气，以及在第一电路板和第二电路板之间产生的第二空间

    公开(公告)号：US5694294A

    公开(公告)日：1997-12-02

    申请号：US593049

    申请日：1996-01-29

    申请人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

    发明人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/203

    摘要： In a portable personal computer in which high-exothermic devices are mounted within a flat case equipped with an input unit, the and in which a surface temperature of the exothermic devices and the input unit is cooled down to or below a predetermined temperature. A first space is created between the back of a keyboard operating section and an electronic circuit board 3, the electronic circuit board 3 is installed so that the face thereof on which the high-exothermic devices are mounted faces away from the back of the keyboard, a second space is created between the electronic circuit board 3 and an electronic circuit board 2, and a fan 4 is installed inside the case so that cooling air flows from the first space to the second space. A flow path for circulating outside air into the case via an air intake hole 8 is constructed on the wall of the input device operating section.

    摘要翻译： 在其中高放热装置安装在配备有输入单元的平坦壳体内并且其中放热装置和输入单元的表面温度被冷却到或低于预定温度的便携式个人计算机中。 在键盘操作部分的背面和电子电路板3之间产生第一空间，电子电路板3被安装成使得其上安装有高放热装置的表面远离键盘的背面， 在电子电路板3和电子电路板2之间产生第二空间，风扇4安装在壳体内部，使得冷却空气从第一空间流到第二空间。 用于经由进气孔8将外部空气循环到壳体中的流动路径被构造在输入装置操作部分的壁上。

    Cooling device and electronic equipment including cooling device
    16.
    发明授权
    Cooling device and electronic equipment including cooling device 有权
    冷却装置和电子设备包括冷却装置

    公开(公告)号：US07936560B2

    公开(公告)日：2011-05-03

    申请号：US12544166

    申请日：2009-08-19

    申请人： Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

    发明人： Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

    IPC分类号： H05K7/20

    CPC分类号： F28D15/043 ,  F28D15/046 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

    摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

    摘要翻译： 提供了包括具有高性能CPU的冷却结构的刀片服务器。 为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽， 上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧 将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

    Electronic apparatus
    17.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US08164902B2

    公开(公告)日：2012-04-24

    申请号：US12544153

    申请日：2009-08-19

    申请人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

    发明人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  H05K7/20245

    摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

    摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

    Blade server
    18.
    发明授权
    Blade server 有权
    刀片服务器

    公开(公告)号：US08130497B2

    公开(公告)日：2012-03-06

    申请号：US12620742

    申请日：2009-11-18

    申请人： Yoshihiro Kondo ,  Tadakatsu Nakajima ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hiroyuki Toyoda ,  Tomoo Hayashi

    发明人： Yoshihiro Kondo ,  Tadakatsu Nakajima ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hiroyuki Toyoda ,  Tomoo Hayashi

    IPC分类号： H05K7/20

    CPC分类号： G06F1/20 ,  H05K7/20818

    摘要： A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

    摘要翻译： 一种具有冷却能力的服务器系统，其可以应对可拆卸地安装在刀片服务器上的服务器模块的CPU产生的热量的增加。 服务器模块包括容纳其中安装有CPU，存储器等的母板的壳体和用于冷却由CPU产生的热的沸腾冷却装置的一部分。 容纳在风扇模块中的风扇适于通过服务器模块外壳的开口将空气吹入服务器模块。 沸腾冷却装置包括设置在服务器模块外壳中的第一传热构件，设置在服务器模块外壳外部的第二传热构件和连接它们的多个管道。 第一传热构件是具有用于气密地密封制冷剂的内部空间的盒体，其一个外部平面被热连接到CPU，而另一个外部平面设置有散热器。 第二传热构件设置在风扇模块单元中，并且用于管道的散热构件与主板一起形成气流通道。

    ELECTRONIC DEVICE AND A THERMAL CONNECTOR USED THEREIN
    19.
    发明申请
    ELECTRONIC DEVICE AND A THERMAL CONNECTOR USED THEREIN 有权
    电子设备及其使用的热连接器

    公开(公告)号：US20100073865A1

    公开(公告)日：2010-03-25

    申请号：US12544137

    申请日：2009-08-19

    申请人： Tomoo HAYASHI ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

    发明人： Tomoo HAYASHI ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

    IPC分类号： G06F1/20

    CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

    摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

    摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。