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    Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board
    1.
    发明授权
    Portable computer with fan moving air from a first space created between a keyboard and a first circuit board and a second space created between the first circuit board and a second circuit board 失效
    便携式计算机，其具有风扇，从在键盘和第一电路板之间产生的第一空间移动空气，以及在第一电路板和第二电路板之间产生的第二空间

    公开(公告)号：US5694294A

    公开(公告)日：1997-12-02

    申请号：US593049

    申请日：1996-01-29

    申请人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

    发明人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： G06F1/203

    摘要： In a portable personal computer in which high-exothermic devices are mounted within a flat case equipped with an input unit, the and in which a surface temperature of the exothermic devices and the input unit is cooled down to or below a predetermined temperature. A first space is created between the back of a keyboard operating section and an electronic circuit board 3, the electronic circuit board 3 is installed so that the face thereof on which the high-exothermic devices are mounted faces away from the back of the keyboard, a second space is created between the electronic circuit board 3 and an electronic circuit board 2, and a fan 4 is installed inside the case so that cooling air flows from the first space to the second space. A flow path for circulating outside air into the case via an air intake hole 8 is constructed on the wall of the input device operating section.

    摘要翻译： 在其中高放热装置安装在配备有输入单元的平坦壳体内并且其中放热装置和输入单元的表面温度被冷却到或低于预定温度的便携式个人计算机中。 在键盘操作部分的背面和电子电路板3之间产生第一空间，电子电路板3被安装成使得其上安装有高放热装置的表面远离键盘的背面， 在电子电路板3和电子电路板2之间产生第二空间，风扇4安装在壳体内部，使得冷却空气从第一空间流到第二空间。 用于经由进气孔8将外部空气循环到壳体中的流动路径被构造在输入装置操作部分的壁上。

    Electronic equipment
    6.
    发明授权
    Electronic equipment 失效
    电子设备

    公开(公告)号：US06449149B1

    公开(公告)日：2002-09-10

    申请号：US09057339

    申请日：1998-04-09

    申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

    发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

    IPC分类号： G06F116

    CPC分类号： G06F1/203 ,  G06F2200/203

    摘要： An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

    摘要翻译： 电子设备包括：第一壳体，其上安装有键盘和布线板;第二壳体，其通过铰链可旋转地安装在第一壳体上。 电子设备的冷却结构包括作为第一壳体内的冷却对象的一个​​或多个元件，与该元件和第一壳体热连接的第一加热排放构件，第二加热排出构件，其布置在 第二壳体的内部和用于热连接第一散热元件和第二散热元件的连接装置。

    ELECTRONIC APPARATUS
    7.
    发明申请
    ELECTRONIC APPARATUS 有权
    电子设备

    公开(公告)号：US20100073863A1

    公开(公告)日：2010-03-25

    申请号：US12544153

    申请日：2009-08-19

    申请人： Hitoshi MATSUSHIMA ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

    发明人： Hitoshi MATSUSHIMA ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  H05K7/20245

    摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

    摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

    Cooling Device and Electronic Apparatus Using the Same
    8.
    发明申请
    Cooling Device and Electronic Apparatus Using the Same 有权
    冷却装置及其使用的电子设备

    公开(公告)号：US20090154104A1

    公开(公告)日：2009-06-18

    申请号：US12328967

    申请日：2008-12-05

    申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

    发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

    摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

    摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

    Electronic apparatus
    9.
    发明授权
    Electronic apparatus 有权
    电子仪器

    公开(公告)号：US08164902B2

    公开(公告)日：2012-04-24

    申请号：US12544153

    申请日：2009-08-19

    申请人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

    发明人： Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  H05K7/20245

    摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

    摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。

    Cooling device and electronic apparatus using the same
    10.
    发明授权
    Cooling device and electronic apparatus using the same 有权
    冷却装置及使用其的电子设备

    公开(公告)号：US07826217B2

    公开(公告)日：2010-11-02

    申请号：US12328967

    申请日：2008-12-05

    申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

    发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

    摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

    摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。