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公开(公告)号：US07557904B2
公开(公告)日：2009-07-07
申请号：US11360814
申请日：2006-02-24
申请人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
发明人： Naoki Ohmiya , Satoshi Genda , Noboru Takeda , Koichi Takeyama , Yukio Morishige , Hiroshi Morikazu , Hiroshi Nomura
CPC分类号： G03F7/707 , B23K26/40 , B23K37/0408 , B23K2101/40 , B23K2103/50 , B25B11/005 , B28D5/0094 , H01L21/6838
摘要： A wafer holding mechanism for holding a wafer affixed to a frame with a tape utilizing a suction force. The wafer holding mechanism includes a suction body, a wafer holder with a holding surface for holding the wafer via the tape, and a suction unit with a suction portion disposed at an outer peripheral edge of the wafer holder. The suction portion transmits a suction force across the holding surface though the outer peripheral edge of the wafer holder such that when the suction portion is covered and sealed by the tape, the wafer holder is held at the suction unit and the wafer is held at the holding surface.
摘要翻译： 一种晶片保持机构，用于利用吸力将带有胶带的胶片固定在框架上。 晶片保持机构包括抽吸体，具有用于通过带保持晶片的保持表面的晶片保持器和具有设置在晶片保持器的外周边缘处的抽吸部分的抽吸单元。 抽吸部分穿过保持表面穿过晶片保持器的外周边缘传递吸力，使得当吸引部分被带覆盖和密封时，晶片保持器被保持在抽吸单元处，并且晶片保持在 保持表面。
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公开(公告)号：US20080299745A1
公开(公告)日：2008-12-04
申请号：US12110839
申请日：2008-04-28
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： H01L21/268 , H01L21/00
CPC分类号： H01L21/78 , B23K26/40 , B23K2101/40 , B23K2103/172 , B23K2103/50 , B28D5/0011 , B28D5/023
摘要： A wafer separating method including a laminated member removing step for partially removing a laminated member of a wafer along streets by applying a laser beam to the wafer along the streets, and a cutting step for cutting a substrate of the wafer along the streets after the laminated member removing step. The laminated member removing step includes a first laser processing step for applying a first laser beam along two parallel lines spaced apart from each other in each street, the first laser beam being capable of passing through the laminated member and having an absorption wavelength to the substrate, thereby heating the substrate to generate two cracks in the laminated member by thermal shock so that the two cracks extend along the two parallel lines in each street; and a second laser processing step for applying a second laser beam to a region between the two cracks in the laminated member, the second laser beam having an energy density higher than that of the first laser beam, thereby removing the region between the two cracks in the laminated member to expose the substrate along each street.
摘要翻译： 一种晶片分离方法，包括：通过沿着街道向晶片施加激光而沿着街道部分地去除晶片的层叠构件的层叠构件去除步骤，以及在层叠之后沿着街道切割晶片的基板的切割步骤 成员删除步骤。 层叠构件除去步骤包括：第一激光加工步骤，用于沿着每个街道彼此间隔开的两条平行线施加第一激光束，第一激光束能够穿过层叠构件并具有到基板的吸收波长 从而加热基板，通过热冲击在层压部件中产生两个裂缝，使得两条裂缝沿着每条街道的两条平行线延伸; 以及第二激光加工步骤，用于将第二激光束施加到层叠部件中的两个裂纹之间的区域，第二激光束的能量密度高于第一激光束的能量密度，从而去除了两个裂纹之间的区域 层叠构件沿着每条街道露出基板。
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公开(公告)号：US07408129B2
公开(公告)日：2008-08-05
申请号：US11593045
申请日：2006-11-06
CPC分类号： B23K26/0736 , B23K26/0853 , B23K26/364 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置， 用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直 朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。
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公开(公告)号：US20080179302A1
公开(公告)日：2008-07-31
申请号：US12007267
申请日：2008-01-08
申请人： Hiroshi Morikazu
发明人： Hiroshi Morikazu
IPC分类号： B23K26/38
CPC分类号： B23K26/0734 , B23K26/40 , B23K2103/50 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a via hole reaching a bonding pad in a wafer having a plurality of devices on the front surface of a substrate and bonding pads formed on each of the devices by applying a pulse laser beam from the rear surface side of the substrate, wherein when a pulse laser beam having a spot diameter which satisfies D/2≦d≦D−2 μm (wherein a diameter of the via hole to be formed is represented as D and a spot diameter of the pulse laser beam is represented as d) is applied in such a manner that the periphery of the spot moves along the inner circumference of the via hole to be formed, the pulse laser beam is applied at an angle of 120 to 180° from the previous application position.
摘要翻译： 一种通过从衬底的背面侧施加脉冲激光而形成在基板前表面上具有多个器件的晶片中的通孔到达每个器件上形成的接合焊盘的方法， 其中当具有满足D / 2 <= d <= D-2μm的点直径的脉冲激光束（其中要形成的通孔的直径表示为D并且表示脉冲激光束的光点直径 如d）所示的方式使得点的周边沿着要形成的通孔的内圆周移动，脉冲激光束以与先前的施加位置成120-180°的角度施加。
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公开(公告)号：US20080076256A1
公开(公告)日：2008-03-27
申请号：US11902046
申请日：2007-09-18
申请人： Akihito Kawai , Takashi Ono , Hiroshi Morikazu
发明人： Akihito Kawai , Takashi Ono , Hiroshi Morikazu
IPC分类号： H01L21/311
CPC分类号： H01L21/3065 , B23K26/389 , B24B7/228 , H01L21/02057 , H01L21/76898
摘要： A method of forming a via hole reaching a bonding pad in a wafer, which have a plurality of devices on the front surface of a substrate and bonding pads on each of the devices, by applying a pulse laser beam from the rear surface of the substrate, comprising the steps of:affixing a protective member to the front surface of the substrate;grinding the rear surface of the substrate having the protective member affixed to the front surface to reduce the thickness of the wafer to a predetermined value;forming via holes in the substrate by applying a pulse laser beam from the rear surface of the substrate of the wafer having the predetermined thickness; andetching the wafer having the via holes in the substrate from the rear surface of the substrate.
摘要翻译： 一种通过从衬底的后表面施加脉冲激光束，形成通孔到达衬底的接合焊盘的方法，该通孔在衬底的前表面上具有多个器件和每个器件上的接合焊盘 包括以下步骤：将保护构件固定在基板的前表面上; 研磨具有固定在前表面的保护构件的基板的后表面，以将晶片的厚度减小到预定值; 通过从具有预定厚度的晶片的衬底的后表面施加脉冲激光束，在衬底中形成通孔; 并且从衬底的后表面蚀刻在衬底中具有通孔的晶片。
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公开(公告)号：US20080029715A1
公开(公告)日：2008-02-07
申请号：US11878909
申请日：2007-07-27
申请人： Hiroshi Morikazu , Eri Kawagishi
发明人： Hiroshi Morikazu , Eri Kawagishi
IPC分类号： G01N23/00
CPC分类号： B23K26/0853 , B23K26/04 , B23K26/043 , B23K26/044 , B23K26/0626 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67294 , H01L21/682
摘要： An alignment method of a laser beam processing machine comprising a chuck table, a laser beam application means having a condenser for applying a laser beam to the workpiece held on the chuck table, an image pick-up means for picking up an image of the workpiece held on the chuck table and a control means having a memory for storing the specifications of the workpiece, the method comprising the steps of storing the design coordinates of a processing position set based on the mark indicating the crystal orientation of a wafer and alignment marks; picking up an image of the periphery of the wafer with the image pick-up means and locating the mark indicating the crystal orientation of the wafer at a predetermined position; positioning the design coordinate position of each of the alignment marks set based on the mark indicating the crystal orientation of the wafer right below the condenser and applying a laser beam from the condenser so as to remove the insulating film in the alignment mark areas; and picking up an image of the alignment marks with the image pick-up means and adjusting the coordinates of the processing position of the wafer on the chuck table based on the image of the alignment marks.
摘要翻译： 一种激光束处理机的对准方法，包括：卡盘台，具有用于将激光束施加到保持在卡盘台上的工件的聚光器的激光束施加装置，用于拾取工件图像的图像拾取装置 保持在卡盘台上的控制装置和具有用于存储工件规格的存储器的控制装置，该方法包括以下步骤：基于指示晶片的晶体取向的标记和对准标记来存储设置的处理位置的设计坐标; 用图像拾取装置拾取晶片周边的图像，并将指示晶片的晶体取向的标记定位在预定位置; 将基于指示晶片的晶体取向的标记设置在冷凝器正下方并将来自冷凝器的激光束设置的每个对准标记的设计坐标位置定位，以便去除对准标记区域中的绝缘膜; 并且利用图像拾取装置拾取对准标记的图像，并且基于对准标记的图像调整卡盘台上的晶片的处理位置的坐标。
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公开(公告)号：US20080020548A1
公开(公告)日：2008-01-24
申请号：US11826911
申请日：2007-07-19
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K26/0622 , B23K26/40 , B23K2103/50
摘要： A wafer laser processing method for forming grooves along streets by applying a pulse laser beam along the streets for sectioning a plurality of devices of a wafer having the plurality of devices which are composed of a laminate consisting of an insulating film and a functional film, on the front surface of a substrate, wherein the pulse laser beam is set to have a repetition frequency of 150 kHz to 100 MHz and an energy per unit length of 5 to 25 J/m.
摘要翻译： 一种晶片激光加工方法，用于沿着街道施加脉冲激光束，沿着街道形成沟槽，用于将由具有由绝缘膜和功能膜构成的层叠体构成的多个器件的晶片的多个器件分隔开， 衬底的前表面，其中脉冲激光束被设置为具有150kHz至100MHz的重复频率和5至25J / m的每单位长度的能量。
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公开(公告)号：US20070235430A1
公开(公告)日：2007-10-11
申请号：US11783190
申请日：2007-04-06
申请人： Ryugo Oba , Hiroshi Morikazu
发明人： Ryugo Oba , Hiroshi Morikazu
CPC分类号： B23K26/0853 , B23K26/0736
摘要： A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis as the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal spot should follow along the processing line based on the X, Y coordinate values of the detected current position and the X, Y coordinate values of the processing line stored in the storage means.
摘要翻译： 一种激光束处理机，包括用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，加工进给装置，分度供给装置，用于检测进给量的加工进给量检测装置 ，分度供给量检测装置和控制装置，其中构成激光束施加装置的电容器包括用于将焦点形成为椭圆形的椭圆点形成装置和用于转动椭圆焦点的焦斑转动装置 在光轴上作为其中心; 并且所述控制装置包括用于存储在所述工件上形成的处理线的X，Y坐标值的存储装置，基于来自所述处理对象的检测信号，获得所述激光束施加位置的当前位置的X，Y坐标值， 进给量检测装置和分度供给量检测装置，并且控制焦点转动装置，以基于检测到的当前位置的X，Y坐标值，确保焦斑的长轴沿着处理线跟随， 存储在存储装置中的处理线的X，Y坐标值。
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公开(公告)号：US20070138156A1
公开(公告)日：2007-06-21
申请号：US11635539
申请日：2006-12-08
申请人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
发明人： Keiji Nomaru , Yasuomi Kaneuchi , Hiroshi Morikazu
IPC分类号： B23K26/06
CPC分类号： B23K26/0869 , B23K26/082 , B23K26/0853 , B23K2101/40
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, a processing-feed means for moving the chuck table and the laser beam application means relative to each other in a processing-feed direction (X-axis direction), and an indexing-feed means for moving the chuck table and the laser beam application means relative to each other in an indexing-feed direction (Y-axis direction) perpendicular to the processing-feed direction (X-axis direction), wherein the laser beam application means comprises a laser oscillation means for oscillating a laser beam, a first acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the processing-feed direction (X-axis direction), and a second acousto-optic deflection means for deflecting the optical axis of a laser beam oscillated by the laser beam oscillation means in the indexing-feed direction (Y-axis direction).
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台，用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，用于使卡盘台和激光束施加装置相对移动的加工进给装置 （X轴方向）彼此相对移动夹具台和激光束施加机构的分度供给机构，使其相对于彼此垂直的分度方向（Y轴方向）相对移动 到处理供给方向（X轴方向），其中激光束施加装置包括用于振荡激光束的激光振荡装置，用于偏转激光振荡的激光束的光轴的第一声光偏转装置 光束振荡意味着处理进给方向（X轴方向），以及用于偏转由激光束振荡振荡的激光束的光轴的第二声光偏转装置 意味着分度进给方向（Y轴方向）。
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公开(公告)号：US20070109526A1
公开(公告)日：2007-05-17
申请号：US11593045
申请日：2006-11-06
CPC分类号： B23K26/0736 , B23K26/0853 , B23K26/364 , B23K26/382 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A laser beam processing machine comprising a chuck table for holding a workpiece and a laser beam application means for applying a laser beam to the workpiece held on the chuck table, the laser beam application means comprising a laser beam oscillation means for oscillating a laser beam and a condenser for converging the laser beam oscillated by the laser beam oscillation means, wherein the condenser comprises a first cylindrical lens unit having a first cylindrical lens, a second cylindrical lens unit having a second cylindrical lens which is positioned such that its converging direction becomes perpendicular to the converging direction of the first cylindrical lens, and an interval adjustment mechanism for adjusting the interval between the first cylindrical lens unit and the second cylindrical lens unit.
摘要翻译： 一种激光束处理机，包括用于保持工件的卡盘台和用于将激光束施加到保持在卡盘台上的工件的激光束施加装置，所述激光束施加装置包括用于振荡激光束的激光束振荡装置， 用于会聚由激光束振荡装置振荡的激光束的聚光器，其中所述聚光器包括具有第一柱面透镜的第一柱面透镜单元，具有第二柱面透镜的第二柱面透镜单元，所述第二柱面透镜单元被定位使得其会聚方向变为垂直 朝向第一柱面透镜的会聚方向，以及间隔调整机构，用于调整第一柱面透镜单元与第二柱面透镜单元之间的间隔。
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