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    Polishing apparatus including detachable cloth cartridge
    12.
    发明授权
    Polishing apparatus including detachable cloth cartridge 失效
    抛光装置包括可拆卸的布料筒

    公开(公告)号：US5679064A

    公开(公告)日：1997-10-21

    申请号：US561024

    申请日：1995-11-21

    申请人： Toyomi Nishi ,  Tamami Takahashi ,  Tetsuji Togawa

    发明人： Toyomi Nishi ,  Tamami Takahashi ,  Tetsuji Togawa

    IPC分类号： B24B37/20 ,  B24B37/22 ,  B24B7/04 ,  B24B29/02

    CPC分类号： B24B37/14 ,  B24B37/015

    摘要： A polishing apparatus includes a light weight and easily interchangeable cloth cartridge of high deformation resistance. The cloth cartridge is made by bonding a polishing cloth to a cartridge base member which includes a honeycomb structure member which can be sandwiched between top and bottom aluminum thin plates. Honeycomb structure member of various cell sizes and materials available in the marketplace can be used for this purpose quite effectively. The honeycomb structure members made of an aluminum material provides a stiff and thermally resistant cartridge base member. Cell spaces in the honeycomb structure member can be cooled or heated, depending on a nature of the polishing slurry used, by passing an appropriate fluid through the base member. This is made possible by providing flow holes in the cell walls separating the honeycomb cells. This approach is effective in producing optimum polishing performance by the cloth cartridge. Thermal control can be exercised generally or locally, depending on where heat is needed or should be removed.

    摘要翻译： 抛光装置包括具有高变形阻力的重量轻且易于互换的布料盒。 布料筒通过将抛光布粘结到包括蜂窝状结构件的盒基部件上而制成，所述蜂窝结构件可夹在顶部和底部铝薄板之间。 市场上可用的各种电池尺寸和材料的蜂窝结构件可以非常有效地用于此目的。 由铝材料制成的蜂窝结构构件提供了坚硬和耐热的筒基座构件。 根据所使用的研磨浆料的性质，通过使适当的流体通过基底部件，蜂窝结构体中的细胞空间可被冷却或加热。 这可以通过在分离蜂窝单元的单元壁中提供流动孔来实现。 这种方法在通过布料盒产生最佳抛光性能方面是有效的。 通常或局部地可以进行热控制，这取决于需要或应该去除热量的地方。

    Polishing apparatus
    13.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5645473A

    公开(公告)日：1997-07-08

    申请号：US621790

    申请日：1996-03-28

    申请人： Tetsuji Togawa ,  Toyomi Nishi

    发明人： Tetsuji Togawa ,  Toyomi Nishi

    IPC分类号： B24B37/00 ,  B24B37/10 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B37/107

    摘要： A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a reduced height compared with conventional polishing apparatuses. The height reduction is achieved by disposing a drive motor for rotating a top ring below a turntable, and by making a swing shaft for loading/unloading of the workpiece hollow to accommodate a rotating shaft for transmitting rotation from the motor to the top ring.

    摘要翻译： 用于抛光诸如半导体晶片的工件的抛光装置与常规抛光装置相比具有降低的高度。 降低高度是通过设置用于将顶环旋转到转盘下方的驱动马达，并且通过制造用于装载/卸载工件中空的摆动轴来容纳用于将旋转从马达传递到顶部环的旋转轴来实现的。

    Polishing apparatus
    15.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US06139677A

    公开(公告)日：2000-10-31

    申请号：US787916

    申请日：1997-01-23

    申请人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

    发明人： Tetsuji Togawa ,  Seiji Katsuoka ,  Norio Kimura ,  Toyomi Nishi

    IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B55/04 ,  C23F1/02

    CPC分类号： B24B53/017 ,  B24B55/045

    摘要： A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

    摘要翻译： 抛光装置70用于通过化学抛光和机械抛光的组合将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括：转台73，其上表面安装有抛光74布;顶环75，用于支撑待抛光的工件并将工件压靠在抛光布上;以及修整工具79，用于将抛光布修整在 转盘。 抛光装置还包括覆盖转台上表面以防止转台上的液体散落的盖10，以及形成在盖的上壁中的插入孔17和21，用于将顶环和修整工具穿过其中 。

    Polishing apparatus
    16.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5931723A

    公开(公告)日：1999-08-03

    申请号：US864905

    申请日：1997-05-29

    申请人： Seiji Katsuoka ,  Toyomi Nishi ,  Tetsuji Togawa

    发明人： Seiji Katsuoka ,  Toyomi Nishi ,  Tetsuji Togawa

    IPC分类号： H01L21/302 ,  B08B15/02 ,  B24B55/12 ,  H01L21/02 ,  H01L21/304 ,  H01L21/3065 ,  B24B1/00

    CPC分类号： B24B37/105 ,  B08B15/02 ,  B24B55/12

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an exhaust device for exhausting air in the polishing apparatus. The polishing apparatus includes a housing, a polishing section housed in the housing for polishing a workpiece, a cleaning section housed in the housing for cleaning the workpiece which has been polished, and a base comprising a plurality of structural members for supporting at least one device in at least one of the cleaning section and the polishing section. At least one of the structural members has a fluid passage therein and intake openings to serve as an exhaust duct. The polishing apparatus further comprises a main exhaust duct communicating with the exhaust duct and extending to an exterior of the housing for exhausting air introduced in the exhaust duct.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置具有用于在抛光装置中排出空气的排气装置。 抛光装置包括壳体，容纳在用于抛光工件的壳体中的抛光部分，容纳在壳体中用于清洁已经被抛光的工件的清洁部分，以及包括多个结构部件的基部，用于支撑至少一个装置 在清洁部分和抛光部分中的至少一个中。 结构构件中的至少一个具有其中的流体通道和用作排气管的进气口。 抛光装置还包括与排气管道连通并延伸到壳体的外部的主排气管道，用于排出引入排气管道中的空气。

    Polishing apparatus
    17.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5860847A

    公开(公告)日：1999-01-19

    申请号：US708948

    申请日：1996-09-06

    申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Toyomi Nishi ,  Seiji Katsuoka ,  Hiromi Yajima ,  Masako Kodera

    发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Toyomi Nishi ,  Seiji Katsuoka ,  Hiromi Yajima ,  Masako Kodera

    IPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/04 ,  B24B49/16 ,  H01L21/66 ,  B24B49/00

    CPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/04 ,  B24B49/16 ,  H01L22/26

    摘要： A polishing apparatus has a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring disposed above the turntable for supporting a workpiece to be polished against the abrasive cloth under predetermined pressure. The turntable is rotatable by a first motor through a timing pulley connected to the first motor, and the top ring is rotatable by a second motor through a timing pulley connected to the second motor. A torque detector incorporated in the timing pulley connected to at least one of the first motor and the second motor detects an output torque produced by the at least one of the first motor and the second motor.

    摘要翻译： 抛光装置具有安装在其上表面上的研磨布的转台和设置在转盘上方的顶环，用于在预定压力下将待抛光的工件支撑在磨料上。 转盘可以通过连接到第一马达的定时皮带由第一马达旋转，并且顶环可以通过连接到第二马达的定时皮带的第二马达转动。 并入到与第一电动机和第二电动机中的至少一个连接的正时轮中的转矩检测器检测由第一电动机和第二电动机中的至少一个产生的输出转矩。

    Polishing apparatus
    18.
    发明授权
    Polishing apparatus 失效
    抛光设备

    公开(公告)号：US5839947A

    公开(公告)日：1998-11-24

    申请号：US795511

    申请日：1997-02-05

    申请人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

    发明人： Norio Kimura ,  Kunihiko Sakurai ,  Tetsuji Togawa ,  Seiji Katsuoka ,  Toyomi Nishi

    IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B53/017

    摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.

    摘要翻译： 抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。 抛光装置包括其上具有抛光表面的转台，用于保持要抛光的工件的顶环，并将工件压靠在抛光表面上，该抛光表面可在转盘内部的抛光位置和位于转盘外部的待机位置之间移动 转盘和用于在顶环处于待机位置时保持顶环的至少下表面湿润的第一装置。 抛光装置还包括用于修整转台上的抛光表面的修整工具，以及用于在修整工具处于待机位置时保持敷料工具的至少下表面湿润的第二装置。

    Polishing facility
    19.
    发明授权
    Polishing facility 失效
    抛光设备

    公开(公告)号：US5827110A

    公开(公告)日：1998-10-27

    申请号：US580312

    申请日：1995-12-28

    申请人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

    发明人： Hiromi Yajima ,  Yukio Imoto ,  Shoichi Kodama ,  Riichiro Aoki ,  Takashi Omichi ,  Toyomi Nishi ,  Tetsuji Togawa

    IPC分类号： B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  B24B7/22

    CPC分类号： B24B37/345 ,  B08B1/04 ,  B24B27/0023 ,  B24B37/04 ,  B24B51/00 ,  B24B55/12 ,  H01L21/67028 ,  H01L21/67057

    摘要： A polishing facility integrates separate components of polishing such as wafer transport, polishing, cleaning and drying in one standardized facility to provide efficient polishing operation at low cost. The facility is designed to deal with a variety of different types of wafers, including different types of surface film, and is designed also to enables quick and low cost upgrading of the facility to meet advancing requirements of customers. The polishing facility can be placed within a cleanroom to provide efficient handling of polished wafers for further processing and fabrication tasks. Individual work component of polishing is arranged in one block having its own power supply and signal lines, and is controlled by a central controller having a dedicated software program for each work component. Therefore, if upgrading of the facility is required on any work component, only that work component requiring attention needs to be repaired/replaced, thus eliminating the need to shut down the entire facility as in conventional polishing setups. Each work component is modularized for easy replacement and inventory purposes. The overall effect of the integrated polishing facility is that the efficiency of the polishing operation is significantly improved at minimal cost of labor and capital investments.

    摘要翻译： 抛光设备将单独的抛光部件如晶片输送，抛光，清洁和干燥在一个标准化设备中进行集成，以低成本提供有效的抛光操作。 该设施旨在处理各种不同类型的晶片，包括不同类型的表面膜，并且还被设计成能够实现设备的快速和低成本升级以满足客户的前进要求。 抛光设备可以放置在洁净室内，以提供抛光晶片的有效处理以进一步处理和制造任务。 抛光的单个工作部件布置在具有其自己的电源和信号线的一个块中，并且由具有用于每个工作部件的专用软件程序的中央控制器控制。 因此，如果需要在任何工作部件上升级设备，只需要修理/更换需要注意的工作部件，从而无需像传统的抛光设备那样关闭整个设备。 每个工作组件都是模块化的，以便于更换和库存目的。 综合抛光设备的整体效果是以最低的劳动成本和资金投入，大大提高了抛光操作的效率。