公开(公告)号：US20140329341A1

公开(公告)日：2014-11-06

申请号：US14254966

申请日：2014-04-17

Applicant: Tokyo Electron Limited

Inventor： Goro Furutani ,  Norio Wada ,  Satoshi Ookawa

IPC: H01L21/66 ,  H01L21/67

CPC classification number: H01L21/67092 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  Y10T156/1744

Abstract: A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.

Abstract translation: 根据本公开的示例性实施例的接合方法包括第一保持处理，第二保持处理，临时接合处理，升温处理和主接合处理。 在第一保持处理中，保持目标基板。 在第二保持处理中，通过静电吸附保持的玻璃基板。 在临时接合处理中，目标基板和玻璃基板在比预定温度低的温度下以比预定的按压力低的按压力暂时接合。 在升温处理中，在暂时接合的同时或之后释放玻璃基​​板的静电吸附的同时，将温度升高至规定温度。 在主接合处理中，以预定的按压力进行目标基板和玻璃基板的主要接合。

公开(公告)号：US11894246B2

公开(公告)日：2024-02-06

申请号：US17816810

申请日：2022-08-02

Applicant: Tokyo Electron Limited

Inventor： Norio Wada ,  Shintaro Sugihara

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01L21/67092 ,  H01L21/6838 ,  H01L21/68742 ,  B32B43/006 ,  Y10T156/1132 ,  Y10T156/1179 ,  Y10T156/1944 ,  Y10T156/1983

Abstract: A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.

公开(公告)号：US11482431B2

公开(公告)日：2022-10-25

申请号：US16964008

申请日：2019-01-11

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

公开(公告)号：US09005385B2

公开(公告)日：2015-04-14

申请号：US14250061

申请日：2014-04-10

Applicant: Tokyo Electron Limited

Inventor： Norio Wada ,  Goro Furutani ,  Satoshi Ookawa

IPC: B32B37/06 ,  H01L21/67 ,  B30B15/06 ,  B32B37/08 ,  B30B13/00 ,  B32B37/10 ,  B30B15/34

CPC classification number: H01L21/67092 ,  B30B13/00 ,  B30B15/064 ,  B30B15/34 ,  B32B37/06 ,  B32B37/08 ,  B32B37/1009

Abstract: A bonding apparatus according to an exemplary embodiment of the present disclosure includes a first holding unit, a second holding unit, a first cooling mechanism, a second cooling mechanism, a third heating mechanism and a fourth heating mechanism. The first holding unit has a first heating mechanism and holds a first substrate. The second holding unit has a second heating mechanism and holds a second substrate. The pressing mechanism contacts and presses the first substrate and the second substrate. The first cooling mechanism cools the first substrate through the first holding unit. The second cooling mechanism cools the second substrate through the second holding unit. The third heating mechanism heats the first cooling mechanism. The fourth heating mechanism heats the second cooling mechanism.

Abstract translation: 根据本公开的示例性实施例的接合装置包括第一保持单元，第二保持单元，第一冷却机构，第二冷却机构，第三加热机构和第四加热机构。 第一保持单元具有第一加热机构并保持第一基板。 第二保持单元具有第二加热机构并保持第二基板。 按压机构接触并按压第一基板和第二基板。 第一冷却机构通过第一保持单元冷却第一基板。 第二冷却机构通过第二保持单元冷却第二基板。 第三加热机构加热第一冷却机构。 第四加热机构加热第二冷却机构。