公开(公告)号：US10062586B2

公开(公告)日：2018-08-28

申请号：US14338656

申请日：2014-07-23

Applicant: Tokyo Electron Limited

Inventor： Derek W Bassett ,  Wallace P Printz ,  Gentaro Goshi ,  Hisashi Kawano ,  Yoshihiro Kai

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/3213

CPC classification number: H01L21/6708 ,  H01L21/30604 ,  H01L21/32134

Abstract: A chemical fluid processing apparatus and a chemical fluid processing method are described, to treat a substrate with a plurality of chemical fluids such that substantially constant temperature is maintained across a substrate surface. The apparatus includes a discharge nozzle above the substrate to supply a first chemical fluid at a first temperature to a front surface of the substrate, a bar nozzle oriented in a radial direction of the substrate to supply a second chemical fluid at a second temperature to the front surface or a back surface of the substrate, the second temperature being higher than the first temperature, and where the bar nozzle includes a plurality of outlets for discharging the second chemical fluid to a plurality of contacting places on the front surface or the back surface of the substrate at different distances from the center of the substrate.

公开(公告)号：US12183613B2

公开(公告)日：2024-12-31

申请号：US17061967

申请日：2020-10-02

Applicant: Tokyo Electron Limited

Inventor： Kouzou Kanagawa ,  Kotaro Tsurusaki ,  Keiji Onzuka ,  Yoshihiro Kai

IPC: H01L21/677 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a loading/unloading part into/from which a cassette that accommodates a plurality of substrates is loaded/unloaded; a batch-type processing part configured to collectively process a lot including the plurality of substrates; a single-substrate-type processing part configured to the plurality of substrates of the lot one by one; and an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part, wherein the loading/unloading part, the single-substrate-type processing part, the interface part, and the batch-type processing part are arranged in this order, and wherein the interface part comprises a lot formation part configured to form the lot, and a transfer part configured to transfer the plurality of substrates from the single-substrate-type processing part to the lot formation part, and configured to transfer the plurality of substrates from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US11978644B2

公开(公告)日：2024-05-07

申请号：US17886687

申请日：2022-08-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou Kanagawa ,  Kotaro Tsurusaki ,  Keiji Onzuka ,  Yoshihiro Kai

IPC: H01L21/56 ,  H01L21/02

CPC classification number: H01L21/561 ,  H01L21/02101

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US11887871B2

公开(公告)日：2024-01-30

申请号：US16942018

申请日：2020-07-29

Applicant: Tokyo Electron Limited

Inventor： Kazushige Sano ,  Yuichi Tanaka ,  Yoshihiro Kai

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67086 ,  H01L21/67057 ,  H01L21/67248 ,  H01L22/30

Abstract: A substrate processing apparatus includes a processing tub configured to store therein a processing liquid in which multiple substrates are to be immersed; multiple liquid supplies each of which includes a supply line through which the processing liquid is supplied to an inside of a water tank of the processing tub and a heating device configured to heat the processing liquid at a portion of the supply line; and multiple in-tank temperature sensors configured to measure a temperature of the processing liquid at multiple positions within the water tank of the processing tub.

公开(公告)号：US20190279884A1

公开(公告)日：2019-09-12

申请号：US16299371

申请日：2019-03-12

Applicant: Tokyo Electron Limited

Inventor： Koji Yamashita ,  Yoshihiro Kai

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677

Abstract: A drying fluid can be uniformly supplied to a substrate. A substrate drying apparatus includes a processing chamber and a cover unit. The processing chamber is provided with an opening through which the substrate is carried in and out. The cover unit is configured to open or close the opening. Further, the cover unit includes a diffusion space and a rectifying member. The diffusion space is configured to diffuse a drying fluid therein. The rectifying member is configured to rectify a flow of the drying fluid diffused in the diffusion space and allow the rectified drying fluid to be flown out into the processing chamber from the diffusion space.

公开(公告)号：US20180337067A1

公开(公告)日：2018-11-22

申请号：US15777941

申请日：2016-11-17

Applicant: Tokyo Electron Limited

Inventor： Kazuki Kosai ,  Yoshihiro Kai ,  Gentaro Goshi ,  Hiroshi Komiya ,  Seiya Fujimoto ,  Takahisa Otsuka

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/687 ,  H01L21/02 ,  B08B3/08 ,  B08B3/04

Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.

公开(公告)号：US20140352730A1

公开(公告)日：2014-12-04

申请号：US14291494

申请日：2014-05-30

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kai ,  Yoshinori Ikeda ,  Kazuyoshi Shinohara ,  Tetsuya Oda ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC: B08B3/02 ,  B05B15/02

CPC classification number: B05B15/555 ,  C03C23/0075 ,  H01L21/67051 ,  H01L21/6715

Abstract: A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.

Abstract translation: 根据本公开的基板处理装置包括将处理液喷射到基板的第一和第二喷嘴; 移动机构，其移动所述第一和第二喷嘴; 以及清洁至少第二喷嘴的喷嘴清洁装置。 喷嘴清洁装置包括清洗槽和溢流槽。 清洗槽包括储存用于清洗第二喷嘴的清洗液的液体储存部分和从液体储存部分排出超过预定水平的清洗液体的溢流部分。 溢流槽设置在清洗槽附近，并接收从溢流部排出的清洗液，并将接收到的清洗液排出到外部。

公开(公告)号：US20140026927A1

公开(公告)日：2014-01-30

申请号：US13941770

申请日：2013-07-15

Applicant: Tokyo Electron Limited

Inventor： Nobuhiro Ogata ,  Terufumi Wakiyama ,  Yoshihiro Kai ,  Ryouga Kamo ,  Yoshinori Ikeda

IPC: B08B3/04

CPC classification number: B08B3/04 ,  H01L21/67051

Abstract: Disclosed are a liquid processing apparatus and a cleaning method which may perform cleaning on a portion which is not in the vicinity of a drain section in an exhaust route. The liquid processing apparatus includes an exhaust section provided in vicinity of the drain section, which is configured to exhaust a surrounding atmosphere of the substrate held by the substrate holding unit; an exhaust route forming member configured to form an exhaust route reaching the exhaust section; and a first cleaning unit configured to supply a cleaning liquid to the exhaust route forming member at the exhaust route side.

Abstract translation: 公开了一种液体处理设备和清洁方法，其可以对排气路径中不在排水区附近的部分进行清洁。 液体处理装置包括设置在排出部附近的排气部，该排气部构造为排出由基板保持单元保持的基板的周围的气氛; 排气路径形成部件，其构成为形成到达排气部的排气路径; 以及构造成在排气路径侧向排气路径形成部件供给清洗液的第一清洗部。

公开(公告)号：US11469114B2

公开(公告)日：2022-10-11

申请号：US17063169

申请日：2020-10-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou Kanagawa ,  Kotaro Tsurusaki ,  Keiji Onzuka ,  Yoshihiro Kai

IPC: H01L21/56 ,  H01L21/02

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US20210035825A1

公开(公告)日：2021-02-04

申请号：US16942018

申请日：2020-07-29

Applicant: Tokyo Electron Limited

Inventor： Kazushige Sano ,  Yuichi Tanaka ,  Yoshihiro Kai

IPC: H01L21/67

Abstract: A substrate processing apparatus includes a processing tub configured to store therein a processing liquid in which multiple substrates are to be immersed; multiple liquid supplies each of which includes a supply line through which the processing liquid is supplied to an inside of a water tank of the processing tub and a heating device configured to heat the processing liquid at a portion of the supply line; and multiple in-tank temperature sensors configured to measure a temperature of the processing liquid at multiple positions within the water tank of the processing tub.