Gypsum board
    17.
    发明授权
    Gypsum board 有权
    石膏板

    公开(公告)号:US08974925B1

    公开(公告)日:2015-03-10

    申请号:US14054620

    申请日:2013-10-15

    Abstract: Described herein is a composite board and a method of producing a composite board, the board having increased fire endurance. The board comprises a sheet having a thickness greater than about 0.014 inches, and a thermal conductivity of about 0.1 w/(m.k.) or less. The composite board can be part of a wall assembly comprising two boards defining an interior cavity, the sheet facing the interior cavity.

    Abstract translation: 这里描述的是复合板和复合板的制造方法,该板具有增加的耐火性能。 该板包括厚度大于约0.014英寸,热导率为约0.1w /(m.k。)或更小的片材。 复合板可以是包括限定内部空腔的两个板的壁组件的一部分,该板面向内部空腔。

    Light weight gypsum board
    20.
    发明授权

    公开(公告)号:US11306028B2

    公开(公告)日:2022-04-19

    申请号:US16521072

    申请日:2019-07-24

    Abstract: This invention provides low dust low density gypsum wallboard products having high total core void volumes, corresponding to low densities in the range of about 10 to 30 pcf. The wallboards have a set gypsum core formed between two substantially parallel cover sheets, the set gypsum core preferably having a total void volume from about 80% to about 92%, and made from a slurry including stucco, pregelatinized starch, and a naphthalenesulfonate dispersant. The combination of the pregelatinized starch and the naphthalenesulfonate dispersant also provides a glue-like effect in binding the set gypsum crystals together. The wallboard formulation, along with small air bubble voids (and water voids) provides dust control during cutting, sawing, routing, snapping, nailing or screwing down, or drilling of the gypsum-containing products. This invention also provides a method of making the low dust low density gypsum products including the introduction of soap foam in an amount sufficient to form a total void volume, including air voids, preferably from about 80% to about 92% in the set gypsum core, corresponding to a set gypsum core density from about 10 pcf to about 30 pcf. The wallboards produced by the method generate significantly less dust during working.

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