公开(公告)号：US5374888A

公开(公告)日：1994-12-20

申请号：US937790

申请日：1992-09-02

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： G01R31/26 ,  G01R1/073 ,  H01L21/66 ,  G01R1/04

CPC分类号： G01R1/07314 ,  Y10S414/141

摘要： A method for positioning and testing an object to be tested wherein the surface of an object to be tested for electrical characteristics is brought into contact with a test probe. The side of the object opposite the surface to be tested is held by a suction device on the end of one of many arms which are attached to a rotating shaft. The object is then transported to a position to bring it into contact with the test probe where testing is performed to determine whether or not the object is faulty. If necessary, the arms are manipulated in an up and down and an in and out direction with respect to the shaft, and the suction device rotated, to maintain the object to be tested in a proper orientation.

摘要翻译： 一种用于定位和测试待测试物体的方法，其中要测试的电气特性的物体的表面与测试探针接触。 与被测试表面相对的物体的侧面由连接到旋转轴的许多臂之一的端部上的抽吸装置保持。 然后将物体运送到一个位置，使其与测试探针接触，测试被执行以确定物体是否有故障。 如果需要，臂相对于轴在上下方向上被操纵，并且抽吸装置旋转，以使待测物体保持正确的方位。

公开(公告)号：USD320361S

公开(公告)日：1991-10-01

申请号：US360754

申请日：1989-06-02

申请人： Wataru Karasawa

设计人： Wataru Karasawa

公开(公告)号：US20080124192A1

公开(公告)日：2008-05-29

申请号：US11793686

申请日：2006-02-28

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： H01L21/677

CPC分类号： H01L21/67379 ,  H01L21/67775

摘要： A relay station (10) has its interior determined as a substrate storing section (10a), and supporting sections (11) for supporting plural semiconductor wafers are formed on facing side walls of the substrate storing section. A substrate processing apparatus-side opening section (12) and a transfer apparatus-side opening section (13) are formed on both sides of the relay station (10), and these opening sections are provided with a substrate processing apparatus-side opening/closing mechanism (14) and a transfer apparatus-side opening/closing mechanism (15). A bottom plane (18) of the relay station (10) has a shape of a FOUP conforming to the SEMI standard and can be placed on a placing table for placing the FOUP.

摘要翻译： 中继站（10）的内部被确定为基板存储部分（10a），并且用于支撑多个半导体晶片的支撑部分（11）形成在基板存储部分的相对的侧壁上。 在中继站（10）的两侧形成有基板处理装置侧开口部（12）和转印装置侧开口部（13），这些开口部设置有基板处理装置侧开闭部（13） 关闭机构（14）和传送装置侧开闭机构（15）。 中继站（10）的底平面（18）具有符合SEMI标准的FOUP的形状，并且可以放置在用于放置FOUP的放置台上。

公开(公告)号：US07133807B2

公开(公告)日：2006-11-07

申请号：US10466787

申请日：2002-01-22

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： G06F17/00

CPC分类号： G05B23/0283 ,  G05B2219/32233 ,  Y02P90/86

摘要： There is provided a system and method for monitoring an apparatus from a remote location. A vendor-side computer obtains operating state data obtained by a monitoring device provided in an apparatus via a communication line, and monitors the operating state of the apparatus from a remote location. Maintenance data at a part replacing time is transmitted from the apparatus, and the vendor-side computer that has received maintenance data calculates an optimal replacement period of a part based on this. The calculated optimal replacement period of each part is sent to a plant. The plant feeds the optimal replacement period back to the operation of the apparatus, so that productivity can be improved.

摘要翻译： 提供了一种用于从远程位置监测装置的系统和方法。 供应商侧计算机通过通信线路获取由设备中提供的监视装置获得的操作状态数据，并从远程位置监视装置的操作状态。 从设备发送部件更换时间的维护数据，并且接收到维护数据的供应商侧计算机基于此计算部件的最佳更换周期。 计算出的每个部件的最佳更换周期都会发送到工厂。 该设备将最佳的更换周期提供给设备的操作，从而可以提高生产率。

公开(公告)号：US20060010087A1

公开(公告)日：2006-01-12

申请号：US10527196

申请日：2003-09-11

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： G06F17/00

CPC分类号： G06Q10/10 ,  G06Q99/00

摘要： A business practitioner who offers a maintenance service for a machine (15) quantifies the productivity of the machine (15) in a predetermined service period (S42). The business practitioner compares the quantified productivity with a predetermined productivity reference, and calculates the difference between them (S43). The business practitioner determines a charge amount for the maintenance service in the service period based on the calculated difference (S45). Due to this, charging is realized which can satisfy both of the user of the machine (15) and the maintenance business practitioner.

摘要翻译： 为机器（15）提供维护服务的商业从业者在预定的使用期限内量化机器（15）的生产率（S42）。 业务人员将量化的生产率与预定的生产率参考进行比较，并计算它们之间的差异（S43）。 业务从业者根据计算出的差异来确定维护服务在服务期间的收费金额（S45）。 由此，实现能够满足机器（15）的用户和维修业务者的充电。

公开(公告)号：US06969620B2

公开(公告)日：2005-11-29

申请号：US10258444

申请日：2001-04-24

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： G01R31/28 ,  G01N21/95 ,  H01L21/66 ,  G01R31/26

CPC分类号： H01L22/20 ,  G01N21/9501 ,  G01N2021/888 ,  H01L22/12

摘要： A device inspection apparatus inspects a plurality of semiconductor devices on an individual device basis. An inspection target sorting part (8) omits an execution of an inspection to be applied to the semiconductor devices according to information which specifies a defective device that has been determined to be defective in a manufacturing process that has been applied to the device.

摘要翻译： 装置检查装置在各个装置的基础上检查多个半导体装置。 检查目标分类部件（8）根据指定在已经被应用于该设备的制造过程中被确定为有缺陷的缺陷设备的信息，省略对半导体器件应用的检查的执行。

公开(公告)号：US5436571A

公开(公告)日：1995-07-25

申请号：US227178

申请日：1994-04-13

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： G01R31/26 ,  G01R1/073 ,  H01L21/66 ,  H01L21/68 ,  G01R1/06

CPC分类号： G01R1/07314 ,  G01R31/2891

摘要： A probing test method including contacting probe of a probe card with pad on an IC chip on a semiconductor wafer, relatively moving each of the probe along the top of each of the pad, and sending test signal to the pad through the probe. Oxide film on the top of each of the pads can be removed by relative motion between each probe and each pad at an area where they are contacted with each other, contact resistance between the probes and the pads can be reduced to a greater extent, and test signal can be more reliable transmitted between the probes and the pads.

摘要翻译： 一种探测测试方法，包括将探针卡的探针与半导体晶片上的IC芯片上的焊盘接触，沿着每个焊盘的顶部相对移动每个探针，并通过探头将测试信号发送到焊盘。 可以通过在每个探针与每个焊盘之间相互接触的区域上的相对运动来去除每个焊盘顶部的氧化物膜，探针和焊盘之间的接触电阻可以更大程度地降低，并且 测试信号可以在探头和焊盘之间传输更可靠。

公开(公告)号：US4985676A

公开(公告)日：1991-01-15

申请号：US312045

申请日：1989-02-17

申请人： Wataru Karasawa

发明人： Wataru Karasawa

IPC分类号： G01R31/28

CPC分类号： G01R31/2831 ,  G01R31/2887 ,  H01L2223/54466

摘要： This invention relates to a method and apparatus for performing a probing test for sequentially testing chips formed on a semiconductor wafer in a matrix form. An area of a chip subjected to the test or a chip excluded from the test on the wafer is preset, the preset-area information is stored, and only chips subjected to to the test are tested on the basis of the sequentially readout preset-area information.

摘要翻译： 本发明涉及一种执行探测测试的方法和装置，用于以矩阵形式依次测试形成在半导体晶片上的芯片。 预先进行了经受测试的芯片的区域或晶片上不包括在外的芯片，存储预置区域信息，并且只有经过测试的芯片才会根据顺序读出的预设区域进行测试 信息。