公开(公告)号：US07169216B2

公开(公告)日：2007-01-30

申请号：US10898282

申请日：2004-07-26

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US5930382A

公开(公告)日：1999-07-27

申请号：US645475

申请日：1996-05-13

申请人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

发明人： Yoko Irie ,  Hideaki Doi ,  Yasuhiko Hara ,  Tadashi Iida ,  Yasuhiro Fujishita ,  Yasuo Nakagawa ,  Takanori Ninomiya

IPC分类号： G01N23/04 ,  G01N21/88 ,  G01N21/956 ,  G01N29/04 ,  G01R31/02 ,  G06T7/00 ,  H05K3/00 ,  G06K9/00 ,  G06K9/32 ,  G06K9/42

CPC分类号： G06T7/0004 ,  G06T2207/10116 ,  G06T2207/20044 ,  G06T2207/30141

摘要： A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.

摘要翻译： 布线图案检查方法包括用X射线照射设置有多层的布线图案的测试对象，获得与叠加在多个层中的布线图案的厚度相对应的可变密度图像信号，所述多个层包括叠加部分 布线图案，从可变密度图像信号中提取与叠加布线图案的数量相对应的多个图像信号的数量，以及比较从表示的图像信号获得的布线图案的终点信息或孤立点信息 从提取的图像信号中获得的表示较少数量的叠加布线图案以检查布线图案中的布线图案中的缺陷的叠加布线图案的数量以及关于布线点上的端点或隔离点的分支信息。 布线图形检查方法由布线图形检查系统进行。

公开(公告)号：US08008393B2

公开(公告)日：2011-08-30

申请号：US12232576

申请日：2008-09-19

申请人： Tadashi Iida ,  Yoshizumi Matsuno ,  Yasushi Nakao

发明人： Tadashi Iida ,  Yoshizumi Matsuno ,  Yasushi Nakao

IPC分类号： C08L33/00

CPC分类号： C09D133/06 ,  B05D7/532 ,  C08G65/3322 ,  C08L33/06 ,  C08L33/062 ,  C08L33/064 ,  C08L67/00 ,  C09D5/36 ,  C09D133/066 ,  C09D167/00 ,  Y10T428/254 ,  C08L2666/04 ,  C08L2666/18

摘要： This invention provides an automobile water-based paint capable of forming coating film of little metallic mottling and excellent flip-flop property and smoothness, which comprises hydroxyl-containing resin, viscosity-regulating agent and hydrophobic solvent, the viscosity-regulating agent being a copolymer obtained by copolymerizing a monomeric mixture containing a (meth)acrylic acid (salt), monomer represented by the following formula (1) [in which R1 stands for hydrogen or methyl, R2 and R3 stand for hydrogen, methyl or ethyl, R4 stands for C8-24 hydrocarbon group, and n is an integer of 3-60], alkyl (meth)acrylate of which alkyl moiety has 1-4 carbons and a monomer having at least two polymerizable unsaturated groups per molecule, at specific ratios.

摘要翻译： 本发明提供一种汽车水性涂料，其能够形成少量金属斑点和优异的触发性和平滑性的涂膜，其包含含羟基的树脂，粘度调节剂和疏水性溶剂，粘度调节剂为共聚物 通过共聚含有（甲基）丙烯酸（盐）的单体混合物，由下式（1）表示的单体[其中R1代表氢或甲基，R2和R3代表氢，甲基或乙基，R4代表 C8-24烃基，n为3-60的整数），烷基部分为1-4个碳原子的（甲基）丙烯酸烷基酯和每分子具有至少两个可聚合不饱和基团的单体。

公开(公告)号：US20100322506A1

公开(公告)日：2010-12-23

申请号：US12819514

申请日：2010-06-21

申请人： Yoshinori MURAMATSU ,  Ryoji Shiwaku ,  Tadashi Iida

发明人： Yoshinori MURAMATSU ,  Ryoji Shiwaku ,  Tadashi Iida

IPC分类号： G06K9/00

CPC分类号： G06T7/001 ,  G06T2207/10056 ,  G06T2207/30141

摘要： An inspection system is disclosed, which inspects a wiring pattern on a high multilayer printed wiring board while determining a calibration position with a smaller number of error reports, and predicts the verification work time by evaluating the inspection property. Based on the CAD data of each layer of the printed wiring board to be inspected and the layer structure information, an intensity composition map viewed through the inspection surface is generated. A plurality of sets of the intensity components of the inspection surface are determined, and after determining at least one intensity evaluation region covering all the sets, the intensity evaluation region is imaged by an inspection unit and the statistical intensity value corresponding to each intensity component is determined and substituted into the intensity composition map. The inspection is conducted by determining the optimal calibration position for determining an inspection threshold value in this way.

摘要翻译： 公开了一种检查系统，其在通过较少数量的错误报告确定校准位置的同时检查高多层印刷线路板上的布线图案，并且通过评估检查性能来预测验证工作时间。 基于要检查的印刷线路板的各层的CAD数据和层结构信息，生成通过检查面观察的强度组成图。 确定检查表面的多组强度分量，并且在确定了覆盖所有集合的至少一个强度评估区域之后，通过检查单元对强度评估区域进行成像，并且对应于每个强度分量的统计强度值为 确定并代入强度组成图。 通过以这种方式确定用于确定检查阈值的最佳校准位置来进行检查。

公开(公告)号：US06989329B2

公开(公告)日：2006-01-24

申请号：US10959073

申请日：2004-10-07

申请人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： H01L21/44

CPC分类号： C23C18/40 ,  H05K3/421 ,  H05K3/422 ,  H05K3/426 ,  H05K3/429 ,  H05K2201/09518

摘要： A multilayer wiring substrate which is high in connection reliability is provided through process steps of forming more than one opening, such as a via-hole in a dielectric layer laminated on a substrate, and then applying uniform copper plating to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative process makes use of an electroless copper plating solution with chosen additives or “admixtures” containing at least on of mandelonitrile and triethyltetramine plus eriochrome block T along with at least one of 2,2′-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline

摘要翻译： 通过在层叠在基板上的电介质层中形成多个开口（例如通孔），然后对电介质的表面部分施加均匀的镀铜，通过工艺步骤提供连接可靠性高的多层布线基板 层，从而形成布线层。 使用其中混合有扁桃腈和三乙基四胺中的至少一种的无电镀铜溶液进行预期的无电镀铜。 一种替代方法利用含有至少含有扁桃腈和三乙基四胺加色团块T的选择的添加剂或“混合物”的化学镀铜溶液以及至少一种2,2'-联吡啶，1,10-菲咯啉和 2,9-二甲基-1,10-菲咯啉

公开(公告)号：US20050079280A1

公开(公告)日：2005-04-14

申请号：US10898282

申请日：2004-07-26

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： C23C18/40 ,  C23C28/02 ,  C25D7/00 ,  H05K3/18 ,  C23C16/00

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US06805915B2

公开(公告)日：2004-10-19

申请号：US10076536

申请日：2002-02-19

申请人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

发明人： Takeyuki Itabashi ,  Hiroshi Kanemoto ,  Haruo Akahoshi ,  Eiji Takai ,  Naoki Nishimura ,  Tadashi Iida ,  Yoshinori Ueda

IPC分类号： B05D118

CPC分类号： C23C18/1803 ,  C23C18/1653 ,  C23C18/40

摘要： An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

摘要翻译： 使用乙醛酸作为还原剂的化学镀铜溶液，其在Cannizzaro反应的反应量较小时，不会通过电镀反应和Cannizzaro反应极大地引起积存在无电镀铜溶液中的盐的沉淀，并且可以 长时间稳定使用。 无电镀铜液包括铜离子，铜离子络合剂，铜离子还原剂和pH调节剂，其中铜离子还原剂为乙醛酸或其盐，pH调节剂为氢氧化钾 化学镀铜溶液含有选自硅酸，偏硅酸盐，二氧化锗，锗酸盐，磷酸，磷酸盐，钒酸，钒酸盐，锡酸和锡酸盐中的至少一种， 为0.0001mol / L以上。

公开(公告)号：US5754621A

公开(公告)日：1998-05-19

申请号：US769218

申请日：1996-12-18

申请人： Yoko Suzuki ,  Hideaki Doi ,  Yasuhiko Hara ,  Koichi Karasaki ,  Tadashi Iida

发明人： Yoko Suzuki ,  Hideaki Doi ,  Yasuhiko Hara ,  Koichi Karasaki ,  Tadashi Iida

IPC分类号： G01N23/04 ,  G01R31/304 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K3/4638 ,  G01N23/04 ,  G01R31/304 ,  H05K3/0008

摘要： An X-ray inspection apparatus and method in which an object to be inspected is irradiated with characteristic X-rays containing at least one wavelength which affords a high X-ray absorbance in the object to be inspected. A transmitted X-ray image which has passed through the object to be inspected is detected, and the object to be inspected is inspected on the basis of the transmitted X-ray image. The method and apparatus are utilized to fabricate a multi-layer printed circuit board.

摘要翻译： 一种X射线检查装置和方法，其中被检查物体用包含至少一个波长的特征X射线照射，所述波长在被检测物体中提供高X射线吸光度。 检测已经通过待检查对象的透射X射线图像，并且根据透射的X射线图像来检查被检查物体。 该方法和装置用于制造多层印刷电路板。