摘要:
An outer ring (21) is arranged in a barrel unit (14c). A driving mechanism (25) provided on the outer ring shifts an optical element (M), and adjusts the position and the tilt of the optical element. A damper mechanism (31) for suppressing propagation of vibration to the optical element is attached to the outer ring.
摘要:
An optical system improved in weight balance and stability, comprising drive mechanisms that support, movable with respect to an outer ring, a virtual rigid body consisting of an inner ring, optical element in a shape asymmetrical with respect to the optical axis, and optical element holding members for holding the optical element and fixing it to the inner ring. The inner ring, the outer ring and drive mechanisms function as a parallel link mechanism. Balance weights are provided on the virtual rigid body such that the weight of the virtual rigid body acts uniformly on the drive mechanisms. Therefore, the optical element is not likely to vibrate when subjected to an external vibration or at adjusting. The optical system is suitable for use in an exposure system requiring high exposure accuracy.
摘要:
A novel method is proposed for the chlorination of a silicon compound having, in a molecule, at least one hydrogen atom directly bonded to the silicon atom. The method comprises the step of reacting the starting silicon compound with anhydrous copper (II) chloride as a chlorinating agent in the presence of copper (I) iodide as a catalyst so as to substitute a chlorine atom for the silicon-bonded hydrogen atom. When the starting silicon compound has two or more of silicon-bonded hydrogen atoms, the chlorination reaction proceeds stepwise so that the inventive method provides a possibility of selective chlorination.
摘要:
A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.9 dyne/cm.sup.2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.7 dyne/cm.sup.2 and a value for tan .delta. of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.
摘要翻译:一种用于在焊接期间临时固定电子装置,特别是表面安装装置到印刷电路板上的位置的压敏粘合剂,从而防止装置从板上掉落。 压敏粘合剂基本上由具有104至109达因/ cm 2范围内的动态弹性模量的树脂材料组成,其电阻值为10Hz的电子装置的焊接温度。 优选地,树脂材料的动态弹性模量在104至107达因/ cm 2的范围内,并且在上述条件下测量的tanδ值大于0.2。 在这种情况下,压敏粘合剂表现出自对准效果,由此通过熔融焊料的表面张力的作用迫使安装在板上的位置的电子装置朝向适当的位置移动。
摘要:
Provided is a shot peening device with which recovered projection material and foreign bodies can be more precisely separated while inhibiting an increase in the size of the device. The shot peening device is provided with: a projector which projects projection material onto a workpiece (W); recovery mechanisms which recover the projection material projected by the projector; and a wind power sorting mechanism in which recovered projection material is allowed to fall freely while an upward air current is applied to the recovered projection material, and foreign bodies included in the recovered projection material are separated from the recovered projection material.
摘要:
The present invention provides a drum for a shot blasting apparatus that uniformly treats the works to be treated by increasing the level of agitation of the works that are buried at the bottom of the drum, and, further, suppressing the traces of collisions on the works, which traces are caused by the works colliding with each other. The drum comprises a hollow middle part, a lower-half part having the shape of a truncated cone, having a closed bottom, and having a projecting part for agitating that is connected to both the lower-half part and the middle part, and that agitates the works, wherein the projecting part for agitating has at least two surfaces, one being the surface for picking-up the works and the other being the surface for having the works slide down. The present invention also provides the shot blasting apparatus using the drum.
摘要:
To provide a novel shot-blasting machine to eliminate a dead space for a cover that shuts an opening for feeding and taking out works and to open and close the cover by moving a rotary drum around an axis. The machine has a cabinet 11, a rotary drum 13 having holes, and a centrifugal shooting machine 15. The rotary drum 13 moves, within the cabinet 11, around an axis through the positions for feeding, processing, and taking out the works. The cabinet 11 comprises a cover 51 for shutting an opening 11b for feeding and taking out the works. It has a wall 59 for sealing the side of the opening 11b. The cover 51 is integrated with the rotary drum 13 to move around the axis. It has walls 51a, 51b, 51d that fit the wall 59 for sealing. Lip seals 61, 63 seal the gap between the walls 51a, 51b, 51d of the cover 51 and the wall 59 for sealing.
摘要:
An optical system improved in weight balance and stability, comprising drive mechanisms that support, movable with respect to an outer ring, a virtual rigid body consisting of an inner ring, optical element in a shape asymmetrical with respect to the optical axis, and optical element holding members for holding the optical element and fixing it to the inner ring. The inner ring, the outer ring and drive mechanisms function as a parallel link mechanism. Balance weights are provided on the virtual rigid body such that the weight of the virtual rigid body acts uniformly on the drive mechanisms. Therefore, the optical element is not likely to vibrate when subjected to an external vibration or at adjusting. The optical system is suitable for use in an exposure system requiring high exposure accuracy.
摘要:
The inventions relate to 1) a method for controlling the apparatus for the shot processing to safely activate it, the apparatus for the shot processing using the method for controlling, and a computer program for it, 2) a method for controlling the apparatus to improve the performance of it, the apparatus using the method for controlling, and a computer program for it, and 3) a method for controlling the apparatus to prevent a fire from breaking out in a dust collector which catches dust generated by it, the apparatus using the method for controlling, and a computer program for it.The method for controlling an apparatus for shot processing to securely activate the apparatus, which is provided with a panel for operation to control the apparatus, is comprised of 1) a step for displaying a screen indicating predetermined items to be checked to confirm the safety of the apparatus and key buttons to select answers on the touch panel of the panel for operation when the apparatus is activated, 2) a step for touching the key buttons to select answers corresponding to the items to be checked, 3) a step for determining whether it has been confirmed that the apparatus can be securely activated after the step for touching the key buttons, and 4) a step for switching the screen on the touch panel to a predetermined different screen based on the result of the step for that determination.
摘要:
A pressure-sensitive adhesive for use in temporarily securing electronic devices, particularly surface-mounting devices onto a printed circuit board in position during soldering, thereby preventing the devices from dropping from the board. The pressure-sensitive adhesive consists essentially of a resinous material having a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.9 dyne/cm.sup.2 as measured at the soldering temperature of the electronic devices with a frequency of applied vibrations of 10 Hz. Preferably, the resinous material has a dynamic modulus of elasticity in the range of from 10.sup.4 to 10.sup.7 dyne/cm.sup.2 and a value for tan .delta. of greater than 0.2 as measured under the above conditions. In this case, the pressure-sensitive adhesive exhibits a self-aligning effect whereby electronic devices mounted out of position on the board are forced to move toward the proper positions by the action of the surface tension of a molten solder.
摘要翻译:一种用于在焊接期间临时固定电子装置,特别是表面安装装置到印刷电路板上的位置的压敏粘合剂,从而防止装置从板上掉落。 压敏粘合剂基本上由具有104至109达因/ cm 2范围内的动态弹性模量的树脂材料组成,其电阻值为10Hz的电子装置的焊接温度。 优选地,树脂材料的动态弹性模量在104至107达因/ cm 2的范围内,并且在上述条件下测量的tanδ值大于0.2。 在这种情况下,压敏粘合剂表现出自对准效果,由此通过熔融焊料的表面张力的作用迫使安装在板上的位置的电子装置朝向适当的位置移动。