摘要:
A semiconductor integrated circuit includes a semiconductor substrate, a plurality of trenches formed to extend in one direction in the semiconductor substrate, at least one connecting trench connecting at least two of the plurality of trenches to each other, a plurality of trench transistors including a plurality of gate electrodes, each gate electrode partially filling a corresponding trench, and a capping layer filling the at least one connecting trench.
摘要:
In a backlight assembly and a flat panel display apparatus, the backlight assembly has a diffusing plate, a supporting member and a reflecting plate. The supporting member has a base body portion, a supporting portion supporting the diffusing plate and a lamp holder receiving lamps to uniformly maintain spaced intervals between the lamps. The base body portion is disposed under the reflecting plate. The supporting portion and the lamp holder are inserted through engaging openings formed at the reflecting plate such that the supporting portion and the lamp holder are upwardly protruded with respect to the reflecting plate. Accordingly, the backlight assembly may reduce an area of the reflecting plate covered by the supporting member, thereby providing the light having uniform brightness distribution.
摘要:
A light source assembly includes a heat interception portion disposed between a light source unit and an optical member. The heat interception portion may be extended from the light source unit. Alternatively, the heat interception portion may be extended from a receiving container that receives the light source unit and the optical member. The heat transferred from the light source unit to the optical member may be reduced. Thus, deformation of the optical member may be prevented and the display quality of the image from the liquid crystal display apparatus using the light source assembly may be improved.
摘要:
Bonding pad(s) formed on a printed circuit board with circuit patterns. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.
摘要:
A multi-layer printed circuit board includes a core layer having a first circuit patterns formed on the upper and lower surface of a first insulation layer and via-holes in which a conductive layer is formed to electrically connect with the first circuit patterns. Built-up layers are formed on the upper and lower side of the core layer and have second circuit patterns electrically connected with the first circuit pattern by means of a via-holes in which conductive layers are formed to electrically connect the first circuit patterns of the core layer and the second circuit patterns of the upper and/or lower built-up layers. The via-holes in the core layer and the via-holes in the built-up layers are formed from an each side/both sides of the core layer and from the built-up layers toward the core layer, whereby interconnection of the circuit patterns is obtained without using through-holes and permitting shortening of the wiring and higher integration.
摘要:
A backlight assembly includes at least one U-shaped lamp, a first connecting member, and a second connecting member. The U-shaped lamp includes a U-shaped lamp tube, a first external electrode covering a first end portion of the U-shaped lamp tube, and a second external electrode covering a second end portion of the U-shaped lamp tube. The U-shaped lamp tube generates light when a first driving voltage is applied to the first external electrode and a second driving voltage is applied to the second external electrode. The first connecting member is electrically connected to the first external electrode for applying the first driving voltage to the first external electrode. The second connecting member is electrically connected to the second external electrode for applying the second driving voltage to the second external electrode. Therefore, interference between a wire for applying power to the U-shaped lamp and the U-shaped lamp is reduced.
摘要:
A semiconductor device includes an isolation region formed in a semiconductor substrate to define an active region. First and second impurity regions spaced apart from each other are formed in the active region. A gate trench region crosses the active region between the first and second impurity regions and extends to the isolation region. A first contact structure having a sidewall in vertical alignment with a sidewall of the gate trench region adjacent to the first impurity region is provided on the first impurity region. A second contact structure having a sidewall in vertical alignment with a sidewall of the gate trench region adjacent to the second impurity region is provided on the second impurity region. A gate electrode is provided in the gate trench region. A gate dielectric layer is interposed between the gate trench region and the gate electrode.
摘要:
A backlight assembly includes a plurality of lamps, a receiving container, a reflective plate and a lamp-securing member. The lamps are arranged substantially parallel to each other and generate light. The receiving container receives the lamps. The reflective plate is disposed between the lamps and the receiving container. The lamp-securing member includes a body disposed on the reflective plate, a lamp-securing portion formed on the body and securing the lamps, a combining portion combined with the receiving container and a slit portion adjacent to the combining portion.
摘要:
There is provided a lamp fixing holder. A lamp fixing holder for fixes a lamp to a receiving container. The lamp provides a liquid crystal display panel with light. The lamp includes a first portion of a face and a second portion of the face. The light emitted from the first portion of the face advances toward the liquid crystal display panel. The lamp fixing holder comprises a lamp fixing body and a fixing member. The lamp fixing body holds a third portion of the face of the lamp. The second portion includes the third portion. The fixing member fixes the lamp fixing body to the receiving container. The lamp fixing holder according to the present invention fixes the lamp so that the lamp does not sway, while minimizing an amount of light that is shielded by the lamp fixing holder.
摘要:
A supporting member for a liquid crystal display device comprises a base substrate, a lamp clip protruded from the base substrate in a first direction to hold a lamp that generates light, a supporting part protruded from the base substrate in the first direction to support a diffusion member that diffuses the light generated from the lamp, and a fixing clip protruded from the base substrate in a second direction substantially opposite to the first direction, wherein the fixing clip combines with a receiving container.