摘要:
An integrated circuit includes a semiconducting substrate (110), electrically conductive layers (120) over the semiconducting substrate, and a capacitor (130) at least partially embedded within the semiconducting substrate such that the capacitor is entirely underneath the electrically conductive layers. A storage node voltage is on an outside layer (132) of the capacitor. In the same or another embodiment, the integrated circuit may act as a 1T-1C embedded memory cell including the semiconducting substrate, an electrically insulating stack (160) over the semiconducting substrate, a transistor (140) including a source/drain region (142) within the semiconducting substrate and a gate region (141) above the semiconducting substrate, a trench (111) extending through the electrically insulating layers and into the semiconducting substrate, a first electrically insulating layer (131) located within the trench, and the capacitor located within the trench interior to the first electrically insulating layer.
摘要:
A processor may comprise a cache, which may be divided into a first and second section while the processor operates in a low-power mode. A cache line of the first section may be fragmented into segments. A first encoder may generate first data bits and check bits while encoding a first portion of a data stream and a second encoder may, separately, generate second data bits and check bits while encoding a second portion of the data stream. The first data bits may be stored in a first segment of the first section and the check bits in a first portion of the second section that is associated with the first segment. The first decoder may correct errors in multiple bit positions within the first data bits using the check bits stored in the first portion and the second decoder may, separately, decode the second data bits using the second set of check bits.
摘要:
Methods and apparatuses to increase a surface area of a memory cell capacitor are described. An opening in a second insulating layer deposited over a first insulating layer on a substrate is formed. The substrate has a fin. A first insulating layer is deposited over the substrate adjacent to the fin. The opening in the second insulating layer is formed over the fin. A first conducting layer is deposited over the second insulating layer and the fin. A third insulating layer is deposited on the first conducting layer. A second conducting layer is deposited on the third insulating layer. The second conducting layer fills the opening. The second conducting layer is to provide an interconnect to an upper metal layer. Portions of the second conducting layer, third insulating layer, and the first conducting layer are removed from a top surface of the second insulating layer.
摘要:
In one embodiment of the invention, a method of forming a semiconductor device includes forming a dynamic random access memory using spacer-defined lithography.
摘要:
A one-time programmable (OTP) cell includes an access transistor coupled to an antifuse transistor. Access transistor has a gate oxide thickness that is greater than the gate oxide thickness of the antifuse transistor so that if the antifuse transistor is programmed, the voltage felt across the gate/drain junction of the access transistor is insufficient to cause the gate oxide of the access transistor to break down. The dual gate oxide OTP cell may be used in an array in which only one OTP cell is programmed at a time. The dual gate oxide OTP cell also may be used in an array in which several OTP cells are programmed simultaneously.
摘要:
In general, in one aspect, the disclosure describes a memory array including a plurality of memory cells arranged in rows and columns. Each memory cell includes a transistor having a floating body capable of storing a charge. A plurality of word lines and purge lines are interconnected to rows of memory cells. A plurality of bit lines are interconnected to columns of memory cells. Driving signals provided via the word lines, the purge lines, and the bit lines can cooperate to alter the charge of the floating body region in one or more of the memory cells.
摘要:
According to embodiments of the present invention, a one-time programmable (OTP) cell includes an access transistor coupled to an antifuse transistor. In on embodiment, access transistor has a gate oxide thickness that is greater than the gate oxide thickness of the antifuse transistor so that if the antifuse transistor is programmed, the voltage felt across the gate/drain junction of the access transistor is insufficient to cause the gate oxide of the access transistor to break down. The dual gate oxide OTP cell may be used in an array in which only one OTP cell is programmed at a time. The dual gate oxide OTP cell also may be used in an array in which several OTP cells are programmed simultaneously.
摘要:
A system includes a pull-up circuit to program a memory cell. The pull-up circuit may include a level shifter to receive a control signal, a supply voltage, and one or more of a plurality of rail voltages, each of the plurality of rail voltages substantially equal to a respective integer multiple of the supply voltage, and to generate a second control signal, and a cascode stage. The cascode stage may include a plurality of transistors, a gate voltage of each of the plurality of transistors to be controlled at least in part by a respective one of the second control signal, the supply voltage, and at least one of the plurality of rail voltages, and an output node to provide a cell programming signal.
摘要:
In some embodiments, a memory array is provided with cells that when written to or read from, can have modified supplies to enhance their read stability and/or write margin performance. Other embodiments may be disclosed and/or claimed.
摘要:
Different embodiments of a one-time-programmable antifuse cell included. In one embodiment, a circuit is provided that includes an antifuse element, a high voltage device, and a sense circuit. The antifuse element has a voltage supply terminal to be at a sense voltage during sensing/reading and a higher programming voltage during programming. The sense circuit is configured to enable programming the antifuse element during programming and to sense the state of the antifuse element during sensing. The high voltage device is coupled between the antifuse element and the sense circuit to couple the antifuse element to the sense circuit during programming and sensing and to protectively shield the sense circuit from the higher programming voltage during programming.