SEMICONDUCTOR STRUCTURE HAVING AN INTEGRATED QUADRUPLE-WALL CAPACITOR FOR EMBEDDED DYNAMIC RANDOM ACCESS MEMORY (EDRAM) AND METHOD TO FORM THE SAME
    6.
    发明申请
    SEMICONDUCTOR STRUCTURE HAVING AN INTEGRATED QUADRUPLE-WALL CAPACITOR FOR EMBEDDED DYNAMIC RANDOM ACCESS MEMORY (EDRAM) AND METHOD TO FORM THE SAME 有权
    具有用于嵌入式动态随机存取存储器(EDRAM)的集成四元组电容器的半导体结构及其形成方法

    公开(公告)号:US20120326274A1

    公开(公告)日:2012-12-27

    申请号:US13165615

    申请日:2011-06-21

    IPC分类号: H01L29/92 H01L21/20

    摘要: Semiconductor structures having integrated quadruple-wall capacitors for eDRAM and methods to form the same are described. For example, an embedded quadruple-wall capacitor includes a trench disposed in a first dielectric layer disposed above a substrate. The trench has a bottom and sidewalls. A quadruple arrangement of metal plates is disposed at the bottom of the trench, spaced apart from the sidewalls. A second dielectric layer is disposed on and conformal with the sidewalls of the trench and the quadruple arrangement of metal plates. A top metal plate layer is disposed on and conformal with the second dielectric layer.

    摘要翻译: 描述了具有用于eDRAM的集成四足壁电容器的半导体结构及其形成方法。 例如,嵌入式四壁电容器包括设置在设置在基板上方的第一电介质层中的沟槽。 沟槽有一个底部和侧壁。 金属板的四重布置设置在沟槽的底部,与侧壁间隔开。 第二电介质层设置在沟槽的侧壁和金属板的四重布置上。 顶部金属板层设置在第二介电层上并与第二介质层保形。