摘要:
An organic EL device in the present invention comprises a light-transmissive substrate 1, an organic light emitting layer 2, a light-transmissive electrode 3 disposed between the light-transmissive substrate 1 and the organic light emitting layer 2, and a light guiding layer 4 which is disposed between the substrate 1 and the light-transmissive electrode 3. The light guiding layer 4 is configured to alter light direction. The organic EL device is configured to emit light from the organic light emitting layer 2, and allow the light to propagate out through said light guiding layer 4, the light-transmissive electrode 3, and the light-transmissive substrate 1. The light guiding layer 4 includes a light dispersion layer 5. The light dispersion layer 5 is formed with a light dispersion region 8 and a light-transmissive region 9, which are arranged in a coplanar relation within said light dispersion layer 5. The light dispersion region 8 contains light dispersion particles 6 and a binder resin 7. The light-transmissive region 9 contains the light dispersion particles 6 at a lower ratio than the light dispersion region 8. The organic EL device in the present invention enables to improve an overall light output by suppressing the reduction of light output in the front direction as well as increasing light output in diagonal directions.
摘要:
The liquid processing apparatus includes: a liquid supply mechanism; a supply line connected to the liquid supply mechanism, the supply line having a discharge opening for discharging a temperature-regulated liquid; a processing unit supporting the discharge opening of the supply line; a return line configured to return the liquid supplied to the supply line to the liquid supply mechanism; and a liquid-supply switching valve configured to switch between supply of the liquid, which is used in a processing of an object to be processed in the processing unit, and stoppage of the liquid supply. The liquid-supply switching valve is disposed on the supply line on a route of the liquid returning from the supply line to the liquid supply mechanism through the return line.
摘要:
A top plate 32 is provided with a top plate rotation mechanism configured to rotate the top plate 32 in a horizontal plane. An outside cup peripheral case 50 disposed around a cup 40 is configured to move between an upper position, in which a top end of the cylinder 50 is positioned above the cup 40, and a lower position located below the upper position. A nozzle support arm 82 configured to support a nozzle 82a is moved, in a horizontal direction, between an advanced position, in which the arm 82 is advanced into the outside cup peripheral case 50 via a side opening 50m formed in a side surface of the outside cup peripheral case 50 when the cylinder 50 is located in the upper position, and a retracted position, in which the arm 82 is retracted outward from the outside cup peripheral case 50.
摘要:
Disclosed is a liquid treatment apparatus capable of effectively exhausting processing liquid atmosphere around a target object. The liquid treatment apparatus includes a container, a support part located within the container that supports the target object, a rotation driving mechanism to rotate the target object supported by the support part, a processing liquid supply mechanism to supply a processing liquid to the target object, and a rotation cup, which is located outside of the outer circumference of the target object and is rotatable together with the support part. A rotation exhaust cup is arranged above the rotation cup and is rotatable together with the rotation cup. A discharge mechanism discharges processing liquid atmosphere guided by the rotation cup and the rotation exhaust cup.
摘要:
A liquid treatment device having a substrate holding section (2) for horizontally holding a wafer (W) and capable of rotating with the wafer (W), a rotation cup (4) having an annular shape so as to surround the wafer (W) held by the substrate holding section (2) and capable of rotating with the wafer (W), a rotation mechanism (3) for integrally rotating the rotation cup (4) and the substrate holding section (2), a nozzle (5) for supplying a treatment liquid for the wafer (W) and a cleaning liquid for the rotation cup (4), a liquid supply section (85) for supplying the treatment liquid and cleaning liquid to the nozzle (5), and a nozzle movement mechanism for moving the nozzle (5) between a first position at which the liquid is discharged to the wafer (W) and a second position at which the liquid is discharged to an external portion of the rotation cup (4). The wafer (W) is treated with the liquid with the nozzle (5) positioned at the wafer treatment position, and the cleaning liquid is discharged to the external portion of the rotation cup with the nozzle (5) positioned at the rotation cup cleaning position.
摘要:
A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; an annular rotary cup configured to surround the substrate held on the substrate holding member and to rotate along with the substrate; a rotation mechanism configured to integrally rotate the rotary cup and the substrate holding member; and a liquid supply mechanism configured to supply a process liquid onto the substrate. The apparatus further includes an annular drain cup configured to receive the process liquid discharged from the rotary cup, and provided with a drain port; and a circular flow generation element configured to generate a circular flow within the drain cup when the rotary cup and the substrate holding member are rotated, such that the circular flow servers to lead the process liquid within the drain cup to the drain port.
摘要:
Water vapor is mixed to O3 gas generated by an ozone generator of discharge type. The mixed fluid is cooled by a cooler, thereby impurities such as metals and nitrogen oxides contained in the O3 gas dissolve into condensed water. Subsequently, a gas-liquid separator separates the O3 gas from the condensed water. Water vapor is mixed with the O3 gas again. The mixed fluid passes through a metal trap composed of a container containing plural silicon chips as a metal adsorbent, thereby to remove the remaining metals therefrom.
摘要:
A common solvent vapor supply source 41 and a common processing gas supply source 42 supply ozone gas and steam to a plurality of processing vessels 30A, 30B. Pressures in the processing vessels are regulated by adjusting the openings of the valuable throttle valves 50A, 50B, which are placed in exhaust lines 80A, 80B, respectively.
摘要:
A liquid treatment apparatus includes a substrate holding member (22) that holds a substrate (W) horizontally, a rotation mechanism (25) that rotates the substrate holding member; a chemical liquid nozzle (56a) that supplies a chemical liquid to the substrate held by the substrate holding member; a top plate (50) that covers the substrate held by the substrate holding member from above the substrate; and at least one LED lamp (62) that heats the substrate during a chemical liquid treatment by irradiating the substrate with light of a predetermined wavelength through the top plate from above the top plate.
摘要:
There is provided a substrate processing method of supplying a processing solution to a substrate through a supply nozzle connected with a supply path via a differential pressure flowmeter provided on the supply path for supplying the processing solution and performing a process on the substrate by the processing solution. The substrate processing method includes measuring a pressure value in the supply path by a pressure measurement unit included in the differential pressure flowmeter when the processing solution is not supplied to the substrate; determining whether the pressure measurement unit is operated normally by comparing the pressure value measured in the measuring process with a predetermined pressure value; and supplying the processing solution to a substrate if it is determined that the pressure measurement unit is operated normally in the determining process.