公开(公告)号：US20120259039A1

公开(公告)日：2012-10-11

申请号：US13496619

申请日：2010-09-14

申请人： Atsuko Kobayashi ,  Ichirou Ogura

发明人： Atsuko Kobayashi ,  Ichirou Ogura

IPC分类号： C08L63/02 ,  C08L33/02 ,  C08L33/00 ,  B29C45/14

CPC分类号： C08F283/10 ,  C08G59/1466 ,  C08G59/50 ,  C08J5/04 ,  C08J2363/00 ,  Y10T428/24994 ,  Y10T428/2915

摘要： The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

摘要翻译： 本发明提供一种纤维增强复合材料用树脂组合物，其在低温下具有优异的流动性，并且产生具有优异机械强度的固化产物，并且还提供其固化产物，纤维增强复合材料，纤维 - 具有优异耐热性的增强树脂模制品，以及生产率高的纤维增强树脂模制品的制造方法。 纤维增强复合材料用树脂组合物含有作为必要成分的环氧树脂（A），含酸基的自由基聚合性单体（B），自由基聚合引发剂（C）和胺系固化剂 （D），在50℃下用E型粘度计测定粘度为500mPa·s以下的粘度。 将组合物浸渍到增强纤维中并固化。

公开(公告)号：US20120095156A1

公开(公告)日：2012-04-19

申请号：US13256724

申请日：2009-08-05

申请人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

发明人： Koji Hayashi ,  Yoshiyuki Takahashi ,  Ichirou Ogura

IPC分类号： C08L61/14 ,  C08G8/32 ,  C08G8/36 ,  C07F9/6574

CPC分类号： H05K1/0326 ,  C07F9/657172 ,  C08G8/28 ,  C08G59/621 ,  C08L61/14 ,  C08L63/00 ,  H05K2201/012 ,  Y10T428/31511

摘要： Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

摘要翻译： 提供一种含磷酚类化合物的制造方法，其中在含磷化合物和苯酚的芳香核之间的反应中反应性相当优异; 在使用多元酚或酚醛树脂作为酚的情况下，作为环氧树脂固化剂的新型含磷酚类化合物，赋予固化物优异的耐热性; 含有新型含磷酚类化合物的固化性树脂组合物; 固化性树脂组合物的固化物; 印刷线路板; 和半导体密封材料。 在芳香核上具有烷氧基作为取代基的芳族醛（a1）与分子内具有P-H基或P-OH基的有机磷化合物（a2）反应。 然后使所得反应产物与苯酚（a3）反应。

公开(公告)号：US08883938B2

公开(公告)日：2014-11-11

申请号：US13496619

申请日：2010-09-14

申请人： Atsuko Kobayashi ,  Ichirou Ogura

发明人： Atsuko Kobayashi ,  Ichirou Ogura

IPC分类号： B29C45/02 ,  B32B27/04 ,  C08J5/04 ,  C08K7/06 ,  C08L63/02 ,  C08L63/04 ,  C08G59/17 ,  C08F283/10 ,  C08G59/50

CPC分类号： C08F283/10 ,  C08G59/1466 ,  C08G59/50 ,  C08J5/04 ,  C08J2363/00 ,  Y10T428/24994 ,  Y10T428/2915

摘要： The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity at low temperature and which produces a cured product having excellent mechanical strength, and also provides a cured product thereof, a fiber-reinforced composite material, a fiber-reinforced resin molding having excellent heat resistance, and a process for producing a fiber-reinforced resin molding with good productivity. A resin composition for a fiber-reinforced composite material contains, as essential components, an epoxy resin (A), an acid group-containing radical polymerizable monomer (B), a radical polymerization initiator (C), and an amine-based curing agent (D) for an epoxy resin, and has a viscosity of 500 mPa·s or less at 50° C. measured with an E-type viscometer. The composition is impregnated into reinforcing fibers and cured.

摘要翻译： 本发明提供一种纤维增强复合材料用树脂组合物，其在低温下具有优异的流动性，并且产生具有优异机械强度的固化产物，并且还提供其固化产物，纤维增强复合材料，纤维 - 具有优异耐热性的增强树脂模制品，以及生产率高的纤维增强树脂模制品的制造方法。 纤维增强复合材料用树脂组合物含有作为必要成分的环氧树脂（A），含酸基的自由基聚合性单体（B），自由基聚合引发剂（C）和胺系固化剂 （D），在50℃下用E型粘度计测定粘度为500mPa·s以下的粘度。 将组合物浸渍到增强纤维中并固化。

公开(公告)号：US08420749B2

公开(公告)日：2013-04-16

申请号：US11817535

申请日：2006-03-01

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

IPC分类号： C08F283/00 ,  C08L61/00 ,  C08L61/06 ,  B24D3/28 ,  C08G8/04 ,  C08G14/02

CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-P-B-X-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂或酚醛树脂 作为环氧树脂材料。

公开(公告)号：US20090054585A1

公开(公告)日：2009-02-26

申请号：US11817535

申请日：2006-03-01

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

IPC分类号： C08L63/00 ,  C08L61/06 ,  C09D163/00 ,  C08G8/04

CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-PBX-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂，或作为环氧树脂的酚醛树脂 材料。

公开(公告)号：US08703845B2

公开(公告)日：2014-04-22

申请号：US13822453

申请日：2011-09-27

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Yousuke Hirota

IPC分类号： C08G59/32 ,  C08G59/62 ,  C08G59/06 ,  C08G61/02 ,  C08L63/00 ,  H01L21/56

CPC分类号： C08L63/00 ,  C08G8/36 ,  C08G59/621 ,  C08G2261/135 ,  C08G2261/3424 ,  C08G2261/592 ,  C08G2261/598 ,  C08G2261/76 ,  C08L61/14 ,  C08L65/00

摘要： A high degree of resistance to moisture and solder and high flame retardancy are realized without incorporating a halogen in view of environmental friendliness. A phenolic resin has structural moieties which are a naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1), a phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2), and a divalent aralkyl group (X) represented by general formula (1) below: (where Ar represents a phenylene group or a biphenylene group and Rs each independently represent a hydrogen atom or a methyl group) and has a structure in which plural aromatic hydrocarbon groups selected from the group consisting of the naphthylmethyloxy group- or anthrylmethyloxy group-containing aromatic hydrocarbon group (ph1) and the phenolic hydroxyl group-containing aromatic hydrocarbon group (ph2) are bonded through the divalent aralkyl group (X). This phenolic resin is used as a curing agent for an epoxy resin.

摘要翻译： 考虑到环境友好性，实现了高度的耐湿性和焊料性以及高阻燃性。 酚醛树脂具有含有萘基甲氧基或含有蒽基甲氧基的芳族烃基（ph1），含酚羟基的芳族烃基（ph2）和通式（2）表示的二价芳烷基（X）的结构部分 1）（其中Ar表示亚苯基或亚联苯基，Rs各自独立地表示氢原子或甲基），并且具有选自由以下组成的组中的多个芳族烃基的结构：萘基甲氧基或蒽基甲氧基 含有芳香族烃基（ph1）和含酚性羟基的芳香族烃基（ph2）通过二价芳烷基（X）键合。 该酚醛树脂用作环氧树脂的固化剂。

公开(公告)号：US08440781B2

公开(公告)日：2013-05-14

申请号：US12634259

申请日：2009-12-09

申请人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

发明人： Ichirou Ogura ,  Yoshiyuki Takahashi ,  Yutaka Sato

IPC分类号： C08G65/48 ,  C08G65/38 ,  C08L61/00 ,  C08L61/06 ,  C08L63/00

CPC分类号： H01L23/293 ,  C08G16/02 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

摘要翻译： 本发明的目的是提供一种能够实现低介电常数和低介电损耗因子的环氧树脂组合物，其适合用作最新的当前高频型电子元件相关材料，而不会降低其中的耐热性 固化反应。 一种酚醛树脂，其具有由酚衍生的含酚羟基的芳香族烃基（P）的结构单元，衍生自甲氧基萘和二价烃基的含烷氧基的缩合多环芳香族烃基（B）（X ）如亚甲基，也具有由-PBX-表示的结构，其中P，B和X是分子结构中这些基团的结构位点，用作环氧树脂的固化剂，或作为环氧树脂的酚醛树脂 材料。

公开(公告)号：US20130184377A1

公开(公告)日：2013-07-18

申请号：US13812972

申请日：2011-07-19

申请人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

发明人： Ichirou Ogura ,  Yousuke Hirota ,  Yoshiyuki Takahashi ,  Norio Nagae ,  Nobuya Nakamura

IPC分类号： C08L73/00

CPC分类号： C08L73/00 ,  C08G8/04 ,  C08L63/00 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a heat-curable resin composition having excellent fluidity and realizing moisture-resistance reliability suitable for recent electronic component-related materials and high flame retardancy in a halogen-free state for harmony with the environment, a cured product thereof, a semiconductor encapsulating material using the composition, and a phenol resin and epoxy resin which give these performances. The heat-curable resin composition includes, as essential components, an epoxy resin (A) and a phenol resin (B), the phenol resin (B) having a phenol resin structure having, as a basic skeleton, a structure in which a plurality of phenolic hydroxyl group-containing aromatic skeletons (ph) are bonded to each other through an alkylidene group or a methylene group having an aromatic hydrocarbon structure, and an aromatic nucleus of the phenol resin structure has a naphthylmethyl group or an anthrylmethyl group.

摘要翻译： 本发明提供了一种热稳定性树脂组合物，其具有优异的流动性，并且实现了适用于近期电子元件相关材料的耐湿可靠性，并且在无卤素状态下与环境和谐相处的高阻燃性，其固化产物，半导体 使用该组合物的封装材料，以及赋予这些性能的酚醛树脂和环氧树脂。 作为必要成分，作为必要成分的热固性树脂组合物包含环氧树脂（A）和酚醛树脂（B），酚醛树脂（B）具有作为基本骨架的酚醛树脂结构，其中多个 含酚羟基的芳族骨架（ph）通过具有芳烃结构的亚烷基或亚甲基彼此键合，并且酚醛树脂结构的芳香核具有萘甲基或蒽基甲基。

公开(公告)号：US08487052B2

公开(公告)日：2013-07-16

申请号：US13389692

申请日：2010-08-06

申请人： Atsuko Kobayashi ,  Ichirou Ogura

发明人： Atsuko Kobayashi ,  Ichirou Ogura

IPC分类号： C08L63/10 ,  B32B27/04

CPC分类号： C08L63/10 ,  B29C70/48 ,  B29C2945/7605 ,  B29K2023/06 ,  B29K2995/0088 ,  C08F283/10 ,  C08G59/08 ,  C08G59/1466 ,  C08J5/24 ,  C08J2363/02 ,  C08L63/00 ,  C08L2205/05 ,  Y10T428/31511 ,  C08L25/04 ,  C08L33/02

摘要： The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

摘要翻译： 本发明提供一种纤维增强复合材料用树脂组合物，其具有优异的流动性和浸渍在纤维基材中，并且产生具有优异耐热性的固化产物。 纤维增强复合材料用树脂组合物含有作为必要成分的聚（缩水甘油氧基芳基）化合物（A），作为不饱和羧酸或其酸酐的可聚合单体（B），分子量为160或 较少的芳族乙烯基化合物或（甲基）丙烯酸酯（C）和自由基聚合引发剂（D），其中组分（A）中的缩水甘油氧基的相对于酸基的当量比[缩水甘油氧基/酸基] 在组分（B）中的比例为1/1至1 / 0.48，组分（B）与组分（C）的摩尔比[（B）/（C）]在1 / 0.55至1 / 2。

公开(公告)号：US20090052909A1

公开(公告)日：2009-02-26

申请号：US11814462

申请日：2006-01-21

申请人： Tomoyuki Hino ,  Kazuhiko Kurata ,  Yutaka Urino ,  Ichirou Ogura ,  Junichi Sasaki ,  Youichi Hashimoto

发明人： Tomoyuki Hino ,  Kazuhiko Kurata ,  Yutaka Urino ,  Ichirou Ogura ,  Junichi Sasaki ,  Youichi Hashimoto

IPC分类号： G02B6/28 ,  H04B10/12

CPC分类号： G02B6/3897 ,  G02B6/43

摘要： One or more one-dimensional array-shaped photoelectric conversion modules 302 are mounted on a board 301. A one-dimensional array-shaped light receiving/emitting element 303 is mounted in each of the one-dimensional array-shaped photoelectric conversion modules 302. Further, the one-dimensional array-shaped photoelectric conversion modules 302 are mechanically and optically connected to a flexible fiber sheet 306 through an optical connector 305. As parallel transmission paths 306 from the one-dimensional array-shaped photoelectric conversion modules 302 approach an end of a board 301, they are laminated with each other and connected to a two-dimensional array-shaped optical connector 307 at an end of the board. Further, a wavelength multiplexer/demultiplexer is connected to the optical connector.

摘要翻译： 一个或多个一维阵列状光电转换模块302安装在板301上。一维阵列状光接收/发射元件303安装在一维阵列状光电转换模块302的每一个中。 此外，一维阵列状光电转换模块302通过光连接器305机械地和光学地连接到柔性纤维片材306上。由于一维阵列状光电转换模块302的平行传输路径306接近尾端 板301彼此层叠并连接到板的一端的二维阵列状光连接器307。 此外，波长多路复用器/解复用器连接到光学连接器。