公开(公告)号：US20140339322A1

公开(公告)日：2014-11-20

申请号：US14334914

申请日：2014-07-18

Applicant: MAXUM LLC

Inventor： James L. Freers ,  James M. Pankey

IPC: F26B21/00

CPC classification number: F26B21/004 ,  B05B1/04 ,  B05B1/044 ,  B05B1/046 ,  B05B1/048 ,  B05C11/02 ,  B05C11/06 ,  F24F13/065 ,  Y10T137/85978

Abstract: An apparatus that uses an optimized body design incorporating one or more interchangeable nozzle inserts with a wide array of discharge orifice sizes, configurations and spacings to efficiently and effectively deliver a pressurized, high velocity, laminar flow air stream to dry, cool, or clean objects that are either stationary or moving transversely through the optimized air stream developed by the apparatus, all while minimizing the operational downtime required to implement the interchangeable nozzle insert modifications to the apparatus.

Abstract translation: 一种使用优化的主体设计的装置，其包括一个或多个可互换的喷嘴插件，其具有各种排放孔尺寸，构造和间隔，以有效和有效地将加压的高速层流气流输送到干燥，冷却或清洁物体 它们是固定的或横向移动通过由设备开发的优化的空气流，同时最小化实现对设备的可互换喷嘴插件修改所需的操作停机时间。

公开(公告)号：US20140190634A1

公开(公告)日：2014-07-10

申请号：US14159647

申请日：2014-01-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Wei-Chieh Huang ,  Hung Chang Hsieh

IPC: G03F7/30

CPC classification number: G03F7/3021 ,  B05C9/12 ,  B05C11/02 ,  B05C11/023 ,  B05C11/08 ,  B05C13/00 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6715

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.

Abstract translation: 本公开提供了制造半导体器件的方法。 该方法包括将液体分配在晶片上。 该方法包括升高晶片。 该方法包括在升高之后降低晶片。 晶片在降低时旋转，从而从晶片去除至少一部分液体。 本公开还提供了一种用于制造半导体器件的装置。 该装置包括可操作以保持半导体晶片并将晶片固定到其上的晶片卡盘。 晶片具有前表面和后表面。 该装置包括可操作以将液体分配到晶片的前表面的分配器。 该装置包括机械结构，其可操作以：在水平方向上旋转晶片卡盘; 并且在晶片卡盘旋转的同时沿着垂直方向向下移动晶片卡盘。

公开(公告)号：US20130164685A1

公开(公告)日：2013-06-27

申请号：US13334266

申请日：2011-12-22

Applicant: Wei-Chieh Huang ,  Hung Chang Hsieh

Inventor： Wei-Chieh Huang ,  Hung Chang Hsieh

IPC: G03F7/20 ,  H01L21/306 ,  G03F7/30

CPC classification number: G03F7/3021 ,  B05C9/12 ,  B05C11/02 ,  B05C11/023 ,  B05C11/08 ,  B05C13/00 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6715

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes dispensing a liquid on a wafer. The method includes raising the wafer. The method includes lowering the wafer after the raising. The wafer is spun as it is lowered, thereby removing at least a portion of the liquid from the wafer. The present disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer chuck that is operable to hold a semiconductor wafer and secure the wafer thereto. The wafer has a front surface and a back surface. The apparatus includes a dispenser that is operable to dispense a liquid to the front surface of the wafer. The apparatus includes a mechanical structure that is operable to: spin the wafer chuck in a horizontal direction; and move the wafer chuck downwards in a vertical direction while the wafer chuck is being rotated.

Abstract translation: 本公开提供了制造半导体器件的方法。 该方法包括将液体分配在晶片上。 该方法包括升高晶片。 该方法包括在升高之后降低晶片。 晶片在降低时旋转，从而从晶片去除至少一部分液体。 本公开还提供了一种用于制造半导体器件的装置。 该装置包括可操作以保持半导体晶片并将晶片固定到其上的晶片卡盘。 晶片具有前表面和后表面。 该装置包括可操作以将液体分配到晶片的前表面的分配器。 该装置包括机械结构，其可操作以：在水平方向上旋转晶片卡盘; 并且在晶片卡盘旋转的同时沿着垂直方向向下移动晶片卡盘。

公开(公告)号：US20130152854A1

公开(公告)日：2013-06-20

申请号：US13467123

申请日：2012-05-09

Applicant: WEI-MIN QIN ,  CHANG-JUN LI ,  YU-LIN LIU

Inventor： WEI-MIN QIN ,  CHANG-JUN LI ,  YU-LIN LIU

IPC: B05C11/04 ,  B05C13/02

CPC classification number: B05B12/20 ,  B05C5/00 ,  B05C11/02

Abstract: A thermal grease smearing apparatus includes a platform for placing a heat sink, a supporting post projecting from the platform, and a bracket mounted to the supporting post. The bracket includes a bottom plate with a smearing hole. A thermal grease pipe is mounted to the bracket and includes a pipe body having an upper opening for introducing thermal grease and a lower opening for applying the thermal grease onto a bottom surface of the heat sink. When the bracket is positioned in a working position, the bottom surface aligns with a the smearing hole and abuts a lower surface of the bottom plate, a smearing portion contacts with the thermal grease applied onto the bottom surface and is actuated to rotate about a central axis of the thermal grease pipe thereby smearing the thermal grease uniformly spread on the bottom surface of the heat sink.

Abstract translation: 导热油脂涂抹装置包括用于放置散热器的平台，从平台突出的支撑柱和安装到支撑柱的支架。 支架包括带有拖尾孔的底板。 导热油脂管安装在支架上，并且包括一个具有用于引入导热油脂的上部开口的管体和用于将散热膏施加到散热器的底表面上的下部开口。 当支架位于工作位置时，底面与涂抹孔对准，并与底板的下表面对准，涂抹部分与施加在底表面上的导热油脂接触并被致动以围绕中心 从而涂抹均匀地散布在散热片的底面上的导热油脂。

公开(公告)号：US20120273070A1

公开(公告)日：2012-11-01

申请号：US13066933

申请日：2011-04-28

Applicant: James L. Freers ,  James M. Pankey

Inventor： James L. Freers ,  James M. Pankey

IPC: F24F13/00

CPC classification number: F26B21/004 ,  B05B1/04 ,  B05B1/044 ,  B05B1/046 ,  B05B1/048 ,  B05C11/02 ,  B05C11/06 ,  F24F13/065 ,  Y10T137/85978

Abstract: An apparatus that uses an optimized body design incorporating one or more interchangeable nozzle inserts with a wide array of discharge orifice sizes, configurations and spacings to efficiently and effectively deliver a pressurized, high velocity, laminar flow air stream to dry, cool, or clean objects that are either stationary or moving transversely through the optimized air stream developed by the apparatus, all while minimizing the operational downtime required to implement the interchangeable nozzle insert modifications to the apparatus.

Abstract translation: 一种使用优化的主体设计的装置，其包括一个或多个可互换的喷嘴插件，其具有各种排放孔尺寸，构造和间隔，以有效和有效地将加压的高速层流气流输送到干燥，冷却或清洁物体 它们是固定的或横向移动通过由设备开发的优化的空气流，同时最小化实现对设备的可互换喷嘴插件修改所需的操作停机时间。

公开(公告)号：US20060099329A1

公开(公告)日：2006-05-11

申请号：US11302434

申请日：2005-12-14

Applicant: Hyeon O ,  Min Choi

Inventor： Hyeon O ,  Min Choi

IPC: B05D5/06 ,  B05D5/12

CPC classification number: H01J9/225 ,  B05C5/025 ,  B05C5/027 ,  B05C11/02 ,  B05C11/08 ,  B05C11/1005 ,  B05C11/1044 ,  H01J2211/42

Abstract: An apparatus for forming phosphor layers on a display panel includes a base plate on which a display panel is placed. The base plate is inclined at an adjustable angle. The display panel, having a panel plate and barrier ribs formed on the panel plate is placed on the base plate. A spray unit includes a nozzle assembly for spraying a slurry containing phosphors into spaces between the barrier ribs. A charged unit for exerting electrostatic force on the phosphors is positioned adjacent to the display panel. The apparatus enables rapid formation of uniform phosphor layers on a display panel with the phosphor particles located adjacent to the surfaces of the phosphor layers.

Abstract translation: 一种用于在显示面板上形成荧光体层的设备包括：底板，放置显示面板。 基板以可调角度倾斜。 具有形成在面板上的屏板和阻挡肋的显示面板被放置在基板上。 喷雾单元包括用于将含有磷光体的浆料喷射到隔壁之间的空间中的喷嘴组件。 用于在荧光体上施加静电力的带电单元位于显示面板附近。 该装置能够在显示面板上快速形成均匀的荧光体层，荧光体颗粒位于荧光体层的表面附近。

公开(公告)号：US20050019499A1

公开(公告)日：2005-01-27

申请号：US10926048

申请日：2004-08-26

Applicant: Mikio Tomaru ,  Toshihiro Mandai ,  Norio Shibata

Inventor： Mikio Tomaru ,  Toshihiro Mandai ,  Norio Shibata

IPC: B05C5/02 ,  B05C11/02 ,  B05C11/04 ,  B05D1/26 ,  B05D1/42 ,  G03C1/74 ,  G11B5/848 ,  B05D3/12

CPC classification number: G03C1/74 ,  B05C5/0254 ,  B05C5/0262 ,  B05C11/02 ,  B05C11/025 ,  B05C11/04 ,  B05C11/041 ,  B05C11/045 ,  B05D1/265 ,  B05D1/42 ,  G03C2001/7459 ,  G11B5/848

Abstract: It is possible to give ultrathin and uniform coating on a flexible web in scraping-off type coating. The distribution of pressure in a web width direction is adjusted by a pressure distribution adjusting device when an excess of coating liquid excessively applied is scraped off by a doctor blade by giving relative pressure to a coating surface of a web and the doctor blade after applying the coating liquid that is more excessive than the desired quantity of the coating liquid on the web by a precoating apparatus while making the web continuously travel.

Abstract translation: 可以在刮擦式涂层的柔性网上给出超薄均匀的涂层。 当通过施加过量的涂布液被刮刀刮除过量的涂布液时，通过压力分布调节装置调节幅材宽度方向上的压力分布，施加相对于幅材的涂布表面和刮刀的相对压力 在使幅材连续行进的同时，通过预涂装置将超过所需量的涂布液涂布在纸幅上。

公开(公告)号：US20030059492A1

公开(公告)日：2003-03-27

申请号：US10149126

申请日：2002-10-18

Inventor： Jean-Marie Gaillard ,  Arnaud Hory

IPC: B29C031/06

CPC classification number: B05C11/02 ,  B05C19/00 ,  B22F2003/1056 ,  B29C41/12 ,  B29C64/00 ,  B29K2105/251 ,  Y02P10/295

Abstract: The object of the invention is a device for applying a thin layer of a powder on support means (14) comprising means (12) for storing the powder, screeding means (16) with a screed (30) comprising a shoe (36) with a working surface as well as means (28) for guiding in translation in a direction of movement F, characterized in that the shoe (36) is rotatable and comprises means (32, 34) for inclining it to take at least two positions, the first in which the working surface is parallel to the support means (14) for the layers to take up a predetermined volume of powder and a second in which this working surface is inclined at an angle null relative to said support means.

Abstract translation: 本发明的目的是一种用于在支撑装置（14）上施加粉末薄层的装置，该装置包括用于储存粉末的装置（12），具有熨平板（30）的熨平板装置（16），该熨平板包括鞋（36） 工作表面以及用于沿运动方向F平移地引导的装置（28），其特征在于，所述鞋（36）是可旋转的并且包括用于使其倾斜至少两个位置的装置（32,34），所述装置 首先，其中工作表面平行于支撑装置（14），以使各层吸收预定体积的粉末，其中该工作表面相对于所述支撑装置以α角倾斜。

公开(公告)号：US20030017256A1

公开(公告)日：2003-01-23

申请号：US10171250

申请日：2002-06-12

Inventor： Takashi Shimane

IPC: B05D001/40

CPC classification number: H01L21/67253 ,  B05B12/084 ,  B05C11/02 ,  B05C11/08 ,  G03F7/162

Abstract: An applying apparatus includes an applying unit for applying a photoresist to a semiconductor wafer on the basis of an applying condition, a thickness measuring unit for measuring the film thickness of the photoresist applied, and a control unit for controlling the applying unit. On the basis of information on the applying condition for a predetermined number of samples and information on the film thickness on the predetermined number of samples, the control unit plots an approximate curve that indicates the relation between the film thickness and the applying condition of the predetermined number of samples. When the applying apparatus starts its actual operation, the control unit calculates a correction value of the applying condition from a thickness target value on the basis of the plotted approximate curve, and generates a control signal for controlling the applying condition on the basis of the calculated correction value.

Abstract translation: 施加装置包括：施加单元，用于基于施加条件将光致抗蚀剂施加到半导体晶片;厚度测量单元，用于测量所施加的光致抗蚀剂的膜厚;以及控制单元，用于控制施加单元。 基于关于预定数量的样本的施加条件和关于预定数量样本的膜厚度的信息的信息，控制单元绘制表示膜厚度与预定的样品的施加条件之间的关系的近似曲线 样品数量 当施加装置开始其实际操作时，控制单元根据绘制的近似曲线从厚度目标值计算施加条件的校正值，并且根据所计算出的值，生成用于控制施加条件的控制信号 校正值。

公开(公告)号：US20020088396A1

公开(公告)日：2002-07-11

申请号：US09982250

申请日：2001-10-16

Inventor： James Michael Caldwell ,  George Schmermund

IPC: B05C011/00

CPC classification number: D21H25/06 ,  A61L15/26 ,  A61L15/52 ,  B05C3/18 ,  B05C11/02 ,  B05C11/04 ,  C08J9/40 ,  C08J9/42 ,  C08J2205/05 ,  C08J2427/00 ,  C08J2433/00 ,  C08J2475/00 ,  C08J2483/00 ,  C14C9/00 ,  C14C11/00 ,  D04H1/655 ,  D04H1/66 ,  D06B15/08 ,  D06M15/256 ,  D06M15/263 ,  D06M15/3568 ,  D06M15/564 ,  D06M15/643 ,  D06M15/653 ,  D06M15/657 ,  D06M2101/06 ,  D06M2101/12 ,  D06M2101/26 ,  D06M2101/32 ,  D06M2101/34 ,  D06M2200/12 ,  D06N3/0002 ,  D06N3/047 ,  D06N3/12 ,  D06N3/128 ,  D21H17/59 ,  D21H19/32 ,  C08L83/04

Abstract: The present invention relates to methods and apparatus for the controlled placement of a shear-thinnable polymer composition into a moving web. The controlled placement is preferably performed by applying the polymer composition onto a surface of a moving web, shear thinning the composition and placing it into the web, and curing the polymer composition. A preferred apparatus includes one or more process heads that has mounted thereto a rigid knife blade for engagement with the moving web. The knife blade is movable vertically and rotationally. The process head is also movable horizontally along the path of the moving web. A plurality of macro and micro tension zones are established and are monitored for controlling the apparatus and process. Additional measurements of web density, micro porosity, placement of an internal layer of polymer within the web, analysis of elements on the treated web, and the size of the polymer bead applied to the moving web are measured for controlling online the apparatus and the process of this invention. This method and apparatus produces webs that either has some of its structural elements encapsulated by the polymer composition while at least some of the interstitial spaces of the web are open; or has an internal layer extending through the web in a direction generally spaced from at least one major surface thereof; or has both encapsulated structural elements and an internal layer of polymer composition.

Abstract translation: 本发明涉及用于将剪切稀释聚合物组合物控制放置到移动网中的方法和装置。 优选通过将聚合物组合物施加到活动纤维网的表面上进行控制的放置，剪切使组合物变薄并将其放入网中，并固化聚合物组合物。 一种优选的装置包括一个或多个工艺头，其中已经安装有用于与移动网接合的刚性刀片。 刀片可以垂直和旋转移动。 处理头也可以沿着移动幅材的路径水平移动。 建立并监测多个宏观和微张力区域以控制装置和过程。 测量幅面密度，微孔隙率，网内聚合物的位置，处理过的纤维网上的元素分析以及施加到移动纤维网上的聚合物珠粒的尺寸，以便在线控制设备和方法 的本发明。 该方法和装置产生纤维网，其纤维网具有由聚合物组合物包封的一些结构元件，而幅材的至少一些间隙空间是开放的; 或者具有在与其至少一个主表面大致间隔开的方向上延伸穿过幅材的内层; 或具有包封的结构元件和聚合物组合物的内层。