公开(公告)号：US6092714A

公开(公告)日：2000-07-25

申请号：US270646

申请日：1999-03-16

Applicant: William J. Casey

Inventor： William J. Casey

IPC: B23K1/20 ,  H05K3/34 ,  B23K9/00 ,  B23K28/00 ,  B23K31/02

CPC classification number: B23K1/206 ,  B23K2201/38 ,  H05K3/3489

Abstract: A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma. The treatment of conductive surfaces according to the method of the present invention has shown to allow a soldering operation for 3 to 8 hours following treatment without additional preparation, cleaning or treatment.

Abstract translation: 一种利用包含氩和CF4的等离子体气体混合物来清洁和涂覆等离子体反应室中的导体以清洁和涂覆导体的方法。 用于清洁和涂覆导体的方法包括清洁过程的组合，包括物理还原和化学反应以及在导体暴露于本发明的方法期间在氟氟金属组合物（SnOxFy）上形成的聚合钝化膜的形成 。 由于退化碳四氟化碳（CF4）气体和降解的环境和休闲碳氢化合物以各种未指定的有机污染物的形式存在而形成聚合钝化膜，以在高能环境中形成粗聚合物分子 的等离子体。 根据本发明的方法处理导电表面已显示允许焊接操作在处理后3至8小时，无需额外的制备，清洁或处理。

公开(公告)号：US6084179A

公开(公告)日：2000-07-04

申请号：US188248

申请日：1998-10-13

Applicant: Jeryle L. Walter ,  Terry Sheetz

Inventor： Jeryle L. Walter ,  Terry Sheetz

IPC: H01R4/02 ,  H01R43/02

CPC classification number: H01R43/02 ,  H01R4/027 ,  B23K2201/38 ,  H01R4/021 ,  Y10T29/49179

Abstract: An electrical joint is provided between first and second electrical leads having different inner diameters. The electrical joint is formed using an electrically conductive transition post including a disk-shaped a separation member, a first cylindrical mounting post having a first diameter integral with the separation member and extending away therefrom in a first direction, and a second cylindrical mounting post having a second diameter integral with the separation member and extending away therefrom in a second direction generally opposite the first direction. The separation member lies in a plane transverse to the longitudinal axis of the first and second mounting posts and has a diameter greater than that of either the first or the second mounting post. A first electrical lead is fittingly received on the first mounting post and a second electrical lead is fittingly received on the second mounting post. In each instance, the free ends of the electrical leads abut the separation member. Thereupon, the first and second electrical leads are welded to the first and second mounting posts, respectively, such that electrical continuity is achieved between the first and second electrical leads. In another embodiment, each of the first and second mounting posts may have a threaded outer peripheral surface for engageably receiving thereon an associated one of the electrical leads.

Abstract translation: 在具有不同内径的第一和第二电引线之间设置电接头。 电接头使用包括圆盘形分离构件的导电过渡柱形成，第一圆柱形安装柱，其具有与分离构件成一体的第一直径并沿着第一方向从其延伸;以及第二圆柱形安装柱，其具有 第二直径与分离构件成一体并且在与第一方向大致相反的第二方向上从其延伸。 分离构件位于横向于第一和第二安装柱的纵向轴线的平面中，并且具有大于第一或第二安装柱的直径的直径。 第一电引线被适配地容纳在第一安装柱上，并且第二电引线被适配地容纳在第二安装柱上。 在每种情况下，电引线的自由端邻接分离构件。 于是，第一和第二电引线分别焊接到第一和第二安装柱，使得在第一和第二电引线之间实现电连续性。 在另一个实施例中，第一和第二安装柱中的每一个可以具有螺纹的外周表面，用于可接合地在其上接收相关的一个电引线。

公开(公告)号：US6045026A

公开(公告)日：2000-04-04

申请号：US27690

申请日：1998-02-23

Applicant: David R. Hembree ,  Michael E. Hess ,  John O. Jacobson ,  Warren M. Farnworth ,  Alan G. Wood

Inventor： David R. Hembree ,  Michael E. Hess ,  John O. Jacobson ,  Warren M. Farnworth ,  Alan G. Wood

IPC: B23K20/10

CPC classification number: B23K20/10 ,  B23K2201/38

Abstract: A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.

公开(公告)号：US5977508A

公开(公告)日：1999-11-02

申请号：US93616

申请日：1998-06-09

Applicant: Yukinori Takano

Inventor： Yukinori Takano

IPC: B23K11/00 ,  B23K11/02 ,  B23K11/11 ,  B23K11/24 ,  B23K11/25 ,  B23K101/38 ,  H01R43/02

CPC classification number: B23K11/0026 ,  B23K11/02 ,  B23K2201/38

Abstract: A resistance welding method in which a welding current is passed through a welding portion of a material to be welded in a condition that the welding portion is put in between a pair of electrodes, so that the welding portion is fused and welded by use of the resistance heating caused by conduction of the welding current under pressure applied between the pair of electrodes, characterized by comprising the steps of: measuring a welding width of the welding portion by the width measurement unit; calculating a reference welding height of the welding portion from the measured welding width on the basis of a predetermined reference welding sectional area of the welding portion; passing the welding current through the welding portion until the height of the welding portion reaches the calculated reference welding height; and displaying current-conduction time from the start to end of conduction of the welding current on the display unit.

Abstract translation: 一种电阻焊接方法，其中焊接电流在焊接部分放置在一对电极之间的条件下通过焊接材料的焊接部分，使得焊接部分通过使用焊接部分熔化和焊接 由在一对电极之间施加的压力下的焊接电流的导通引起的电阻加热，其特征在于包括以下步骤：通过宽度测量单元测量焊接部分的焊接宽度; 基于所述焊接部的规定的基准焊接截面积，从所测量的焊接宽度计算所述焊接部的基准焊接高度; 使焊接电流通过焊接部分，直到焊接部分的高度达到计算出的参考焊接高度; 并且在显示单元上显示从焊接电流的导通的开始到结束的电流导通时间。

公开(公告)号：US5906044A

公开(公告)日：1999-05-25

申请号：US760340

申请日：1996-12-04

Applicant: Atsuhiko Fujii ,  Kazuhito Murakami

Inventor： Atsuhiko Fujii ,  Kazuhito Murakami

IPC: B21F15/06 ,  B23K20/10 ,  B23K20/16 ,  B23K101/38 ,  H01R4/02 ,  H01R43/02 ,  H02G1/14 ,  H01R4/00

CPC classification number: H01R43/0207 ,  B23K20/10 ,  B23K2201/38 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/49201

Abstract: The claimed invention provides an ultrasonic welding method, whereupon joint portions in which a copper foil portion and a twisted-wire electric cable are placed one upon the other in each groove of a resin casing, the grooves having a through-hole portion. In the through-hole portion, the copper foil portion and the twisted-wire electric cable are placed one upon the other. Welding is performed in a state in which the piled-up portion is sandwiched between a welding tip formed at an end of a welding head and an anvil. Thus, the joint portion between the copper foil portion and the twisted-wire electric cable invade and are invaded by a portion of the resin casing softened by welding heat. The joint portion is fastened not only by welding, but also by the solidified resin.

Abstract translation: 所要求保护的发明提供一种超声波焊接方法，其中铜箔部分和双绞线电缆的接合部分一个接一个地放置在树脂壳体的每个凹槽中，所述凹槽具有通孔部分。 在通孔部中，铜箔部和双绞线电缆一个放置在另一个上。 在堆焊部分夹在形成在焊接头端部的焊接尖端和砧座之间的状态下进行焊接。 因此，铜箔部分和绞线电缆之间的接合部分侵入并被一部分通过焊接热而软化的树脂壳体侵入。 接合部不仅通过焊接而且被固化树脂固定。

公开(公告)号：US5675891A

公开(公告)日：1997-10-14

申请号：US610258

申请日：1996-03-04

Applicant: Jonathan Childs ,  Charles R. Schotthoefer

Inventor： Jonathan Childs ,  Charles R. Schotthoefer

IPC: B23K1/002 ,  H01R4/18 ,  H01R43/02 ,  B23P19/00

CPC classification number: B23K1/002 ,  H01R4/187 ,  H01R43/0263 ,  B23K2201/38 ,  H01R43/0207 ,  Y10T29/4921 ,  Y10T29/49213 ,  Y10T29/53209

Abstract: Electrical connector components, for example, a pin terminal constructed from a solid wire pin and a formed metal body, are attached to a web carrier and fed through an inductive heating station, thereby bonding the components together. The components are pre-treated with a conductive bonding material which can be cured, flowed, or set by applying heat. The web carrier may be wound on a first spool, fed through the inductive heating station, and wound onto a second spool, for ready feed to and from successive production steps. The temperature of the heating operation may be controlled by varying the speed of the web feed and the strength of the inductive field, so as to ensure repeatable, uniform heating, at a high economical speed. In addition, the tip of the pin can be cooled during the heating operation, to prevent heat damage or contamination of the pin.

Abstract translation: 电连接器部件，例如，由实心线销和成形金属体构成的销接头连接到卷筒纸载体上，并通过感应加热台进给，从而将部件粘合在一起。 这些部件用可以通过加热固化，流动或固化的导电粘合材料进行预处理。 卷筒纸载体可以缠绕在通过感应加热台进给的第一卷轴上，并卷绕到第二卷轴上，以便从连续的生产步骤准备进料。 加热操作的温度可以通过改变幅材进给的速度和感应场的强度来控制，以便以高经济的速度确保可重复均匀的加热。 另外，在加热操作期间可以冷却销的尖端，以防止热损坏或销的污染。

公开(公告)号：US3287037A

公开(公告)日：1966-11-22

申请号：US41896764

申请日：1964-12-17

Applicant: AGA AB

Inventor： JOEL AVERSTEN KARL

IPC: B23K9/028 ,  H01R4/02

CPC classification number: H01R4/02 ,  B23K9/0288 ,  B23K2201/38 ,  Y10T403/479

Abstract: 1,070,559. Soldering. AGA A.B. Dec. 10, 1964 [Jan. 10, 1964], No. 50283/64. Heading B3R. In soldering a contact shoe and its contained cable end to a metal surface wherein a metal stud having solder at its end is soldered into an aperture in the shoe and to the metal surface by striking an arc between the surface and the solder on the stud and forcing the stud into the solder melted into the aperture, the contact shoe and its contained cable end is proportioned to have a minimum volume W min and a maximum volume W max according to the formulµ wherein W = volume of contact end of the cable shoe and its contained cable end in cm. 3 A = cross sectional area of the solder on the stud in cm. 2 h = height of the solder on the stud in cm. K = melting temperature of the solder in kelvin degrees K 1 = melting temperature of contact shoe and metal in kelvin degrees k = constant lying between 0À2 and 0À26 depending on the solder used. The metal stud (4), Fig. 4 (not shown), is of brass with an end portion (5) of silver solder of Cu 19%; Zn 13-17%; Ag 42-46%; Cd 18-22% for which K = 0À2 and has a notched portion to facilitate breaking-off a -portion after soldering. The contact shoe is circular and is provided on the end of a cable (1) to be soldered to a rail (3). Other solders which may be used comprise Cu 16%; Zn 23%; Ag 49%; Mn 7% and Ni 5%, for which K = 0À2, Cu 50%; Zn 31%; Ag 12% and Cd 7% for which k = 0À22 and Cu 86%; Mn 10% and Co 4% for which k = 0À26.

Abstract translation: 1,070,559。 焊接。 AGA A.B. 1964年12月10日[1月 10，1964]，No.50283/64。 标题B3R。 在将接触靴及其包含的电缆端焊接到金属表面上时，其端部具有焊料的金属螺柱通过在螺柱上的表面和焊料之间触发电弧而被焊接到焊盘中的孔中和金属表面，以及 迫使螺柱熔化到孔中的焊料中，接触靴及其包含的电缆端部成比例地具有根据配方的最小体积W min和最大体积W max，其中W =电缆靴的接触端的体积和 其包含的电缆端部以厘米为单位。 3 A =螺柱上焊料的横截面积，单位为cm。 2 h =螺柱上焊料的高度，单位为cm。 K =焊料的熔融温度，开氏度K 1 =接触靴和金属的熔融温度，开尔文度k = 0-2和0〜26之间的常数，这取决于所使用的焊料。 金属螺柱（4），图 图4（未示出）是具有Cu 19％的银焊料的端部（5）的黄铜。 锌13-17％; Ag 42-46％; Cd 18-22％，K = 0-2，并具有切口部分，以便在焊接之后破坏部分。 接触靴是圆形的，并且设置在待焊接到轨道（3）的电缆（1）的端部上。 可以使用的其他焊料包括Cu 16％; 锌23％; Ag 49％; Mn为7％，Ni为5％，K = 0〜2，Cu为50％。 Zn 31％; Ag 12％和Cd 7％，其中k = 0〜22和Cu 86％; Mn为10％，Co为4％，k = 0〜26。

公开(公告)号：US3205572A

公开(公告)日：1965-09-14

申请号：US24580962

申请日：1962-12-19

Applicant: PHILIPS CORP

Inventor： WILHELMUS JOCHEMS PIETER JOHAN

IPC: B23K1/005 ,  B23K3/08 ,  H01L21/60

CPC classification number: B23K3/08 ,  B23K1/005 ,  B23K2201/38 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01032 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12033 ,  Y10T29/41 ,  H01L2924/00

Abstract: 1,010,698. Semi-conductor devices. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. Jan. 11, 1963 [Jan. 15, 1962], No. 1376/63. Heading H1K. In a method for soldering a connecting wire to a semi-conductor body or alloyed electrode thereof, the wire is held in place only by a magnetic field during the soldering operation. The Figure shows a germanium wafer 1 with alloyed electrodes 2 of lead and antimony on a carbon support 3 located between magnetic polepieces 6 and 7. The block is heated by radiation from lamp 8 and at the soldering temperature gold-plated nickel wires 4 which are held in place by the magnetic field are soldered to electrodes 2. Other means of heating may be employed such as hot gas or a heating coil; the process is particularly suitable for mass production of transistors.

公开(公告)号：US1857182A

公开(公告)日：1932-05-10

申请号：US46378030

申请日：1930-06-25

Applicant: GEN ELECTRIC

Inventor： DONOVAN JOHN F ,  MALLOY FRANK J

IPC: B23K3/06

CPC classification number: B23K3/0646 ,  B23K2201/38

公开(公告)号：US6019272A

公开(公告)日：2000-02-01

申请号：US967537

申请日：1997-11-12

Applicant: John Scott Badgley ,  Dawn Roberta White ,  Richard Lawrence Allor ,  Samir Samir

Inventor： John Scott Badgley ,  Dawn Roberta White ,  Richard Lawrence Allor ,  Samir Samir

IPC: B23K1/00 ,  H01R43/02 ,  H05K3/34 ,  H01L21/60 ,  B23K20/12

CPC classification number: H05K3/3494 ,  B23K1/0008 ,  H01R43/0256 ,  H05B3/84 ,  B23K2201/38 ,  H05B2203/016 ,  H05K2201/1031 ,  H05K2203/0271 ,  H05K3/341 ,  Y02P70/611

Abstract: There is disclosed herein a method for attaching a terminal to a metallic mating surface on a workpiece by friction joining, comprising the steps of: (1) providing the terminal and the workpiece, wherein the terminal comprises an electrically conductive body having a top end to which an electrical connector may be attached, a bottom end having a bottom surface generally conforming to the mating surface of the workpiece, a rotational axis substantially orthogonal to the bottom surface about which the terminal may be rotated, and a layer of solder attached to the bottom surface wherein the layer has an outer perimeter and defines a central solder-free region about the axis; (2) rotating the terminal about its rotational axis at a predetermined rotational speed while holding the workpiece stationary; (3) pressing together the rotating terminal and the stationary workpiece using a predetermined forging force for a predetermined length of time, so as to promote a galling bond between the mating surfaces; and (4) abruptly stopping the rotation of the terminal. During the pressing together step, the solder is generally maintained at an average temperature below its melting temperature.

Abstract translation: 这里公开了一种通过摩擦接合将端子附接到工件上的金属配合表面的方法，包括以下步骤：（1）提供端子和工件，其中端子包括导电体，其具有顶端至 电连接器可以被附接，底端具有大体上与工件的配合表面相符的底表面，基本上垂直于底表面的旋转轴线，端子可围绕该底表面旋转，以及附接到工件的焊料层 底表面，其中所述层具有外周边并且围绕所述轴线限定中心无焊料区域; （2）在保持工件静止的同时以预定转速旋转端子绕其旋转轴线; （3）使用预定的锻压力将旋转端子和固定工件压在预定的时间长度上，以促进配合表面之间的磨损结合; 和（4）突然停止终端的旋转。 在压制步骤期间，焊料通常保持在低于其熔融温度的平均温度。