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273 条记录 (耗时 0.022 秒)

    Methods of repairing a substrate
    11.
    发明授权
    Methods of repairing a substrate 有权
    修复基材的方法

    公开(公告)号：US07888277B2

    公开(公告)日：2011-02-15

    申请号：US12621120

    申请日：2009-11-18

    申请人： James A. Riedell ,  Timothy E. Easler

    发明人： James A. Riedell ,  Timothy E. Easler

    IPC分类号： C04B35/00 ,  C03B29/00

    CPC分类号： C04B35/565 ,  B64G1/58 ,  C04B35/58078 ,  C04B35/6269 ,  C04B41/009 ,  C04B41/5059 ,  C04B41/87 ,  C04B2111/00982 ,  C04B2235/3225 ,  C04B2235/3813 ,  C04B2235/3826 ,  C04B2235/483 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B41/0054 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/4572 ,  C04B41/5045 ,  C04B41/507 ,  C04B35/83 ,  C04B35/80

    摘要： A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting of aluminum oxide, aluminum nitride, boron carbide, boron oxide, boron nitride, hafnium boride, hafnium carbide, hafnium oxide, lithium aluminate, molybdenum silicide, niobium carbide, niobium nitride, silicon boride, silicon carbide, silicon oxide, silicon nitride, tin oxide, tantalum boride, tantalum carbide, tantalum oxide, tantalum nitride, titanium boride, titanium carbide, titanium oxide, titanium nitride, yttrium oxide, zirconium boride, zirconium carbide, zirconium oxide, and zirconium silicate. Methods of forming the ceramic adhesive and of repairing a substrate in a vacuum and microgravity environment are also disclosed, as is a substrate repaired with the ceramic adhesive.

    摘要翻译： 适用于真空，热和微重力环境的陶瓷粘合剂的前体。 陶瓷粘合剂的前体包括硅基预陶瓷聚合物和选自氧化铝，氮化铝，碳化硼，氧化硼，氮化硼，硼化铪，碳化铪，氧化铪中的至少一种陶瓷粉末， 铝酸锂，硅化钼，碳化铌，氮化铌，硼化硅，碳化硅，氧化硅，氮化硅，氧化锡，硼化钽，碳化钽，氧化钽，氮化钽，硼化钛，碳化钛，氧化钛，氮化钛 ，氧化钇，硼化锆，碳化锆，氧化锆和硅酸锆。 还公开了在真空和微重力环境中形成陶瓷粘合剂和修复基材的方法，以及用陶瓷粘合剂修复的基材。

    METHODS OF REPAIRING A SUBSTRATE
    13.
    发明申请
    METHODS OF REPAIRING A SUBSTRATE 有权
    修复基材的方法

    公开(公告)号：US20100059166A1

    公开(公告)日：2010-03-11

    申请号：US12621120

    申请日：2009-11-18

    申请人： James A. Riedell ,  Timothy E. Easler

    发明人： James A. Riedell ,  Timothy E. Easler

    IPC分类号： B32B43/00

    CPC分类号： C04B35/565 ,  B64G1/58 ,  C04B35/58078 ,  C04B35/6269 ,  C04B41/009 ,  C04B41/5059 ,  C04B41/87 ,  C04B2111/00982 ,  C04B2235/3225 ,  C04B2235/3813 ,  C04B2235/3826 ,  C04B2235/483 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B41/0054 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/4572 ,  C04B41/5045 ,  C04B41/507 ,  C04B35/83 ,  C04B35/80

    摘要： A precursor of a ceramic adhesive suitable for use in a vacuum, thermal, and microgravity environment. The precursor of the ceramic adhesive includes a silicon-based, preceramic polymer and at least one ceramic powder selected from the group consisting of aluminum oxide, aluminum nitride, boron carbide, boron oxide, boron nitride, hafnium boride, hafnium carbide, hafnium oxide, lithium aluminate, molybdenum silicide, niobium carbide, niobium nitride, silicon boride, silicon carbide, silicon oxide, silicon nitride, tin oxide, tantalum boride, tantalum carbide, tantalum oxide, tantalum nitride, titanium boride, titanium carbide, titanium oxide, titanium nitride, yttrium oxide, zirconium boride, zirconium carbide, zirconium oxide, and zirconium silicate. Methods of forming the ceramic adhesive and of repairing a substrate in a vacuum and microgravity environment are also disclosed, as is a substrate repaired with the ceramic adhesive.

    摘要翻译： 适用于真空，热和微重力环境的陶瓷粘合剂的前体。 陶瓷粘合剂的前体包括硅基预陶瓷聚合物和选自氧化铝，氮化铝，碳化硼，氧化硼，氮化硼，硼化铪，碳化铪，氧化铪中的至少一种陶瓷粉末， 铝酸锂，硅化钼，碳化铌，氮化铌，硼化硅，碳化硅，氧化硅，氮化硅，氧化锡，硼化钽，碳化钽，氧化钽，氮化钽，硼化钛，碳化钛，氧化钛，氮化钛 ，氧化钇，硼化锆，碳化锆，氧化锆和硅酸锆。 还公开了在真空和微重力环境中形成陶瓷粘合剂和修复基材的方法，以及用陶瓷粘合剂修复的基材。

    Ceramic impregnated superabrasives
    20.
    发明申请
    Ceramic impregnated superabrasives 有权
    陶瓷浸渍超级磨料

    公开(公告)号：US20060042171A1

    公开(公告)日：2006-03-02

    申请号：US10931671

    申请日：2004-09-01

    申请人： Robert Radtke ,  Andrew Sherman

    发明人： Robert Radtke ,  Andrew Sherman

    IPC分类号： C09K3/14

    CPC分类号： C04B41/89 ,  C04B35/52 ,  C04B35/5831 ,  C04B41/009 ,  C04B41/52 ,  C04B2235/3826 ,  C04B2235/3873 ,  C04B2235/3891 ,  C04B2235/3895 ,  C04B2235/427 ,  C04B2235/483 ,  C04B2235/616 ,  C04B2235/80 ,  C04B2235/96 ,  Y10T428/249957 ,  Y10T428/249967 ,  Y10T428/249969 ,  Y10T428/30 ,  C04B41/4521 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/457 ,  C04B41/5035 ,  C04B41/5059 ,  C04B41/5057 ,  C04B41/522 ,  C04B38/00

    摘要： A superabrasive fracture resistant compact is formed by depositing successive layers of ceramic throughout the network of open pores in a thermally stable self-bonded polycrystalline diamond or cubic boron nitride preform. The void volume in the preform is from approximately 2 to 10 percent of the volume of the preform, and the average pore size is below approximately 3000 nanometers. The preform is evacuated and infiltrated under at least about 1500 pounds per square inch pressure with a liquid pre-ceramic polymerizable precursor. The precursor is infiltrated into the preform at or below the boiling point of the precursor. The precursor is polymerized into a solid phase material. The excess is removed from the outside of the preform, and the polymer is pyrolized to form a ceramic. The process is repeated at least once more so as to achieve upwards of 90 percent filling of the original void volume. When the remaining void volume drops below about 1 percent the physical properties of the compact, such as fracture resistance, improve substantially. Multiple infiltration cycles result in the deposition of sufficient ceramic to reduce the void volume to below 0.5 percent. The fracture resistance of the compacts in which the poes are lined with formed in situ ceramic is generally at least one and one-half times that of the starting preforms.

    摘要翻译： 通过在热稳定的自结合多晶金刚石或立方氮化硼预成型体中的开孔的网络中沉积连续的陶瓷层来形成超耐磨断裂的压块。 预制件中的空隙体积约为预制件体积的约2％至10％，平均孔径低于约3000纳米。 将预成型件用至少约1500磅/平方英寸的压力抽真空并用液体预陶瓷可聚合前体渗透。 前体在等于或低于前体沸点的条件下浸入预制件中。 将前体聚合成固相材料。 将多余物从预成型体的外部除去，并将聚合物热解以形成陶瓷。 该过程至少重复一次，以便实现原始空隙体积的90％以上的填充。 当剩余的空隙体积下降到约1％以下时，压实体的物理性能如抗断裂性能显着改善。 多次渗透循环导致沉积足够的陶瓷以将空隙体积降低至0.5％以下。 其中以原位形成的陶瓷衬垫的压块的抗断裂性通常为起始预制件的抗压强度的至少一倍。