Method and apparatus for aligning two objects, and method and apparatus
for providing a desired gap between two objects
    11.
    发明授权
    Method and apparatus for aligning two objects, and method and apparatus for providing a desired gap between two objects 失效
    用于对准两个物体的方法和装置,以及用于在两个物体之间提供期望间隙的方法和装置

    公开(公告)号:US4988197A

    公开(公告)日:1991-01-29

    申请号:US291276

    申请日:1988-12-28

    CPC classification number: G03F9/7049 G03F9/7023

    Abstract: A first diffraction grating is formed on a mask, and a second diffraction grating is formed on a wafer. Two light beams having slightly different frequencies interfere with each other and are diffracted as they travel through the first diffraction grating, are reflected by the second diffraction grating, and again pass through the first diffraction grating. As a result, they change into thrice diffracted light beams. The diffracted light beams are combined into a detection light beam which has a phase shift .phi..sub.A representing the displacement between the wafer and the mask, or a phase shift .phi..sub.G representing the gap between the wafer and the mask. The detection light beam is converted into a detection signal. The phase difference between the detection signal and a reference signal having no phase shifts are calculated, thus determining phase shift .phi..sub.A or .phi..sub.G. The displacement or the gap is determined from the phase shift. In accordance with the displacement or the gap, the wafer and the mask are aligned to each other, or the gap between them is adjusted to a desired value. Since the detection signal is generated from diffracted light beams, its S/N ratio is sufficiently great. Therefore, the displacement or the gap is determined with high precision. In addition, it is possible with the invention to perform the aligning of the wafer and the mask and the adjusting of the gap therebetween, simultaneously.

    Mask aligner with a wafer position detecting device
    12.
    发明授权
    Mask aligner with a wafer position detecting device 失效
    掩模对准器与晶片位置检测装置

    公开(公告)号:US4794648A

    公开(公告)日:1988-12-27

    申请号:US42534

    申请日:1987-04-27

    CPC classification number: G03F9/7069 G03F9/7023

    Abstract: A mask aligner includes a TV image pick-up device having a wide field angle and picking up the image of a wafer detection pattern on an image pick-up station to generate TV signals at the output, a fine alignment device for detecting a positional deviation of the wafer relative to a mask in an exposure station with the detected result being used to align the wafer with the mask, a transport stage for carrying and transporting the wafer from the image pick-up station to the exposure station, a processing device for determining the positional deviation of the wafer relative to the reference position on the image pick-up stage in accordance with the TV signals, and a drive for moving the transport stage so as to remove the positional deviation of the wafer relative to the reference position of the exposure station.

    Abstract translation: 掩模对准器包括具有宽场角的TV图像拾取装置,并且拾取图像拾取站上的晶片检测图案的图像以在输出端产生TV信号,用于检测位置偏差的精细对准装置 的晶片相对于曝光站中的掩模,其检测结果用于将晶片与掩模对准,用于将晶片从图像拾取站传送并传送到曝光站的传送台,用于 根据TV信号确定晶片相对于图像拾取台上的参考位置的位置偏差;以及用于移动传送台的驱动器,以便消除晶片相对于参考位置的位置偏差 曝光站。

    Exposure apparatus
    13.
    发明授权
    Exposure apparatus 失效
    曝光装置

    公开(公告)号:US4711567A

    公开(公告)日:1987-12-08

    申请号:US897644

    申请日:1986-08-18

    Inventor: Akikazu Tanimoto

    CPC classification number: G03F7/706 G03F7/70725 G03F9/7023

    Abstract: An exposure apparatus for optically transferring a pattern of a circuit such as an integrated circuit on a semiconductor wafer. The positioning control of stepping movement of a movable stage holding the wafer thereon is effected in such a manner that even if a rotational displacement is present in the optical image of a mask pattern with respect to the moving coordinate axes of the stage the rotational displacement is substantially cancelled in a printed pattern.

    Abstract translation: 一种用于在半导体晶片上光学传输集成电路等电路图案的曝光装置。 保持晶片在其上的可移动台阶的步进运动的定位控制是这样实现的:即使相对于台的移动坐标轴在掩模图案的光学图像中存在旋转位移,旋转位移是 基本上以印刷图案取消。

    Apparatus for aligning mask and wafer used in semiconductor circuit
element fabrication
    14.
    发明授权
    Apparatus for aligning mask and wafer used in semiconductor circuit element fabrication 失效
    用于对准半导体电路元件制造中使用的掩模和晶片的装置

    公开(公告)号:US4636626A

    公开(公告)日:1987-01-13

    申请号:US570189

    申请日:1984-01-12

    CPC classification number: G03F9/7023

    Abstract: An alignment apparatus for aligning a semiconductor wafer with an optical mask containing a circuit pattern to be exposed onto the wafer in the fabrication of semiconductor devices by a proximity exposure apparatus. The alignment apparatus includes light beam radiating means for radiating a first and second light beams which are imaged at positions separated by a given gap in a direction substantially perpendicular to two flat sheets, first and second detecting means for respectively detecting the imaging condition of the first and second light beams at the flat sheets, means for relatively moving the light beam radiating means and the flat sheets, and means for discriminating the order of generation of signals from the first and second detecting means, whereby the value of each gap between the selected areas of the two flat sheets at a plurality of places is detected with a high degree of accuracy without changing the gap between the flat sheets thereby making it possible to correct the parallelism, inclination, etc., of the flat sheets.

    Abstract translation: 一种对准装置,用于通过接近曝光装置将半导体晶片与包含要在半导体器件制造中暴露于晶片上的电路图案的光学掩模对准。 对准装置包括光束照射装置,用于辐射第一和第二光束,该第一和第二光束在基本上垂直于两个平板的方向上以给定间隙分开的位置成像;第一和第二检测装置,用于分别检测第一和第二光束的成像条件 并且平板处的第二光束,用于使光束辐射装置和平板相对移动的装置,以及用于鉴别来自第一和第二检测装置的信号的产生顺序的装置,由此所选择的每个间隙之间的值 在不改变平板之间的间隙的情况下以高精度检测多个位置处的两个平板的区域,从而可以校正平板的平行度,倾斜度等。

    Lithography system
    16.
    发明授权

    公开(公告)号:US4516253A

    公开(公告)日:1985-05-07

    申请号:US487943

    申请日:1983-04-25

    Inventor: W. Thomas Novak

    CPC classification number: G03F7/70691 B23Q1/36 G03F9/7023 G03F9/7049

    Abstract: A lithography system for X-ray or other beam printing on a substrate such as a silicon semiconductor wafer comprises a beam chamber (301), a beam source (302), means (309) for mounting a mask, means (308) for mounting an image sensing means (342) interiorly of the chamber, means (317, 318), for mounting a substrate (307) in multiple including six degrees of freedom and means (308, 292, 320-322) including the image sensing means to align the mask and substrate relative to one another utilizing alignment patterns on the mask and substrate, images of which are brought into registration and sensed by the image sensing means. In a preferred embodiment three sets of target images are provided so as to adjust the substrate and mask relative orientation in six degrees of freedom. The mask seals helium within the chamber. The mask and the substrate are aligned in situ in the same position in which the mask and substrate are to be exposed to the beam. Means (313, 314, 311, 312) are provided for loading masks, calibration assemblies and substrate-holding means. The source-to-substrate distance is adjustable as is the mask-to-substrate gap. To conserve helium volume adjustable optic objectives (342) are provided in the chamber to sense registration of alignment targets on each of the mask and substrate, with essentially the remainder of the optics outside the chamber. Improved compression optics (408) are also provided in the alignment system.

    MASK, EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD
    17.
    发明申请
    MASK, EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 审中-公开
    掩模,曝光装置和装置制造方法

    公开(公告)号:US20130329209A1

    公开(公告)日:2013-12-12

    申请号:US13967688

    申请日:2013-08-15

    Inventor: Yuichi SHIBAZAKI

    Abstract: A circular cylinder-shaped mask is used to form an image of a pattern on a substrate via a projection optical system. The mask has a pattern formation surface on which the pattern is formed and that is placed around a predetermined axis, and the mask is able to rotate, with the predetermined axis taken as an axis of rotation, in synchronization with a movement of the substrate in at least a predetermined one-dimensional direction. When a diameter of the mask on the pattern formation surface is taken as D, and a maximum length of the substrate in the one-dimensional direction is taken as L, and a projection ratio of the projection optical system is taken as β, and circumference ratio is taken as π, then the conditions for D≧(β×L)/π are satisfied.

    Abstract translation: 使用圆筒状的荫罩通过投影光学系统在基板上形成图案的图像。 掩模具有图案形成表面,其上形成图案并且围绕预定轴线放置,并且掩模能够以预定轴线为旋转轴线旋转,与基板的移动同步 至少预定的一维方向。 当图案形成表面上的掩模的直径取为D时,将一维方向上的基板的最大长度设为L,投影光学系统的投影比为β,圆周 比例为pi,则满足D> =(β×L)/ pi的条件。

    IMPRINT APPARATUS IN WHICH ALIGNMENT CONTROL OF A MOLD AND A SUBSTRATE IS EFFECTED
    18.
    发明申请
    IMPRINT APPARATUS IN WHICH ALIGNMENT CONTROL OF A MOLD AND A SUBSTRATE IS EFFECTED 审中-公开
    模具和基材的对准控制的印刷装置受到影响

    公开(公告)号:US20130196016A1

    公开(公告)日:2013-08-01

    申请号:US13804973

    申请日:2013-03-14

    Abstract: An imprint apparatus performs alignment control of a mold and a substrate. A pattern formed on the mold is transferred onto a pattern forming layer on the substrate. A mold holding portion holds the mold, a substrate holding portion holds the substrate, and a control portion effects control so that the mold and the substrate are brought near to each other during the alignment control. The mold and the pattern forming layer are brought into contact with each other and then the pattern forming layer is cured. The control portion changes a driving profile for the alignment control after the alignment control is started and at least one of before and after the mold contacts the pattern forming layer. The driving profile used to move at least one of the mold holding portion and the substrate holding portion to a target position, and includes at least one of acceleration, speed, driving voltage, and driving current.

    Abstract translation: 压印装置执行模具和基板的对准控制。 在模具上形成的图案被转印到基板上的图案形成层上。 模具保持部保持模具,基板保持部保持基板,并且控制部分进行控制,使得模具和基板在对准控制期间彼此靠近。 模具和图案形成层彼此接触,然后图案形成层固化。 在开始对准控制之后,控制部分改变对准控制的驱动轮廓,并且在模具接触图形形成层之前和之后的至少一个。 用于将模具保持部分和基板保持部分中的至少一个移动到目标位置的驱动轮廓,并且包括加速度,速度,驱动电压和驱动电流中的至少一个。

    Method and system for operating an air gauge at programmable or constant standoff
    19.
    发明申请
    Method and system for operating an air gauge at programmable or constant standoff 有权
    用于在可编程或恒定间距下操作气压计的方法和系统

    公开(公告)号:US20060123888A1

    公开(公告)日:2006-06-15

    申请号:US11011435

    申请日:2004-12-15

    Abstract: Provided are a method and system for measuring a distance to an object. The system includes an air gauge configured to sense a distance to a surface of the object and a sensor configured to measure at least one from the group including (i) a relative position of the air gauge and (ii) a relative position of the surface of the object. Outputs of the air gauge and the sensor are combined to produce a combined air gauge reading.

    Abstract translation: 提供了一种用于测量到物体的距离的方法和系统。 该系统包括配置成感测到物体的表面的距离的空气计和被配置为测量来自该组中的至少一个的传感器,该传感器包括(i)空气计的相对位置和(ii)表面的相对位置 的对象。 气压表和传感器的输出相结合,产生一个组合的气压表读数。

    Position detecting method, surface shape estimating method, and exposure apparatus and device manufacturing method using the same
    20.
    发明申请
    Position detecting method, surface shape estimating method, and exposure apparatus and device manufacturing method using the same 审中-公开
    位置检测方法,表面形状估计方法以及使用该方法的曝光装置和装置制造方法

    公开(公告)号:US20050161615A1

    公开(公告)日:2005-07-28

    申请号:US10505997

    申请日:2003-03-07

    CPC classification number: G03F1/64 G03F9/7023 G03F9/7026 G03F9/7088

    Abstract: A position detecting system including a detecting system for detecting positions, at different points on a surface of a reticle having a predetermined pattern formed thereon, with respect to a direction substantially perpendicular to the reticle surface, wherein the detecting system includes a light projecting portion for directing light from a light source to the reticle surface and a light receiving portion for receiving reflection light from the reticle surface, and wherein the angle of incidence of light from the light projecting portion, being incident on the reticle surface, is not less than 45 degrees.

    Abstract translation: 一种位置检测系统,包括:检测系统,用于在相对于基本上垂直于所述标线片表面的方向上检测在其上形成有预定图案的标线片的表面上的不同点处的位置,其中所述检测系统包括:用于 将光从光源引导到光罩表面,以及光接收部分,用于接收来自光罩表面的反射光,并且其中入射在光罩表面上的来自光投射部分的光的入射角不小于45° 度。

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