公开(公告)号：US09093281B2

公开(公告)日：2015-07-28

申请号：US14014777

申请日：2013-08-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Sampei Tomohiro

IPC: H01L23/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/50 ,  H01L33/64

CPC classification number: H01L24/04 ,  H01L23/3735 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L33/382 ,  H01L33/50 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04042 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/0335 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A luminescence device used in a backlight unit for lighting or displaying may include a substrate having a first electrode and a second electrode, and an LED chip disposed on the first electrode. A dam is disposed on the substrate. The dam is disposed spaced from the LED chip, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer and a second copper layer. The first electrode and the second electrode include respectively a metal film which fills a void of the surfaces thereof.

Abstract translation: 用于照明或显示的背光单元中的发光装置可以包括具有第一电极和第二电极的基板和设置在第一电极上的LED芯片。 坝体设置在基板上。 该坝与LED芯片间隔设置，并且该基板包括包括第一铜层和第二铜层的直接铜键合（DCB）基板。 第一电极和第二电极分别包括填充其表面的空隙的金属膜。

公开(公告)号：US20150101848A1

公开(公告)日：2015-04-16

申请号：US14491888

申请日：2014-09-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ji Sung CHO ,  Toshiko Yokota ,  Makoto Dobashi ,  Seung Min Baek ,  Ichiro Ogura ,  Eun Jung Lim ,  Yoon Su Kim ,  Sung Han

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K1/0284 ,  H05K1/0333 ,  H05K1/09 ,  H05K3/007 ,  H05K3/025 ,  H05K3/389 ,  H05K2201/0335 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0369 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/31533 ,  Y10T428/31544 ,  Y10T428/31678

Abstract: Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer.

Abstract translation: 本文公开了表面处理铜箔，包括该铜箔的覆铜层压板，使用其的印刷电路板及其制造方法。 具体地，根据本发明的一个实施方案的覆铜层压板包括：载体; 形成在载体上的剥离层; 形成在剥离层上的铜包层; 以及形成在覆铜层上的表面处理层，其中表面处理层包括硫醇基化合物。 因此，本发明提供一种印刷电路板，其能够通过在铜包覆层上形成表面处理层来改善基体和覆铜层之间的粘合力而不对粗糙表面进行处理。

公开(公告)号：US20140091345A1

公开(公告)日：2014-04-03

申请号：US14014777

申请日：2013-08-30

Applicant: Sampei TOMOHIRO

Inventor： Sampei TOMOHIRO

IPC: H01L33/50 ,  H01L33/38

CPC classification number: H01L24/04 ,  H01L23/3735 ,  H01L24/02 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L33/382 ,  H01L33/50 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/04042 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/0335 ,  H05K2201/09909 ,  H05K2201/10106 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A luminescence device used in a backlight unit for lighting or displaying may include a substrate having a first electrode and a second electrode, and an LED chip disposed on the first electrode. A dam is disposed on the substrate. The dam is disposed spaced from the LED chip, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer and a second copper layer. The first electrode and the second electrode include respectively a metal film which fills a void of the surfaces thereof.

Abstract translation: 用于照明或显示的背光单元中的发光装置可以包括具有第一电极和第二电极的基板和设置在第一电极上的LED芯片。 坝体设置在基板上。 该坝与LED芯片间隔设置，并且该基板包括包括第一铜层和第二铜层的直接铜键合（DCB）基板。 第一电极和第二电极分别包括填充其表面的空隙的金属膜。