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    Decorated-part having a fine decoration using a laser processed groove
    11.
    发明授权
    Decorated-part having a fine decoration using a laser processed groove 有权

    公开(公告)号：US11241713B2

    公开(公告)日：2022-02-08

    申请号：US15928256

    申请日：2018-03-22

    申请人： TRINITY INDUSTRIAL CORPORATION

    发明人： Yukihiro Goto ,  Tadayuki Mizobe ,  Tokinobu Shimada

    IPC分类号： B05D3/06 ,  B23K26/364 ,  B05D7/02 ,  B23K26/352 ,  B23K26/359 ,  B05D5/06 ,  B05D7/00 ,  B60R13/00 ,  B60N2/75 ,  B23K103/16

    摘要： This invention provides a method for manufacturing decorated-parts of high design-quality and reliability, since the exposed surface of the base coat-layer is not bulged, and thus the color of said coat-layer is distinct. The method for manufacturing decorated-parts of this invention comprises a base coat-layer-forming process, a surface coat-layer-forming process and a laser-decorating process. In the base coat-layer-forming process, a resin-base material of a highly light color at a lightness-level of 70 or more or a clear and colorless resin base-material is formed. In the surface coat-layer forming process, the surface coat-layer of a less-bright color at a lightness-level of 20 or less is formed on the base coat-layer. In the laser-decorating process, the first laser-processed groove penetrating the surface coat-layer and exposing partially the base coat-layer is made by irradiating the infrared laser onto such surface coat-layer, thus providing a fine decoration onto the surface of said decorated-part.

    Wafer processing method
    12.
    发明授权
    Wafer processing method 有权

    公开(公告)号：US11195757B2

    公开(公告)日：2021-12-07

    申请号：US16790891

    申请日：2020-02-14

    申请人： DISCO CORPORATION

    发明人： Kenji Furuta

    IPC分类号： H01L21/78 ,  B23K26/08 ,  H01L21/67 ,  B23K26/359 ,  H01L21/304 ,  B23K26/36

    摘要： A wafer processing method for processing a wafer with devices formed in regions on a side of a front surface of the wafer, the regions being defined by first scheduled division lines and second scheduled division lines includes a first modified layer forming step and a second modified layer forming step. In the first modified layer forming step, a laser beam is irradiated with its focal point set at a height leveled with a height of a first region located inside the wafer on the side of the front surface of the wafer, whereby first modified layers are formed. In the second modified layer forming step, the laser beam is irradiated with its focal point set at a height leveled with a height of a second region located inside the wafer on a side of a back surface of the wafer, whereby second modified layers are formed.

    GOLF CLUB HEAD
    16.
    发明申请
    GOLF CLUB HEAD 有权

    公开(公告)号：US20210205671A1

    公开(公告)日：2021-07-08

    申请号：US17203229

    申请日：2021-03-16

    申请人： SUMITOMO RUBBER INDUSTRIES, LTD.

    发明人： Scott A. CARLYLE ,  Sharon J. PARK ,  Brian D. SCHIELKE

    IPC分类号： A63B53/04 ,  A63B60/00 ,  B23K26/359 ,  B23K26/364

    摘要： A golf club head has a striking face with a plurality of scorelines including a first scoreline and a second scoreline adjacent thereto. The striking face also has a plurality of auxiliary grooves each spaced from the scorelines. In a first imaginary vertical plane, a first path is formed by a first intersection between the first imaginary vertical plane and the striking face, and the auxiliary grooves have a first concentration no less than 0.17 measured between the first and second scorelines. A second imaginary vertical plane is horizontally spaced from the first imaginary plane. A second path is formed in the second imaginary vertical plane by a second intersection between the second imaginary vertical plane and the striking face. The auxiliary grooves in the second imaginary vertical plane have a second concentration that is different from the first concentration measured between the first and second scorelines.

    LASER PROCESSING APPARATUS
    17.
    发明申请
    LASER PROCESSING APPARATUS 有权

    公开(公告)号：US20210197313A1

    公开(公告)日：2021-07-01

    申请号：US17102566

    申请日：2020-11-24

    申请人： Keyence Corporation

    发明人： Junya ONODA

    IPC分类号： B23K26/042 ,  B23K26/03 ,  B23K26/06 ,  B23K26/046 ,  B23K26/359 ,  G05B19/402

    摘要： High processing accuracy of a workpiece is maintained even if the workpiece is misaligned. A laser processing apparatus includes: a setting section that sets a pattern area and a distance measurement position on a captured image; a condition setting storage section that stores image information in the pattern area; a position correction section that detects a misalignment of a new workpiece different from a workpiece used to set the pattern area and corrects the distance measurement position on the new workpiece; a distance measurement section that measures a distance based on a light reception position of distance measuring light in a distance measuring light receiving section; and a Z scanner that adjusts a focal position based on a measurement result of the distance measurement section prior to irradiation of the workpiece with laser light.

    Method of creating a burst groove by laser scoring
    18.
    发明授权
    Method of creating a burst groove by laser scoring 有权

    公开(公告)号：US10987761B2

    公开(公告)日：2021-04-27

    申请号：US15951242

    申请日：2018-04-12

    申请人： Elfab Limited

    发明人： Brian McLeod

    IPC分类号： B23K26/364 ,  B23K26/0622 ,  F16K17/16 ,  F16K17/40 ,  B23K26/359 ,  B23K101/20

    摘要： A method of creating a burst groove in a burst member is provided. The burst groove following a path, wherein: the groove is created in a plurality of laser scoring stages which are performed in succession to thereby successively increase the depth of the burst groove during each stage; each laser scoring stage involving laser scoring the burst member along at least a portion of the path. The laser scoring in each stage involves laser-energizing a respective region of the burst member with a respective energization width measured perpendicular to the path. In at least one stage the energization width is smaller than the energization width in the immediately preceding stage.

    Laser processing machine
    19.
    发明授权
    Laser processing machine 有权

    公开(公告)号：US10898970B2

    公开(公告)日：2021-01-26

    申请号：US16621955

    申请日：2018-05-23

    申请人： AMADA HOLDINGS CO., LTD.

    发明人： Hiroaki Ishiguro ,  Ryouhei Ito ,  Tetsuya Kobayashi

    IPC分类号： B23K26/066 ,  B23K26/06 ,  B23K26/70 ,  B23K26/073 ,  B23K26/21 ,  B23K26/359 ,  B23K26/38

    摘要： A profile selector includes at least one beam-forming lens refracting a laser beam to be incident so as to convert a beam profile and emits a laser beam having a beam profile selected from a plurality of beam profiles. A collimating lens converts a laser beam of a divergent beam to be incident into collimated light. A focusing lens focuses the collimated light emitted from the collimating lens and irradiates the focused beam to a sheet metal of a processing target. A moving mechanism moves the collimating lens along an optical axis such that a deviation of a focal point is reduced caused when the beam profile of the focused beam emitted from the focusing lens is selected by the profile selector.