RECHARGEABLE BATTERY WITH RESISTIVE LAYER FOR ENHANCED SAFETY

    公开(公告)号:US20230402658A1

    公开(公告)日:2023-12-14

    申请号:US18339748

    申请日:2023-06-22

    发明人: Jiang FAN Dengguo WU

    摘要: An improved high energy density rechargeable (HEDR) battery with an anode energy layer, a cathode energy layer, a separator between the anode and cathode energy layers for preventing internal discharge thereof, and at least one current collector for transferring electrons to and from either the anode or cathode energy layer, includes a resistive layer interposed between the separator and one of the current collectors for limiting the rate of internal discharge through the failed separator in the event of separator failure. The resistive layer has a fixed resistivity at temperatures between a preferred temperature range and an upper temperature safety limit for operating the battery. The resistive layer serves to avoid temperatures in excess of the upper temperature safety limit in the event of separator failure in the battery, and a fixed resistivity of the resistive layer is greater than the internal resistivity of either energy layer.

    BATTERY INTERCONNECTS
    17.
    发明公开

    公开(公告)号:US20230369731A1

    公开(公告)日:2023-11-16

    申请号:US18352584

    申请日:2023-07-14

    摘要: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.