Abstract:
An integrated dynamic random access memory element includes two cells for the storage of two respective bits. A source region and a drain region are included. Each cell comprises a field-effect transistor having a gate and an intermediate portion which extend between the source and drain regions. A channel is provided in the intermediate portion of the transistor for each cell. A polarization electrode is placed between the respective intermediate portions of the two transistors. This polarization electrode is capacitively coupled to the intermediate portion of each transistor and is used to store the first and second bits.
Abstract:
A method of making a variable capacitor by forming a grove portion in an insulating substrate, two upper portions of the substrate located on either side of the groove portion forming two lateral edges, a conductive layer covering the inside of the groove portion, a flexible conductive membrane, placed above the groove portion by bearing on the edges, a dielectric layer covering the conductive layer or the membrane to insulate the conductive layer and the membrane, and terminals of application of a voltage between the conductive layer and the membrane, and such that the depth of the groove portion continuously increases from one of the edges to the bottom of the groove portion, and that the conductive layer covers the inside of the groove portion at least to reach one of the two edges, that it may cover.
Abstract:
The invention concerns a circuit (1) for storing a binary code (B1, B2, Bi-1, Bi, Bn-1, Bn) in an integrated circuit chip, comprising an input terminal (2) applying a signal (E) triggering reading of the code, output terminals (31, 32, 3i-1, 3i, 3n-1, 3n) for delivering said binary code, first electrical paths (P1, P2, Pi, Pn) individually connecting said input terminal to each output terminal, each path inputting a fixed delay in the manufacture of the integrated circuit, and means (4, 51, 52, 5i, 5n) simultaneously integrating the binary states present in output of the electrical paths.
Abstract:
A support wafer made of silicon wafer comprising, on a first surface a porous silicon layer having protrusions, porous silicon pillars extending from the porous silicon layer to the second surface of the wafer, in front of each protrusion. Layers constituting a fuel cell can be formed on the support wafer.
Abstract:
The content of a few pages of the dynamic random access memory is backed up, then one tries to refresh them less quickly, for example two times less quickly, and one observes whether this does or does not cause errors. The operation is repeated on the entire memory. Depending on the number of errors that have appeared on the pages refreshed less often, the refresh period is decreased or increased. Thus, the memory self-adjusts its refresh period to what is necessary for it.
Abstract:
A method and a circuit for generating a secret quantity based on an identifier of an integrated circuit, in which a first digital word is generated from a physical parameter network, and this first word is submitted to at least one retroaction shift register, the output of the shift register forming the secret quantity.
Abstract:
A device for correcting the reset noise and/or the fixed pattern noise of an active pixel comprising a photosensitive element, the device comprising a transmission circuit connecting the photosensitive element to a correction node and operating with a first or a second transmission gain; a circuit for providing a correction voltage equal to the sum of a constant voltage and of the noise multiplied by an amplification gain equal to the inverse of the difference between the first and second transmission gains; and a correction circuit capable of bringing the correction node from the constant voltage to the correction voltage, the transmission circuit having the first transmission gain, and of bringing the correction node to the constant voltage, the transmission circuit having the second transmission gain.
Abstract:
A method checks the state of a set of memory cells of a memory comprising memory cells arranged in a memory array, means for selecting a memory cell, and a sense amplifier for supplying a state of the selected memory cell depending on whether the selected memory cell is conductive or non-conductive. The method includes features wherein all the memory cells of a set grouping together several memory cells are selected, and then simultaneously coupled to the sense amplifier, and the sense amplifier supplies a global state of all the selected memory cells to which it is coupled, if the latter are simultaneously non-conductive. Application is provided to the checking of a command for block-erasing a memory.
Abstract:
An SRAM memory cell includes first and second inverters (14, 16) interconnected between first and second data nodes. Each inverter is formed from complementary MOS transistors (18, 20, 18′, 20′) connected in series between a DC voltage supply source and a grounding circuit (22). A circuit (28, 30) programs the MOS transistors by causing an irreversible degradation of a gate oxide layer of at least some of the transistors (18, 18′).
Abstract:
The invention concerns an identification method and circuit (1) of the network type of parameters contained in an integrated circuit chip, comprising a single input terminal (2) for applying a signal (E) triggering an identification, the output terminals (31, 32, 3i−1, 3i, 3n−1, 3n) adapted to deliver a binary identifying code (B1, B2, Bi−1, Bi, Bn−1, Bn), first electrical paths P1, P2, Pi, Pn), individually connecting said input terminal to each output terminal, and means (4, 51, 52, 5i, 5n) for simultaneously integrating the binary states present in output of the electrical paths, each path inputting a delay sensitive to technological dispersions and/or of the integrated circuit fabrication method.